0402 vs 0603 Capacitor for High-Speed PCB Decoupling
A common misconception is that a larger capacitor package stores more energy and therefore provides better filtering performance. However, in high-speed PCB designs such as FPGA, SoC, and DDR applicat...
Why ICs Fail After Passing ESD Tests and How ESD Differs from EOS
Previous articles have covered key technologies related to chip ESD, including ESD diodes, power clamps, CDM mechanisms, and ESD testing procedures, with a focus on chip-level electrostatic discharge ...
PCB Layout Guide to Interface Driver and Connector Placement
People who design PCBs for embedded, industrial control, and communication hardware have probably heard a common PCB layout rule: interface drivers should be placed as close as possible to board-edge ...
High-Speed ADC PCB Layout Guide: EPAD, PDS, and Grounding Best Practices
High-speed analog-to-digital converter (ADC) PCB layout involves multiple design parameters, and their importance varies depending on the application. For high-speed ADC systems, the focus should not ...
How to Properly Handle Unused IC Pins in Schematic Design
When working on schematic design, engineers often encounter situations like this: to meet the core functional requirements, a 100-pin MCU is selected, but only 60 pins are actually used. Or a 4-channe...
USB Type-C Design and CC Pin Configuration: A Practical Hardware Design Guide
One of the most common pitfalls in Hardware Design for Type-C interfaces is confusing the legacy protocols used by USB-A ports with the native USB Type-C protocol. Some designers mistakenly treat D+ /...
Remote-Sense Guidelines in Power Supply Design for DC-DC Converters
Many DC-DC power chips provide a Remote-Sense function. However, many designers mistake it for an optional secondary connection and wire it directly near the power module's local output. This setup ef...
HDI PCB Layout Guide for High Speed Optical Module PCB Design
An optical module PCB is a typical high-frequency, high-density HDI PCB precision board. Its material selection is closely related to transmission rate, link length, loss budget, and device platforms....
PCB Routing Angle Rules and the 90 Degree Trace Myth
In the realm of hardware design, "never use 90° angle traces" is one of the most widely circulated rules. Most engineers habitually modify 90° corners into 45° bends, or even intentionally increase tr...
PCB Impedance Control Guide: How to Fix Impedance Discontinuities in PCB Layout
In modern pcb design, maintaining signal integrity relies on a stable transmission path. Proper impedance control prevents signal reflection and ensures stable performance across your board. This arti...
LDO Output Capacitor Selection: Why Bigger Isn't Always Better in Power Supply Design
In power supply design, there is a common engineering misconception regarding the selection of the LDO output capacitor: when faced with issues like high output ripple or poor load transient response,...
PCB Routing Layer Selection for High-Speed Signals: Microstrip vs. Stripline
In the hardware layout for high-speed interfaces such as PCIe, DDR5, USB 3.0, and SerDes, selecting the trace layer—specifically choosing between surface microstrip and inner stripline—is a core decis...
Copper Keep-out Guidelines for PCB Layout and Component Layout
In modern pcb layout, solid copper pouring is widely used as an optimization technique. However, it is not universally applicable to all components. For devices whose magnetic fields easily couple wit...
Power Supply Capacitor Layout: Placement Rules for Bulk and Small Capacitors
Engineers often encounter hard-to-spot issues when debugging switch-mode power supplies, DC-DC converters, and LDO circuits. These issues typically stem from placing electrolytic or tantalum bulk capa...
Ground Stitching Vias in High-Speed PCB Differential Via Design
In high speed PCB debugging, engineers frequently encounter high-speed link communications failure, severe eye diagram jitter, TDR impedance anomalies near via regions, and EMI radiation exceeding lim...
High Speed PCB Design Guidelines for Impedance and SI
High-performance board layout is not merely about transmitting signals faster—it is about ensuring they remain stable, continuous, and predictable throughout the entire channel. As edge rates push int...
9 Essential PCB Copper Pour Techniques: A Complete Guide for PCB Layout Design
Copper pouring is a critical technique in PCB layout design that directly impacts signal integrity, thermal management, and manufacturing reliability. Whether you’re working on a high-speed digital bo...
Industrial-Grade RS-485 Communication Interface Design and PCB Layout
1. Introduction: An Irreplaceable Foundation of Industrial Bus CommunicationIn industrial automation, medical equipment, and smart grid applications, the stability of communication interfaces directly...
Switching Power Supply PCB Layout Guide: AC-DC, DC-DC & Digital Power Design Best Practices
Power supply PCB layout is one of the most critical aspects of switching converter design. A poorly executed PCB layout can turn a theoretically perfect power stage into an EMI nightmare, a thermal fa...
How to Design an H-Bridge Motor Driver: Circuit & PCB Layout Guide
1. Overview of H-Bridge Drive CircuitsAn H-bridge drive circuit is one of the most widely used basic topologies in DC motor drive systems. Its core structure consists of four independently controlled ...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 5 |
| 2 | Kieu Vu | 1 |
| 3 | SAAD ZAFAR | 1 |