Several factors for the increased temperature of printed circuit board and its solutions

The direct factor for the temperature rise of PCB is the existence of power consumption parts and the heat generation intensity varies with the power consumption.There are two phenomena of temperature rise.1.Sectional temperature rise or full -area temperature rise;2. Short-term temperature rise or long-term temperature rise.For the detailed reasons, they are generally analyzed from the following aspects.1.Electrical power consumption(1) Analysis of power consumption per unit area;(2) Analyze th...

heat dissipation components thermal conductivity cooling system heat sink PCB

Solution for Negative Film Deformation of PCB Technology

The reasons for the deformation of the negative film and its solution: The reason:(1) Temperature and humidity control failure(2) The exposure machine temperature rises too highSolution:(1) Normally, the temperature is controlled at 22 ± 2 ° C and the humidity is at 55% ± 5% RH.(2) Using a cold light source or an aerator with a cooling device and constantly replacing the backup film The process of negative film deformation correction: 1. Change the Hole Position MethodIn the case of mastering...

Deformation. PCB Negative Film

How to prevent the PCB from being bended and warped when get through the reflow furnace

Everyone knows that PCBs are easy to be bended or warped when get through the reflow furnace. So how to avoid this situation, here are some advices for you.1. Reduce the effect of temperature on PCB board stress Since the "temperature" is the main source of stress in the board, as long as the temperature of the reflow furnace is lowered or slow the speed of warming up and cooling down in the reflow furnace, the board bending and the board warping can be greatly reduced. However, there ...

PCB reflow furnace

Thermoelectric Separation Technology of Copper Core PCB

What is the Thermoelectric Separation Substrate?The circuit part and the thermal layer part of the substrate are on different circuit layers, and the thermal layer part directly contacts the heat dissipation part of the lamp bead to achieve the best heat dissipation (zero thermal resistance) effect. And the material of the substrate is generally the copper substrate. Advantages:1. Selecting the copper substrate: the density is high, the substrate itself has strong heat ...

4 Main Types of Plating Methods in PCB production

There are four main types of plating methods in PCB (Printed Circuit Board) production: finger-plated plating, through-hole plating, reel linkage selective plating and brushing plating. Here's a brief introduction: 1. Finger-plated platingRare metals need to be plated on the board edge connectors, board edge joint or gold fingers to provide lower contact resistance and higher abrasive resistance. This technique is known as finger-plated or protruding partial plating. Gold is often plated on ...

Research on the Key Technology of PCB

Introduction:PCB is an important carrier of electronic components and an important circuit connecting component and has developed for a long time. According to the number of printed circuit board, PCB can be divided into single-side PCB, double-side PCB, multi-layer PCB. Until today, PCB has reached a fairly fine degree. Many improvements and optimization of PCB technologies have been born.High-Density Interconnection PCB:In the early 1990s, Japan and the United States pioneered the application ...

Key Points in Manufacturing Mechanical Blind-Via

Introduction:Mechanical blind through-hole PCB means that both the blind holes and the through-hole of the plate are formed by the process of mechanical drilling. For example, the figure below is the schematic diagram of a kind of mechanical blind through-hole PCB.Key Points of Manufacturing Process:The common manufacturing process:Transfer of inner layer patterns → Oxidation → Lamination → Drilling → PTH → Transfer of inner layer patterns → Oxidation → Lamination → Drilling → PTH → Transfer of ...

BGA Soldering Quality Detection Techniques by X-Ray Imaging

Introduction:BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in the form of spherical solder joints, which can make the device smaller, more pins, larger pin spacing, higher assembly rate of finished products and better electrical performance. Thus, the application of this kind of packaging method is more and more popular with the market.Currently, BGA soldering quality detection methods are very limited. Common det...

BGA

Analysis of the Methods of PCB Interconnection

Introduction:Electronic components and electromechanical components have electrical contacts, and the electrical connection between two discrete contacts becomes an interconnection. The electronic devices must be interconnected according to the circuit schematic diagram in order to achieve the predetermined function.As a part of the whole machine, a PCB generally cannot constitute an electronic product, and there must be the problem of external connection. For example, electrical connections are...

Halogen-Free Flexible Printed Board Material

Introduction:In recent years, due to the miniaturization and thinness of portable electronic products, the mounting space inside the machine and the mounting area of the substrate are becoming smaller and smaller, and the demand for flexible circuit boards is becoming more and more urgent. The application of flexible circuit board in electronic products mainly includes the following aspects. The first is the LCD, plasma display and other planar display driver chip installation applications. Seco...

Suitable Temperature Curve of Lead-free Solder

Introduction:Alloy, , is the best solder in the reflowing process. Compared with the traditional solder, it has two disadvantages in terms of manufacturability as following:1) The melting point is high. It has a melting point of about 217 degrees Celsius and a complete melting temperature of 235 degrees Celsius. Therefore, we must raise the manufacturing temperature in the manufacturing process, otherwise it will cause a series of adverse consequences.2) Wettability is slightly worse. Th...

New Flexible Substrate Manufacturing Technology ---Electrodeposition Polyimide Process

Introduction:As the wiring density of flexible substrate becomes higher and higher, the circuit made by subtractive process can no longer meet the requirements of circuit elaboration. Therefore, the industry gradually turns to the semi-additive manufacturing process. At the same time, some thin flexible substrates and embedded flexible substrates manufacturing technology is also gradually applied in the production of mass production.Electrodeposition Polyimide Process:The protective layer of fle...

Electrodeposition Polyimide Process

Acid Electroplating Copper Technology

Application of Acid Copper Plating in PCB Manufacturing:After a series of processes, the printed circuit board needs to be metallized and deposited on the hole wall surface of the through hole in order to achieve the purpose of interconnection and intercommunication between the board and the board and to achieve strong conductivity. Taking into consideration, copper metal is regarded as the most extensive deposition material in the industry. At present, the process of hole metallization generall...

Brief Introduction of PCB Cleaning Technologies

Abstract:The cleaning effect after PCB installation soldering is directly related to the electrical performance, working life and reliability of the product. Cleaning is also a key process in PCB production.The Necessity of Cleaning Process:Different types of flux are required for PCB assembly. Flux is usually composed of active agent, film agent, additive and solvent. Active agents are composed of organic acids or halogens, and additives are often composed of substances such as acidity regulato...

Introduction of MVI & ICT & X-Ray Inspection

MVI (Manual visual inspection):Manual visual inspection, shortly as MVI, is a method to detect defects in digital circuits by naked eye, magnifier and microscope in SMT production. In the manual visual inspection, you can also make a comprehensive judgment with the help of metal needles or bamboo toothpicks, and with appropriate force and speed across the QFP pins. In addition, MVI has a good effect in checking whether the IC pin has pseudo soldering or bridge connection. MVI with the aid of mag...

MVI (Manual visual inspection) ICT (In-Circuit Test) AXI (Automated X-Ray Inspection)

How to generate Gerber files from Eagle

Generally it doesn't work to use the Eagle files for PCB manufacturing , so the situation will be better if you can send the Gerber files directly to a PCB fab. In this tutorial, we are going to show you how to export Gerber files from your eagle .brd file, then you can upload it to PCBWay online system for fabrication.*Here is a page where you can easily convert your Eagle.brd file to Gerber files automatically within seconds. Feel free to try it before taking time to use the following tuto...

Design Gerber PCB Eagle

Signal Integrity Analysis for High-speed PCB

Signal Integrity Analysis for High-speed PCBIntroduction:As large-scale and ultra-large-scale integrated circuits are more and more applied to power circuit systems, the requirements of users are higher and higher. As a result, the integration scale of chips is larger and smaller, the number of pins is larger and higher, and the frequency is higher and higher. However, the rapid development of the circuit brings about such a problem: the chip size is getting smaller, and the pins are generally i...

Influence of PCB Quality Problem on Wave Soldering and Reflow Soldering

Background:After the production of PCB, the original components need to be assembled to be used further. At present, the most common assembly methods are wave soldering, reflow soldering and the combination of the two technologies. The quality of PCB has great influence on the assembly quality of the three processes.Wave Soldering:Technological introduction: Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of mol...

Wave Soldering, Reflow Soldering

Defects Contrast between Wave Soldering and Reflow Soldering

Introduction:As a kind of traditional welding technology, wave soldering and reflow soldering play an active role in the field of electronic manufacturing in the assembling process of electronic products. The quality of welding is related to product performance, reliability, service life, etc., and will affect each subsequent process flow. By analyzing and comparing the defects in the process of wave soldering and reflow welding from the quality control before welding, production process materia...

Wave Soldering, Reflow Soldering

Ball Grid Array (BGA)

Background:In the information age, the update speed of electronic products is accelerated. In one hand, the popularity of computers, mobile devices, portable devices and other products has made people's demands on electronic products higher and higher, which means that the performance of products must be improved in order to meet people’s requirements. The feature size of IC chip should be smaller and smaller, and the complexity should be increased. That is to say, the number of I/O in the c...

Ball Grid Array (BGA)

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