The four Stages of Design

The Four Stages of DesignIng. Mark Donners  ‘Since new developments are the product of a creative mind, we must therefore stimulate and encourage that type of mind in every way possible’ Geo...

Design considerations for a vco audio project

General descriptionDuring the past month I’ve been slowly gathering information and designing a VCO’s architecture based on the specifications stated on my last post. Here’s a reminder:InputsCV 1V/oct...

Three Types of Switching Power Supply Snubber Circuit

1. What is a switching power supply snubber circuit?Snubber circuit is also called absorption circuit, which is an important protection circuit for power electronic devices. It is composed of inductor...

Switching Power Supply Snubber Circuit RCD LCD energy regenerative snubber circuit

Impedance Matching in HDI PCB Design

Impedance matchingImpedance matching means that when source is transmitted, the load impedance must be equal to the characteristic impedance of the transmission line. At this situation, the transmissi...

HDI Impedance Matching PCB design Series termination matching Parallel terminal matching

Several factors for the increased temperature of printed circuit board and its solutions

The direct factor for the temperature rise of PCB is the existence of power consumption parts and the heat generation intensity varies with the power consumption.There are two phenomena of t...

PCB heat sink cooling system thermal conductivity components heat dissipation

Solution for Negative Film Deformation of PCB Technology

The reasons for the deformation of the negative film and its solution: The reason:(1) Temperature and humidity control failure(2) The exposure machine temperature rises too highSolution:(1) Norma...

Negative Film Deformation. PCB

How to prevent the PCB from being bended and warped when get through the reflow furnace

Everyone knows that PCBs are easy to be bended or warped when get through the reflow furnace. So how to avoid this situation, here are some advices for you.1. Reduce the effect of temperature on PCB b...

reflow furnace PCB

Thermoelectric Separation Technology of Copper Core PCB

What is the Thermoelectric Separation Substrate?The circuit part and the thermal layer part of the substrate are on different circuit layers, and the thermal layer part directly contacts the heat diss...

Thermoelectric Separation Technology,Copper Core PCB

4 Main Types of Plating Methods in PCB production

There are four main types of plating methods in PCB (Printed Circuit Board) production: finger-plated plating, through-hole plating, reel linkage selective plating and brushing plating. Here'...

Research on the Key Technology of PCB

Introduction:PCB is an important carrier of electronic components and an important circuit connecting component and has developed for a long time. According to the number of printed circuit board, PCB...

Key Points in Manufacturing Mechanical Blind-Via

Introduction:Mechanical blind through-hole PCB means that both the blind holes and the through-hole of the plate are formed by the process of mechanical drilling. For example, the figure below is the ...

BGA Soldering Quality Detection Techniques by X-Ray Imaging

Introduction:BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in the form of spherical solder joints, which can make the...

BGA

Analysis of the Methods of PCB Interconnection

Introduction:Electronic components and electromechanical components have electrical contacts, and the electrical connection between two discrete contacts becomes an interconnection. The electronic dev...

Halogen-Free Flexible Printed Board Material

Introduction:In recent years, due to the miniaturization and thinness of portable electronic products, the mounting space inside the machine and the mounting area of the substrate are becoming smaller...

Suitable Temperature Curve of Lead-free Solder

Introduction:Alloy, , is the best solder in the reflowing process. Compared with the traditional solder, it has two disadvantages in terms of manufacturability as following:1)     ...

New Flexible Substrate Manufacturing Technology ---Electrodeposition Polyimide Process

Introduction:As the wiring density of flexible substrate becomes higher and higher, the circuit made by subtractive process can no longer meet the requirements of circuit elaboration. Therefore, the i...

Electrodeposition Polyimide Process

Acid Electroplating Copper Technology

Application of Acid Copper Plating in PCB Manufacturing:After a series of processes, the printed circuit board needs to be metallized and deposited on the hole wall surface of the through hole in orde...

Brief Introduction of PCB Cleaning Technologies

Abstract:The cleaning effect after PCB installation soldering is directly related to the electrical performance, working life and reliability of the product. Cleaning is also a key process in PCB prod...

Introduction of MVI & ICT & X-Ray Inspection

MVI (Manual visual inspection):Manual visual inspection, shortly as MVI, is a method to detect defects in digital circuits by naked eye, magnifier and microscope in SMT production. In the manual visua...

MVI (Manual visual inspection) ICT (In-Circuit Test) AXI (Automated X-Ray Inspection)

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