Acid Electroplating Copper Technology

Application of Acid Copper Plating in PCB Manufacturing:After a series of processes, the printed circuit board needs to be metallized and deposited on the hole wall surface of the through hole in order to achieve the purpose of interconnection and intercommunication between the board and the board and to achieve strong conductivity. Taking into consideration, copper metal is regarded as the most extensive deposition material in the industry. At present, the process of hole metallization generall...

Brief Introduction of PCB Cleaning Technologies

Abstract:The cleaning effect after PCB installation soldering is directly related to the electrical performance, working life and reliability of the product. Cleaning is also a key process in PCB production.The Necessity of Cleaning Process:Different types of flux are required for PCB assembly. Flux is usually composed of active agent, film agent, additive and solvent. Active agents are composed of organic acids or halogens, and additives are often composed of substances such as acidity regulato...

Introduction of MVI & ICT & X-Ray Inspection

MVI (Manual visual inspection):Manual visual inspection, shortly as MVI, is a method to detect defects in digital circuits by naked eye, magnifier and microscope in SMT production. In the manual visual inspection, you can also make a comprehensive judgment with the help of metal needles or bamboo toothpicks, and with appropriate force and speed across the QFP pins. In addition, MVI has a good effect in checking whether the IC pin has pseudo soldering or bridge connection. MVI with the aid of mag...

AXI (Automated X-Ray Inspection) ICT (In-Circuit Test) MVI (Manual visual inspection)

Signal Integrity Analysis for High-speed PCB

Signal Integrity Analysis for High-speed PCBIntroduction:As large-scale and ultra-large-scale integrated circuits are more and more applied to power circuit systems, the requirements of users are higher and higher. As a result, the integration scale of chips is larger and smaller, the number of pins is larger and higher, and the frequency is higher and higher. However, the rapid development of the circuit brings about such a problem: the chip size is getting smaller, and the pins are generally i...

Influence of PCB Quality Problem on Wave Soldering and Reflow Soldering

Background:After the production of PCB, the original components need to be assembled to be used further. At present, the most common assembly methods are wave soldering, reflow soldering and the combination of the two technologies. The quality of PCB has great influence on the assembly quality of the three processes.Wave Soldering:Technological introduction: Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of mol...

Wave Soldering, Reflow Soldering

Defects Contrast between Wave Soldering and Reflow Soldering

Introduction:As a kind of traditional welding technology, wave soldering and reflow soldering play an active role in the field of electronic manufacturing in the assembling process of electronic products. The quality of welding is related to product performance, reliability, service life, etc., and will affect each subsequent process flow. By analyzing and comparing the defects in the process of wave soldering and reflow welding from the quality control before welding, production process materia...

Wave Soldering, Reflow Soldering

Ball Grid Array (BGA)

Background:In the information age, the update speed of electronic products is accelerated. In one hand, the popularity of computers, mobile devices, portable devices and other products has made people's demands on electronic products higher and higher, which means that the performance of products must be improved in order to meet people’s requirements. The feature size of IC chip should be smaller and smaller, and the complexity should be increased. That is to say, the number of I/O in the c...

Ball Grid Array (BGA)

The Application of AOI System in PCB

—created by PCBWayIntroduction: With the rapid development of IC industry and the improvement of special components as well as multifunction of electronic components, the number of pins in unit area are substantially increasing, which accelerated the transfer of QFP & TCP to BGA & CSP and promoted the obvious change of PCB technology. PCB products are also developing towards ultra-thin, small components, high density and fine spacing. As the density of components on the PCB increases, PC...

AOI PCB

The PCB manufacturing process

We have so many tech articles about how to design pcb. However you may still curious how to manufacture boards in our factory as a designer. I know you can check the production status in your PCBWay account, it shows the mainly production process, here I will show you more details and you can download the file.For Double sided PCB manufacturing processFor Multilayer PCB manufacturing processStep 1. IQC(Input Quality Control): IQC is mainly to control the raw materials, including the quality insp...

pcb manufacturing process

General introduction of Aluminum PCB

Among all Metal core PCBs,Aluminum PCBs is the most common type - the base material consists of aluminum core with standard FR4. It features a thermal clad layer that dissipates heat in a highly efficient manner, while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCBs is regarded as the solution to high power and tight tolerance applications. Advantages of Aluminum PCB 1.Environmentally Friendly: Aluminum is non-toxic and recyclable. Manuf...

Aluminum PCB

Impedance Control of PCB

As circuit design becomes increasingly complex and high-speed, how to ensure the integrity of various signals (especially high-speed signals), that is, to ensure signal quality, has becomes a problem.At this point, will take advantage of transmission line theory to analyze. Control signal characteristic impedance matching becomes the key point. Non-strict impedance control will cause considerable signal reflections and signal distortions, leading to design failures. Common signals such as PCI bu...

PCB Impedance Control

What is Automated optical inspection(AOI)

Automated optical inspection (AOI) is an automated visual inspection of printed circuit board manufacture where a camera autonomously scans the device under test for both catastrophic failure (such as missing component) and quality defects.It is commonly used in the manufacturing process because it is a non-contact test method. This guarantees the high reliability of Multi-CB multilayer circuit boards.It is especially important for the following application areas:l Line width violationsl Spaci...

AOI Automated optical inspection

What is HDI PCB

High density interconnect (HDI) PCB, represent one of the fastest growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design is able to incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter. By using HDI technology, designers now have the ability to place more components on both sides of the raw PCB if desired....

HDI PCB

PCB material classification

What is PCB?A printed circuit board (PCB)mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. Components are generally soldered on the PCB.-Printed circuit boards are used in all but the simplest electronic products. They are also used in some electrical products, such as passive switch boxes. The base pcb material (CCL-Copper Clad Laminate) is a composite materi...

PCB material

The difference between immersion gold and gold plating

Gold plating: Gold plating is a method of depositing a thin layer of gold onto the surface of another metal through plating way. The gold particles attached to the pcb, as strong adhesion also known as hard gold. The gold finger of memory bank is hard gold and abrasion resistant. Immersion gold: Immersion gold through chemical reaction to make gold particles attached to pcb. As weak adhesion it is also known as soft gold.Why use gold plating?As IC become more and more integrated and IC pins are ...

immersion gold,gold plating

What is ball grid array (BGA)

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package, each pin is provided with a solder ball. All connections are distributed in a uniform surface grid or matrix on the component. The whole bottom surface of the device can be used instead of just the perimeter. The leads are also on average...

ball grid array,BGA

General introduction of SMD Adhesive

SMD Adhesive is also called Surface Mount Adhesive.Before soldering, components with pin contacts or SMDs are often bonded to the PCB with adhesive. This allows, for example, several capacitors, electrolytic capacitors and coils to be positioned on a circuit board and cured within just a few seconds to prevent their falling over or sliding out of position on the PCB. The secured components can then be reflow-soldered in a single work step, which saves time and speeds up production. The SMD adhes...

Surface Mount Adhesive SMD Adhesive

What is Electronic test/probe test

Combine Automatic optical alignment system and the traditional flying needle machine together,with the help of image-processing software and flying-pin-only cameras, flying probe test is easier and more accurate.The electronic test for circuit boards is performed after manufactured. All the pcb manufactured by PCBWay must be checked with flying probe test. The layout is analysed according to the pcb file for short circuits and interruptions. This is important because only the E-test detects inco...

probe test Electronic test

Comparison of several PCB surface finish types

PCB surface finish is a coating between a component and a bare board PCB. It is applied for two basic reasons: to ensure solderability, and to protect exposed copper circuitry. As there are many types of surface finishes,selecting the right one is no easy task, especially as surface mounts have become more complex and regulations such as RoHS and WEEE have changed industry standards.HASL(Hot Air Solder Leveling) / Lead Free HASLHASL is the predominant surface finish used in the industry. The pro...

ENIG Lead Free HASL HSAL OSP PCB surface finish

Flexible PCB vs Rigid PCB

Flexible PCB (also variously referred to around the globe as flex circuits, flexible printed circuit boards, flex print, flexi-circuits) are members of electronic and interconnection family. They consist of a thin insulating polymer film having conductive circuit patterns affixed thereto and typically supplied with a thin polymer coating to protect the conductor circuits. The technology has been used for interconnecting electronic devices since the 1950s in one form or another. It is now one of ...

Rigid PCB Flexible PCB

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