Impedance matchingImpedance matching means that when source is transmitted, the load impedance must be equal to the characteristic impedance of the transmission line. At this situation, the transmission will not reflect, which indicates that all source is absorbed by the load. Conversely, there is source loss during transmission. In HDI PCB design, impedance matching is related to the quality of the signal.When do PCB traces need impedance matching?It does not mainly decided by the frequency, bu...
PCBWay
Dec 19,2019
1038 views
The direct factor for the temperature rise of PCB is the existence of power consumption parts and the heat generation intensity varies with the power consumption.There are two phenomena of temperature rise.1.Sectional temperature rise or full -area temperature rise;2. Short-term temperature rise or long-term temperature rise.For the detailed reasons, they are generally analyzed from the following aspects.1.Electrical power consumption(1) Analysis of power consumption per unit area;(2) Analyze th...
PCBWay
Sep 05,2019
3560 views
The reasons for the deformation of the negative film and its solution: The reason:(1) Temperature and humidity control failure(2) The exposure machine temperature rises too highSolution:(1) Normally, the temperature is controlled at 22 ± 2 ° C and the humidity is at 55% ± 5% RH.(2) Using a cold light source or an aerator with a cooling device and constantly replacing the backup film The process of negative film deformation correction: 1. Change the Hole Position MethodIn the case of mastering...
lesley
Jul 25,2019
1867 views
Everyone knows that PCBs are easy to be bended or warped when get through the reflow furnace. So how to avoid this situation, here are some advices for you.1. Reduce the effect of temperature on PCB board stress Since the "temperature" is the main source of stress in the board, as long as the temperature of the reflow furnace is lowered or slow the speed of warming up and cooling down in the reflow furnace, the board bending and the board warping can be greatly reduced. However, there ...
lesley
Jul 08,2019
1992 views
What is the Thermoelectric Separation Substrate?The circuit part and the thermal layer part of the substrate are on different circuit layers, and the thermal layer part directly contacts the heat dissipation part of the lamp bead to achieve the best heat dissipation (zero thermal resistance) effect. And the material of the substrate is generally the copper substrate. Advantages:1. Selecting the copper substrate: the density is high, the substrate itself has strong heat ...
lesley
Jun 28,2019
2206 views
There are four main types of plating methods in PCB (Printed Circuit Board) production: finger-plated plating, through-hole plating, reel linkage selective plating and brushing plating. Here's a brief introduction: 1. Finger-plated platingRare metals need to be plated on the board edge connectors, board edge joint or gold fingers to provide lower contact resistance and higher abrasive resistance. This technique is known as finger-plated or protruding partial plating. Gold is often plated on ...
lesley
Jun 20,2019
2595 views
Introduction:PCB is an important carrier of electronic components and an important circuit connecting component and has developed for a long time. According to the number of printed circuit board, PCB can be divided into single-side PCB, double-side PCB, multi-layer PCB. Until today, PCB has reached a fairly fine degree. Many improvements and optimization of PCB technologies have been born.High-Density Interconnection PCB:In the early 1990s, Japan and the United States pioneered the application ...
PCBWay
Jan 25,2019
2336 views
Introduction:Mechanical blind through-hole PCB means that both the blind holes and the through-hole of the plate are formed by the process of mechanical drilling. For example, the figure below is the schematic diagram of a kind of mechanical blind through-hole PCB.Key Points of Manufacturing Process:The common manufacturing process:Transfer of inner layer patterns → Oxidation → Lamination → Drilling → PTH → Transfer of inner layer patterns → Oxidation → Lamination → Drilling → PTH → Transfer of ...
PCBWay
Jan 23,2019
2394 views
Introduction:BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in the form of spherical solder joints, which can make the device smaller, more pins, larger pin spacing, higher assembly rate of finished products and better electrical performance. Thus, the application of this kind of packaging method is more and more popular with the market.Currently, BGA soldering quality detection methods are very limited. Common det...
PCBWay
Jan 22,2019
2708 views
Introduction:Electronic components and electromechanical components have electrical contacts, and the electrical connection between two discrete contacts becomes an interconnection. The electronic devices must be interconnected according to the circuit schematic diagram in order to achieve the predetermined function.As a part of the whole machine, a PCB generally cannot constitute an electronic product, and there must be the problem of external connection. For example, electrical connections are...
PCBWay
Jan 18,2019
3316 views
Introduction:In recent years, due to the miniaturization and thinness of portable electronic products, the mounting space inside the machine and the mounting area of the substrate are becoming smaller and smaller, and the demand for flexible circuit boards is becoming more and more urgent. The application of flexible circuit board in electronic products mainly includes the following aspects. The first is the LCD, plasma display and other planar display driver chip installation applications. Seco...
PCBWay
Jan 14,2019
1013 views
Introduction:Alloy, , is the best solder in the reflowing process. Compared with the traditional solder, it has two disadvantages in terms of manufacturability as following:1) The melting point is high. It has a melting point of about 217 degrees Celsius and a complete melting temperature of 235 degrees Celsius. Therefore, we must raise the manufacturing temperature in the manufacturing process, otherwise it will cause a series of adverse consequences.2) Wettability is slightly worse. Th...
PCBWay
Jan 03,2019
1850 views
Introduction:As the wiring density of flexible substrate becomes higher and higher, the circuit made by subtractive process can no longer meet the requirements of circuit elaboration. Therefore, the industry gradually turns to the semi-additive manufacturing process. At the same time, some thin flexible substrates and embedded flexible substrates manufacturing technology is also gradually applied in the production of mass production.Electrodeposition Polyimide Process:The protective layer of fle...
PCBWay
Dec 17,2018
2147 views
Application of Acid Copper Plating in PCB Manufacturing:After a series of processes, the printed circuit board needs to be metallized and deposited on the hole wall surface of the through hole in order to achieve the purpose of interconnection and intercommunication between the board and the board and to achieve strong conductivity. Taking into consideration, copper metal is regarded as the most extensive deposition material in the industry. At present, the process of hole metallization generall...
PCBWay
Dec 11,2018
1389 views
Abstract:The cleaning effect after PCB installation soldering is directly related to the electrical performance, working life and reliability of the product. Cleaning is also a key process in PCB production.The Necessity of Cleaning Process:Different types of flux are required for PCB assembly. Flux is usually composed of active agent, film agent, additive and solvent. Active agents are composed of organic acids or halogens, and additives are often composed of substances such as acidity regulato...
PCBWay
Nov 23,2018
1679 views
MVI (Manual visual inspection):Manual visual inspection, shortly as MVI, is a method to detect defects in digital circuits by naked eye, magnifier and microscope in SMT production. In the manual visual inspection, you can also make a comprehensive judgment with the help of metal needles or bamboo toothpicks, and with appropriate force and speed across the QFP pins. In addition, MVI has a good effect in checking whether the IC pin has pseudo soldering or bridge connection. MVI with the aid of mag...
PCBWay
Nov 20,2018
1166 views
Generally it doesn't work to use the Eagle files for PCB manufacturing , so the situation will be better if you can send the Gerber files directly to a PCB fab. In this tutorial, we are going to show you how to export Gerber files from your eagle .brd file, then you can upload it to PCBWay online system for fabrication.*Here is a page where you can easily convert your Eagle.brd file to Gerber files automatically within seconds. Feel free to try it before taking time to use the following tuto...
PCBWay
Apr 25,2017
21795 views
Signal Integrity Analysis for High-speed PCBIntroduction:As large-scale and ultra-large-scale integrated circuits are more and more applied to power circuit systems, the requirements of users are higher and higher. As a result, the integration scale of chips is larger and smaller, the number of pins is larger and higher, and the frequency is higher and higher. However, the rapid development of the circuit brings about such a problem: the chip size is getting smaller, and the pins are generally i...
View MoreBackground:After the production of PCB, the original components need to be assembled to be used further. At present, the most common assembly methods are wave soldering, reflow soldering and the combination of the two technologies. The quality of PCB has great influence on the assembly quality of the three processes.Wave Soldering:Technological introduction: Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of mol...
PCBWay
Nov 01,2018
1911 views
Introduction:As a kind of traditional welding technology, wave soldering and reflow soldering play an active role in the field of electronic manufacturing in the assembling process of electronic products. The quality of welding is related to product performance, reliability, service life, etc., and will affect each subsequent process flow. By analyzing and comparing the defects in the process of wave soldering and reflow welding from the quality control before welding, production process materia...
PCBWay
Oct 11,2018
2874 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Support | 4 |
| 2 | Aleksey Andreevich Fadeev | 2 |
