FR408HR High Performance Laminate and Prepreg PCB Materials

FR408HRHigh Performance Laminate and Prepregfr408hr.pdfProduct SummaryFR408HR is a proprietary high-performance 230°C (DMA) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% impr...

Internationally known isola base materials Rigid material PCB Base materials FR408HR

S7038 Shengyi HSD Materials Mid-loss PCB Material

S7038HSD Materials,Mid-loss MaterialCharacteristic● Tg>190℃ (DSC)● Dk/Df@1GHz: 3.62/0.0085● low Z-axis CTE, with good processibilityApplication AreaPC server, line card, HSD application...Product PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃190TgIPC-TM-650 2.4.24.4DMA℃200TdIPC-TM-650 2.4.24.65% wt. loss℃345CTE(Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃50After Tgppm/℃23050-260℃%2.5T260IPC-TM-650 2.4.24.1TMAmin>60T288IPC-TM-650 2.4.24.1TMAmin27Thermal StressIPC-TM-650 2.4....

Internationally known Shengyi base materials Rigid material PCB Base materials S7038

TU-768 High Speed Digital (HSD) PCB Materials

High Speed Digital (HSD)TU-768High-Tg and High Thermal Reliability Laminate and PrepregCore: TU-768; Prepreg: TU-768PTU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhi...

Internationally known High Speed Digital base materials Rigid material PCB Base materials TU-768

TU-662 Radio Frequency (RF) Mid-Tg and High Thermal Reliability Laminate and Prepreg PCB Material

TU-662Mid-Tg and High Thermal Reliability Laminate and PrepregCore: TU-662; Prepreg: TU-66PTU-662/ TU-66P laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 laminates exhibit excellent CTE, superior chemic...

Internationally known base materials Rigid material PCB Base materials TU-662

TU-862 HF TU-862S TU-862T Automotive High Tg Halogen Free Material

AutomotiveTU-862 HFHigh Tg Halogen Free MaterialCore: TU-862 HF; Prepreg: TU-86P HFTU-862 HF/TU-86P HF High Tg halogen free materials are made of epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862 HF/TU-86P HF achieves flammability class of UL94V-0 by incorporating phosphorous and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-86P HF is designed for...

Internationally known Halogen Free Rigid material PCB Base materials High Tg

S1151G Shengyi Conventional FR-4 Rigid PCB Materials

S1151GCharacteristic●Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.UV Blocking/AOI compatible● HighCTI,CTI≥600V● Not suitable for solder mask reworkApplication Area● Consumer electronics● Smartphone● Automotive electronics● Suggested to be used for maximum 8-layer board (thickness<1.6mm) with through hole constructionProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃150Td...

Internationally known Shengyi base materials Rigid material PCB Base materials S1151G

S1600 Shengyi Conventional FR-4 Rigid PCB Materials

Characteristic● Excellent tracking resistance,CTI≥600V● UV Blocking● Good PCB processablity● Not recommended fro solder mask reworkApplication Area● PDP, LCD, power base board, TV, refrigerator, washing machine, and etc.● Not suitable for Anti-CAF applicationProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃135TdIPC-TM-650 2.4.24.65% wt. loss℃310CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃55After Tgppm/℃30850-260℃%4.5Thermal StressIPC-TM-650 2.4.24.13288℃, solder dip...

Internationally known Shengyi base materials Rigid material PCB Base materials S1600

S1170G Shengyi Conventional FR-4 Rigid PCB Materials

S1170GCharacteristic● Lead-free compatible● Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.● High Tg, halogen free, Tg180℃(DMA)●UV Blocking/AOI compatible● Lower Z-axis CTEApplication Area● Consumer electronics● Smartphone● Automotive electronics● Computer● InstrumentProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.24.2DMA℃180TdIPC-TM-650 2.4.24.65% wt. loss℃390CTE (Z-axis)IPC-TM-...

Internationally known Shengyi base materials Rigid material PCB Base materials S1170G

S1150G Shengyi Halogen Free and Lead Free Compatible FR-4.1, FR-15.1 Rigid PCB Materials

S1150GCharacteristic● Free of constituents such as halogen, antimony, red phosphorous, ect. No toxic gas emission and no hazardous residue during waste combustion.● Excellent mechanical processability and thermal resistance, lead free process complianceApplication Area● Smartphone, tablet, notebook● LED, game station● Automotive electronics● Communication equipmentProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃155TdIPC-TM-650 2.4.24.65% wt. loss℃355CTE (Z-axis)IPC...

Internationally known Shengyi base materials Rigid material PCB Base materials S1150G

S1000-2M Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

S1000-2MCharacteristic● Lead-free compatible FR-4.0 laminate●Tg170℃ (DSC), UV Blocking/AOI compatible● High heat resistance● Lower Z-axis CTE● Excellent through-hole reliability● ExcellentAnti-CAF performance● Low water absorption● Excellent mechanical processabilityApplication Area● Suitable for high-layer count PCB● Widely used in computer, communication, automotive electronics, and etc.Product PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃180IPC-TM-650 2.4.24.4DMA℃185...

Internationally known Shengyi base materials Rigid material PCB Base materials S1000-2M

S1000-2 Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

S1000-2Characteristic● Lead-free compatible FR-4.0 laminate●Tg 170℃(DSC),UV Blocking/AOI compatible● High heat resistance● Low Z-axis CTE● Excellent through-holereliability●Excellent Anti-CAF performance● Low water absorptionApplication Area● Widely used in computer, communication equipment, precise apparatus and instrument, router, and etc.Product PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃180IPC-TM-650 2.4.24.4DMA℃185TdIPC-TM-650 2.4.24.65% wt. loss℃345CTE (Z-axis)I...

Internationally known Shengyi base materials Rigid material PCB Base materials S1000-2

S1000H Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

S1000HCharacteristic● Lead-free compatible FR-4.0● Excellent thermalreliability● LowZ-axis CTE● Good Anti-CAF performance and IST● Low water absorptionApplication Area● Computer and NB● Instruments● Consumer electronics● Automotive electronics● Power supply and industrialProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DDSC℃155IPC-TM-650 2.4.24.4DMA℃160TdIPC-TM-650 2.4.24.65% wt. loss℃348CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃37After Tgppm/℃23050-260℃%2.8T260IPC-TM-...

Tg150 Shengyi base materials Rigid material PCB Base materials PCB Materials S1000H

S1141 Shengyi Conventional FR-4 Rigid PCB Materials

Characteristic Tg140℃(DSC)●UV Blocking/AOI compatible● Excellent mechanical processabilityApplication Area● Computer,instrumentation, VCR, communication equipment, electronic game machine, automotive electronics, aviation,and etc.● Not suitable for Anit-CAF application● Not suitable for >2 oz heavy copper, HDI and >/=12L high layer count applicationProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃140TdIPC-TM-650 2.4.24.65% wt. loss℃310CTE (Z-axis)IPC-TM-650 2...

Internationally known Shengyi base materials Rigid material PCB Base materials PCB Materials S1141

Advanced PCBs common laminated structure design template

1. PCB stack method is recommended as Foil superposition method2. Minimize the use of PP and CORE models and types in the same stack (no more than 3 PP layers per layer).3. The thickness of PP medium between 3 and two layers should not exceed 21MIL. (thick PP dielectric processing is difficult. Generally, a core panel will be added, resulting in the increase of actual laminated number, which will increase additional processing cost).4. PCB outer layer (Top, Bottom layer) generally select 0.5OZ t...

PCB design template laminated structure Advanced PCBs

Determining SMT Process and Its Packaging

Abstract:Standardized design is good for the accomplishment of electric with SMT and the improvement of production efficiency. Introduce the standardized design of process flow, the choice of components, the layout of PCB, the requirement of SMT machine for design. The standardized design will assure the products to be of higher manufacturability, quality and production efficiency.Determine the Technological Process:In the initial stage of product design, the designer should basically determine ...

High Frequency PCB Layout Techniques

Introduction:The components are developing towards high speed, low consumption, small volume and high anti-interference. PCB design is an important stage of electronic product design. It can realize the connection and function between electronic components, and is also an important part of power circuit design. High frequency circuit has the higher integration and the higher layout density, so it is very vital how to make layout more reasonable and more scientific.PCB can realize the connection ...

Signal Integrity Analysis for High-speed PCB

Signal Integrity Analysis for High-speed PCBIntroduction:As large-scale and ultra-large-scale integrated circuits are more and more applied to power circuit systems, the requirements of users are higher and higher. As a result, the integration scale of chips is larger and smaller, the number of pins is larger and higher, and the frequency is higher and higher. However, the rapid development of the circuit brings about such a problem: the chip size is getting smaller, and the pins are generally i...

Influence of PCB Quality Problem on Wave Soldering and Reflow Soldering

Background:After the production of PCB, the original components need to be assembled to be used further. At present, the most common assembly methods are wave soldering, reflow soldering and the combination of the two technologies. The quality of PCB has great influence on the assembly quality of the three processes.Wave Soldering:Technological introduction: Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of mol...

Wave Soldering, Reflow Soldering

How to Design a PCB Panel for Less Money?

Introduction:PCB panel is a combination of several PCB unit boards with various possible connection modes, as shown in the figures below.Typical, when a hardware designer a PCB, he considers the electrical signal and the layout of the components on the circuit board, focusing on the function of the product. Less consideration is given to PCB manufacturing and assembly. To make PCB production smooth, especially for SMT assembly, special attention should be paid to PCB assembly design.I. Pur...

panel

Kicad Like a Pro, 2nd edition from Peter Dalmaris

Today we'd like to recommend an ebook from Peter Dalmaris - Kicad Like a Pro, 2nd edition. This book will teach you to use KiCad. Whether you are a hobbyist or an electronics engineer, this book will help you become productive quickly, and start designing your own boards.For people already familiar with previous versions of Kicad, the transition is seamless, and the changes make its usage easier than before. Features and workflows that used to be broken or problematic, now work (I am looking...

PCB design Kicad

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