The ratio of usable parts at the end of a manufacturing process to the number of components submitted for processing.
Shiny Li
Jan 28,2016
890 views
Capillary absorption of liquid along the fibres of the base material.
Shiny Li
Jan 28,2016
1020 views
The formation of a relatively uniform, smooth, unbroken and adherent film of solder to a base material.
Shiny Li
Jan 28,2016
832 views
A condition of base material in which a weave pattern of glass cloth is appearing on the surface though the unbroken fibres of the woven cloth are completely covered with resin.
Shiny Li
Jan 28,2016
1098 views
The technique of joining parts to a PCB by passing the assembly over a wave of molten solder so as to coat the pre-fluxed areas to be joined.
Shiny Li
Jan 28,2016
743 views
A surface condition of base material in which the unbroken fibres of woven glass cloth are not completely covered by resin.
Shiny Li
Jan 28,2016
750 views
A conductor or portion of a conductor layer on or in a printed board which is maintained at other than ground potential. It can also be used as a common voltage source, for heat sinking, or for shielding.
Shiny Li
Jan 28,2016
761 views
The property of a fluid that enables it to develop and maintain a level of shearing stress dependent upon the velocity of flow and then offer continued resistance to flow. The absolute unit of viscosity measurement is poise, or more commonly, centipoise.
Shiny Li
Jan 28,2016
659 views
A virtual (computer model) representation of an electronic product that can be used to explore different design scenarios and then verify that the product will work as planned before building a physical implementation.
Shiny Li
Jan 28,2016
763 views
A plated through-hole used as an interlayer connection and not as a terminating point for a component lead. It may also be blind (incomplete penetration) or buried (non-surfacing).
Shiny Li
Jan 28,2016
654 views
A plated through-hole whose only purpose is to connect a track on one layer or side of the board through to a track on another layer or side. In a via, there is no intention to insert a component lead or other reinforcing material.
Shiny Li
Jan 28,2016
683 views
The solder re-flow process that uses a vaporized solvent as the source for heating the solder beyond its melting point,creating the component-to-board solder joint.
Shiny Li
Jan 28,2016
578 views
A component handling tool with a small vacuum cup for ease of pick-up and removal during de-soldering.
Shiny Li
Jan 28,2016
494 views
A hole containing no conductive material nor any other type of reinforcement.
Shiny Li
Jan 28,2016
381 views
A logotype authorized for placement on a product which has been recognized (accepted) by Underwriters Laboratories, Inc. (UL).
Shiny Li
Jan 28,2016
456 views
A groove or excavation at one edge of a conductor caused by etching.
Shiny Li
Jan 28,2016
443 views
Fluxless soldering wherein molten solder is vibrated at ultrasonic frequencies while making the joint.
Shiny Li
Jan 28,2016
368 views
Underwriter’s Laboratories, Inc., a corporation for the purpose of establishing safety standards on types of equipment or components in USA and Canada.
Shiny Li
Jan 28,2016
404 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Support | 2 |
| 2 | P****ita | 1 |
