S1141 Shengyi Conventional FR-4 Rigid PCB Materials

Characteristic Tg140℃(DSC)●UV Blocking/AOI compatible● Excellent mechanical processabilityApplication Area● Computer,instrumentation, VCR, communication equipment, electronic game machine, automotive electronics, aviation,and etc.● Not suitable for Anit-CAF application● Not suitable for >2 oz heavy copper, HDI and >/=12L high layer count applicationProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃140TdIPC-TM-650 2.4.24.65% wt. loss℃310CTE (Z-axis)IPC-TM-650 2...

Internationally known Shengyi base materials Rigid material PCB Base materials PCB Materials S1141

Advanced PCBs common laminated structure design template

1. PCB stack method is recommended as Foil superposition method2. Minimize the use of PP and CORE models and types in the same stack (no more than 3 PP layers per layer).3. The thickness of PP medium between 3 and two layers should not exceed 21MIL. (thick PP dielectric processing is difficult. Generally, a core panel will be added, resulting in the increase of actual laminated number, which will increase additional processing cost).4. PCB outer layer (Top, Bottom layer) generally select 0.5OZ t...

PCB design template laminated structure Advanced PCBs

Determining SMT Process and Its Packaging

Abstract:Standardized design is good for the accomplishment of electric with SMT and the improvement of production efficiency. Introduce the standardized design of process flow, the choice of components, the layout of PCB, the requirement of SMT machine for design. The standardized design will assure the products to be of higher manufacturability, quality and production efficiency.Determine the Technological Process:In the initial stage of product design, the designer should basically determine ...

High Frequency PCB Layout Techniques

Introduction:The components are developing towards high speed, low consumption, small volume and high anti-interference. PCB design is an important stage of electronic product design. It can realize the connection and function between electronic components, and is also an important part of power circuit design. High frequency circuit has the higher integration and the higher layout density, so it is very vital how to make layout more reasonable and more scientific.PCB can realize the connection ...

Signal Integrity Analysis for High-speed PCB

Signal Integrity Analysis for High-speed PCBIntroduction:As large-scale and ultra-large-scale integrated circuits are more and more applied to power circuit systems, the requirements of users are higher and higher. As a result, the integration scale of chips is larger and smaller, the number of pins is larger and higher, and the frequency is higher and higher. However, the rapid development of the circuit brings about such a problem: the chip size is getting smaller, and the pins are generally i...

Influence of PCB Quality Problem on Wave Soldering and Reflow Soldering

Background:After the production of PCB, the original components need to be assembled to be used further. At present, the most common assembly methods are wave soldering, reflow soldering and the combination of the two technologies. The quality of PCB has great influence on the assembly quality of the three processes.Wave Soldering:Technological introduction: Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of mol...

Wave Soldering, Reflow Soldering

How to Design a PCB Panel for Less Money?

Introduction:PCB panel is a combination of several PCB unit boards with various possible connection modes, as shown in the figures below.Typical, when a hardware designer a PCB, he considers the electrical signal and the layout of the components on the circuit board, focusing on the function of the product. Less consideration is given to PCB manufacturing and assembly. To make PCB production smooth, especially for SMT assembly, special attention should be paid to PCB assembly design.I. Pur...

panel

Kicad Like a Pro, 2nd edition from Peter Dalmaris

Today we'd like to recommend an ebook from Peter Dalmaris - Kicad Like a Pro, 2nd edition. This book will teach you to use KiCad. Whether you are a hobbyist or an electronics engineer, this book will help you become productive quickly, and start designing your own boards.For people already familiar with previous versions of Kicad, the transition is seamless, and the changes make its usage easier than before. Features and workflows that used to be broken or problematic, now work (I am looking...

PCB design Kicad

Defects Contrast between Wave Soldering and Reflow Soldering

Introduction:As a kind of traditional welding technology, wave soldering and reflow soldering play an active role in the field of electronic manufacturing in the assembling process of electronic products. The quality of welding is related to product performance, reliability, service life, etc., and will affect each subsequent process flow. By analyzing and comparing the defects in the process of wave soldering and reflow welding from the quality control before welding, production process materia...

Wave Soldering, Reflow Soldering

Notes for Gerber files Generated from Eagle 9.20

Several days ago, Eagle released the lastest version 9.20, which still provide the convenient button for generating Gerber files. But what followed was some file problems.1. When opening Eagle.brd file and clicking the "CAM processor", you need be aware of the option of soldermask layers. Please cancel checking the "Nagative Polarity" which is checked by default, shown as below screenshot:2. If there is no board outline in the profile layer, please check and add the #Dimensi...

Eagle; Gerber; PCB design

The Main Factors Affect the Quality of SMT Soldering and Its Solutions

Abstract: SMT process as the core of the electronic assembly process, the welding quality affects the overall quality of the products. For SMT industry, high quality welding quality is the basis of products, and the capital and leverage for products to compete with others. The following are some main factors affecting SMT welding quality.Materials:As one of the important components of SMT, the quality and performance of materials directly affect the quality of backflow welding, so that the follo...

SMT Solder paste Stencil 3. Scraper Reflow Welding

Ball Grid Array (BGA)

Background:In the information age, the update speed of electronic products is accelerated. In one hand, the popularity of computers, mobile devices, portable devices and other products has made people's demands on electronic products higher and higher, which means that the performance of products must be improved in order to meet people’s requirements. The feature size of IC chip should be smaller and smaller, and the complexity should be increased. That is to say, the number of I/O in the c...

Ball Grid Array (BGA)

The Application of AOI System in PCB

—created by PCBWayIntroduction: With the rapid development of IC industry and the improvement of special components as well as multifunction of electronic components, the number of pins in unit area are substantially increasing, which accelerated the transfer of QFP & TCP to BGA & CSP and promoted the obvious change of PCB technology. PCB products are also developing towards ultra-thin, small components, high density and fine spacing. As the density of components on the PCB increases, PC...

PCB AOI

Organic Solderability Preservative (OSP)

—A Method of Surface Finish TechnologiesBackground:In recent years, electronic products are developing towards light, thin, short, miniaturized and multi-functional. At the same time, PCB is also developing towards high precision, high speed, high density and so on. In particular, the rapid development of SMT makes the hot air leveling process increasingly unsuited to the requirements of PCB manufacturing process. Meanwhile, the welding material, such as Sn-Pb, used in the hot air leveling proce...

Organic Solderability Preservative (OSP) SMT

Problems Encountered in PCB Design and Their Solutions

Brief Introduction:The improvement of hardware of electronic products often takes a long time, and the major problem is often the focus of solution. But it's the small, trivial issues that ultimately get in our way. This article is aimed at PCB board design, production and some problems encountered in maintenance, such as the voltage resistance of diode, electromagnetic interference, the shedding of welding pads and the replacement of vulnerable parts, etc. Under the principle of minimizing ...

PCB Design rectifier diode 1. Voltage - resistant protection electromagnetic interference pads

Copper Clad Laminate

Introduction:The substrates used in PCB are mainly divided into two categories: organic substrates and inorganic substrates. Among them, the organic substrates are made of several types of materials which refer to the reinforcing materials, such as glass fiber cloth, fiber paper, glass felt, etc. These reinforcing materials are impregnated with resin adhesive and dried, then covered with copper foil at high temperature and high pressure. This type of substrate, known as copper clad laminate (CCL...

Copper Clad Laminate CCL FR-4 FR-5 CEM-1 CEM-3 FR-1 FR-2 1) Rigid CCL 2) Flexible CCL Copp

Surface Finish Technology

Background:At present, the environmental problems involved in PCB production are particularly prominent. Lead and bromine are the hottest topics at the moment; Lead-free and halogen-free will affect the development of PCB in many ways. Although changes in the surface treatment process of PCB are not significant at present and seem to be relatively distant, it should be noted that the slow change in the long term will lead to great changes. PCB surface treatment technology is bound to change dram...

Surface Finish Technology

Something You Must Know about Surface Mount Technology (SMT)

Introduction:Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technolo...

PCB PCB Assembly SMT Surface-mount technology

What Do You Know About HDI

What Do You Know About HDI—by PCBWayBasic Information:HDI board refers to High Density Interconnect, namely High Density Interconnect board. It is a relatively new technology developed by PCB industry in the end of 20th century. When the drilling hole size of the traditional PCB reaches 0.15mm, the cost is very high and it is difficult to improve it again because of the affection by the drilling tool. The drilling of HDI board no longer relies on traditional mechanical drilling, but uses the las...

HDI

Meet PCBWay At Electronica 2018 (Messe München)

Venue:Messe MünchenDates:November 13–16, 2018 Opening hoursVisitorsExhibitorsJournalistsTuesday to Thursday09:00–18:0008:00–19:0008:45–18:00Friday09:00–17:0008:00–end of dismantling08:45–17: PCBWay Booth No.:A1.543-4◇Online Quotation Demonstration:Staffs of PCBWay will be consulted directly on PCB board design, manufacturing and assembly as well as PCB prototype and mass production. We will show some of our manufacturing examples in the booth so you can check the quality. ◇Main Exhib...

PCBWay Electronica 2018 Electronica Messe München PCB Board

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