Clipper Circuits Part 2: Negative Clipper Circuits

 IntroductionPart one of the Clipper Circuits briefed us on the two types of clipper circuits: positive and negative clipper circuits, and we dwelt deeply into the positive clipper circuits worki...

PCB Substrate Advanced PCBs High Tg PCB PCB Manufacturing Impedance Control

Clipper Circuits Part 1

In power electronics, engineers sometime would like to reject part of the specified wave while allowing part of it to pass. This action requires the design of a special circuit known as a clipper circ...

PCB Substrate Advanced PCBs High Tg PCB PCB Manufacturing Impedance Control

Basic Things For Generating High-Speed Printed Circuit Board

As the world is upgrading at a very fast rate, every field is producing a faster product which is the reason for embedded software development. Speed is inversely proportional to the size in terms of ...

PCB Substrate PCB Manufacturing Impedance Control PCB Materials Manufacture capability

FQC and Packaging | Multi-layer PCB Manufacturing Process - 16

Final Quality ControlFQC, short for final quality control, is the comprehensive and final inspection of printed circuit boards before shipping to ensure that the boards meet the specifications. Althou...

PCB Manufacturing

Electrical Test | Multi-layer PCB Manufacturing Process - 15

After all the manufacturing processes of the circuit board have been completed, the electrical test is carried out to check the board for open circuits and short circuits. The two most commonly used t...

PCB Manufacturing

Profile | Multi-layer PCB Manufacturing Process - 14

The process of PCB profile is to cut the production panel into specific sizes and shapes based on the customer's design requirements. To facilitate PCB assembly, the boards can be profiled in individu...

PCB Manufacturing

Surface Finish | Multi-layer PCB Manufacturing Process - 13

Bare copper of PCB is easily oxidized by moisture when exposed to air, and the resulting oxide layer of copper has a great impact on the soldering, which may lead to cold soldering and even cause the ...

PCB Manufacturing

Legend Printing | Multi-layer PCB Manufacturing Process - 12

Legend printing ,also known as Silkscreen, is a process of printing informational texts or patterns on the surface of the board. Legend information includes component reference designators, switch set...

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PCB Surface Finishes

Bare copper has good solderability, but it is easily oxidized by moisture when exposed to air. The oxide layer of copper has a great impact on the soldering. It may lead to cold soldering and even cau...

PCB Manufacturing

Soldermask | Multi-layer PCB Manufacturing Process - 11

As a protective layer, the solder mask layer is covered on the traces and substrates that do not need to be soldered to prevent short circuits during soldering. At the same time, it serves to provide ...

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Automatic Optical Inspection | Multi-layer PCB Manufacturing Process - 10

AOI - Automatic Optical InspectionDuring the etching process, the etching method, the etching rate, the types and pH value of the etchants, or other factors directly affect the quality of the circuits...

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Etching | Multi-layer PCB Manufacturing Process – 09

In the previous step, the copper surface is covered with a layer of tin as an etching resist. Now we need to remove the unwanted copper from the surface to obtain the final desired circuits. This proc...

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Pattern Plating | Multi-layer PCB Manufacturing Process - 08

After developing, the copper thickness of the exposed circuits needs to be increased by a secondary copper plating, namely pattern plating. The purpose is to make the hole copper and surface copper of...

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Outer Layer | Multi-layer PCB Manufacturing Process - 07

In the previous steps, we have completed the creation of all the inner layer circuits and the required holes (Through/Buried/Blind holes). Next, we have to enter the outer layer imaging process of the...

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PCB Plating Process | Multi-layer PCB Manufacturing Process - 06

The hole walls after drilling are composed of non-conductive epoxy resin and fiberglass board. In order to connect circuits between different layers, it is necessary to metalize the hole walls through...

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Drilling | Multi-layer PCB Manufacturing Process - 05

To make the circuit of each layer connected, the boards need to go through the drilling process to make the corresponding holes according to the specifications in the drill files. For single and doubl...

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Lamination | Multi-layer PCB Manufacturing Process - 04

Prior to lamination, the surface of inner image layer needs to go through an oxide process (brown oxide or black oxide treatment) to roughen and passivate the copper surface, increase the interaction ...

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Inner Layer | Multi-layer PCB Manufacturing Process - 03

Surface Pre-TreatmentThe copper sheet after cutting has oxides, grease and other impurities attached to the surface, which firstly needs to be pretreated. The main purpose of pretreatment is to remove...

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Board Cutting | Multi-layer PCB Manufacturing Process - 02

Planned FeedingAs PCB gets unavoidably scrapped in the actual production process, the factory needs to add an additional proportion of materials to ensure the required quantity of good boards. The add...

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Pre-engineering | Multi-layer PCB Production Process 01

All PCB orders need to go through the engineering department before being scheduled for production. Now let's explore what the engineering department does to ensure the smooth production. Checkin...

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