Common IPC standards for PCB

1) IPC-ESD-2020The joint standard for the development of electrostatic discharge control programs. Includes the design, establishment, implementation, and maintenance necessary for electrostatic discharge control procedures. Provide guidance for handling and protection during electrostatic discharge sensitive periods based on the historical experience of certain military and commercial organizations.2) IPC-SA-61ASemi-aqueous cleaning manual after welding. Including all aspects of semi-aqueous cl...

Surface Mount Technology Welding Technology IPC Standards

Characteristics and Maintenance of Common Circuit board and Component Failures

1. The fault characteristics and maintenance of industrial control circuit board capacitor damageThe failure caused by capacitor damage is the highest in electronic equipment, especially the damage of the electrolytic capacitor is the most common.Capacitor damage manifests itself as: 1. capacity becomes smaller; 2. complete loss of capacity; 3. leakage; 4. short circuit.Capacitors play different roles in the circuit, and the faults they cause also have their own characteristics. In industrial co...

Impedance Matching in High-Speed PCB Design

Impedance matchingImpedance matching means that when energy is transmitted, the load impedance must be equal to the characteristic impedance of the transmission line. At this time, there is no reflection in the transmission, which indicates that all energy is absorbed by the load. On the contrary, there is energy loss in transmission. In high-speed PCB design, the matching of impedance is related to the quality of the signal.When do PCB traces need to be impedance matched?It does not mainly look...

Parallel terminal matching Series termination matching Impedance matching

Embedding of Passive Components into Flex PCB

Introduction:Miniaturization and multi-function of products are the main driving force for the development of electronic industry. Printed circuit board is the most common electronic assembly platform. These include rigid or flexible polymer substrates and ceramic substrates for metal wiring. Typically, various components and subsystems are mounted on the board surface. However, in order to reduce the number of components on the surface of the printed circuit board, researchers are constantly st...

Passive Components Embedding Components Flex PCB

Semi-Flex PCB

Introduction:Traditional rigid-flex PCB materials include rigid materials and flexible materials. The current production method is usually to carry on the pattern plating for the rigid substrates and flexible substrates, and then laminating the rigid substrates and flexible substrates together by using the adhesion agent. The materials of the adhesion agent are usually made of non-flowing prepregs. Flexible materials are expensive and costly to make. At present, the cost of multilayer rigid-flex...

Gold, Silver and Copper in PCB

The PCB is support for electronic components and is a carrier for electrical connection of electronic components, mainly for supporting and interconnecting. From the outside, the outer layer of the board has three main colors: gold, silver, and light red. Classified by price: gold is the most expensive, silver is second, light red is the cheapest. However, the circuit inside the board is mainly pure copper, which is bare copper.Why are there precious metals on the PCB?PCB as a support for electr...

Immersion Silver Immersion Gold PCB CCL

The Roles of the Different Capacitors

Capacitors are almost indispensable energy storage elements in electronic circuits. They have the characteristics of blocking DC, connecting AC, and preventing low frequency. Widely used in the coupling, blocking, bypass, filtering, tuning, energy conversion and automatic control circuits. Being familiar with the meaning of capacitor names in different circuits will help us understand electronic circuit diagrams.1. Filter capacitor: It is connected between the positive and negative poles of the ...

Resisitor DC AC Capacitor

SH260 Shengyi Rigid Polyimide Material Special Materials

SH260Characteristic● Polyimide system provides ultra-high thermal performance, with Tg>250℃ (TMA), Td>405℃ (5% loss, TGA), and T300>60min.● Lower Z-axis CTE of1.20% (50-260℃) offering superior PTH reliability.● Maintain mechanical strength and bonding strength at high temperature.● Tough resin system, Non-MDA chemistry.● Halogen-free chemistry compatible with lead-free processing. RoHS/WEEE compliant.● IPC4101D/40,/41.Application Area● Burn-in Board● Down Hole● Aircraft and Aerospace● Other PCB ...

Internationally known Shengyi base materials Rigid material PCB Base materials Special Materials

TU-863P MF High Tg Low Loss Halogen Free Low flow Prepreg PCB Materials

Radio Frequency (RF)TU-863P MFHigh Tg Low Loss Halogen Free Low flow PrepregPrepreg: TU-863P MFTU-863P MF low loss, low flow halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding applications. The special design TU-863P MF low flow, low loss halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board applications. TU-863P MF low flow prepreg also provide excellent bonding performance wi...

Internationally known TUC base materials Rigid material PCB Base materials TU-863P MF

N4000-13-13-SI High-Speed Multifunctional Epoxy Laminate & Prepreg PCB Materials

N4000-13 / 13 SIHigh-Speed Multifunctional Epoxy Laminate & PrepregLaminate Part Number: N4103-13Prepreg Part Number: N4203-13The Nelco N4000-13 / 13 SI series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI? is excellent for PCB material applications that require optimum signal integrity and precise impedance control, while maintaining high reliability through CAF and thermal resistance.Data She...

Internationally known AGC base materials Rigid material PCB Base materials PCB Materials

TU-872 LK TU-872 SLK TU-872 SLK Sp TUC High Speed Digital HSD PCB Materials

High Speed Digital (HSD)TU-872 LKLow Dk/Df and High Thermal Reliability MaterialCore: TU-872 LK; Prepreg: TU-87P LKTU-872 LK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 LK material is suitable for environmental protection lead free process and also compatible with FR-4 proc...

Internationally known TUC base materials Rigid material PCB Base materials TU-872

IT-170GRA2 ITEQ high Tg Rigid PCB Materials

IT-170GRA2The IT-170GRA2 is a high Tg (175° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. This green material is designed for low lost low loss material and used in server/storage/switch application .ApplicationServer/Storage/SwitchRoutersBackplaneTelecomBase stationKey FeaturesHalogen free, High-Tg (175oC)Lower Dk ( Compatible with High Tg standard FR-4 processesHigh thermal & CAF resistance reliabilityEnvironmental frie...

Internationally known ITEQ base materials Rigid material PCB Base materials IT-170GRA2

FR408HR High Performance Laminate and Prepreg PCB Materials

FR408HRHigh Performance Laminate and Prepregfr408hr.pdfProduct SummaryFR408HR is a proprietary high-performance 230°C (DMA) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% impr...

Internationally known isola base materials Rigid material PCB Base materials FR408HR

S7038 Shengyi HSD Materials Mid-loss PCB Material

S7038HSD Materials,Mid-loss MaterialCharacteristic● Tg>190℃ (DSC)● Dk/Df@1GHz: 3.62/0.0085● low Z-axis CTE, with good processibilityApplication AreaPC server, line card, HSD application...Product PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃190TgIPC-TM-650 2.4.24.4DMA℃200TdIPC-TM-650 2.4.24.65% wt. loss℃345CTE(Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃50After Tgppm/℃23050-260℃%2.5T260IPC-TM-650 2.4.24.1TMAmin>60T288IPC-TM-650 2.4.24.1TMAmin27Thermal StressIPC-TM-650 2.4....

Internationally known Shengyi base materials Rigid material PCB Base materials S7038

TU-768 High Speed Digital (HSD) PCB Materials

High Speed Digital (HSD)TU-768High-Tg and High Thermal Reliability Laminate and PrepregCore: TU-768; Prepreg: TU-768PTU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhi...

Internationally known High Speed Digital base materials Rigid material PCB Base materials TU-768

TU-662 Radio Frequency (RF) Mid-Tg and High Thermal Reliability Laminate and Prepreg PCB Material

TU-662Mid-Tg and High Thermal Reliability Laminate and PrepregCore: TU-662; Prepreg: TU-66PTU-662/ TU-66P laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 laminates exhibit excellent CTE, superior chemic...

Internationally known base materials Rigid material PCB Base materials TU-662

TU-862 HF TU-862S TU-862T Automotive High Tg Halogen Free Material

AutomotiveTU-862 HFHigh Tg Halogen Free MaterialCore: TU-862 HF; Prepreg: TU-86P HFTU-862 HF/TU-86P HF High Tg halogen free materials are made of epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862 HF/TU-86P HF achieves flammability class of UL94V-0 by incorporating phosphorous and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-86P HF is designed for...

Internationally known Halogen Free Rigid material PCB Base materials High Tg

S1151G Shengyi Conventional FR-4 Rigid PCB Materials

S1151GCharacteristic●Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.UV Blocking/AOI compatible● HighCTI,CTI≥600V● Not suitable for solder mask reworkApplication Area● Consumer electronics● Smartphone● Automotive electronics● Suggested to be used for maximum 8-layer board (thickness<1.6mm) with through hole constructionProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃150Td...

Internationally known Shengyi base materials Rigid material PCB Base materials S1151G

S1600 Shengyi Conventional FR-4 Rigid PCB Materials

Characteristic● Excellent tracking resistance,CTI≥600V● UV Blocking● Good PCB processablity● Not recommended fro solder mask reworkApplication Area● PDP, LCD, power base board, TV, refrigerator, washing machine, and etc.● Not suitable for Anti-CAF applicationProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃135TdIPC-TM-650 2.4.24.65% wt. loss℃310CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃55After Tgppm/℃30850-260℃%4.5Thermal StressIPC-TM-650 2.4.24.13288℃, solder dip...

Internationally known Shengyi base materials Rigid material PCB Base materials S1600

S1170G Shengyi Conventional FR-4 Rigid PCB Materials

S1170GCharacteristic● Lead-free compatible● Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.● High Tg, halogen free, Tg180℃(DMA)●UV Blocking/AOI compatible● Lower Z-axis CTEApplication Area● Consumer electronics● Smartphone● Automotive electronics● Computer● InstrumentProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.24.2DMA℃180TdIPC-TM-650 2.4.24.65% wt. loss℃390CTE (Z-axis)IPC-TM-...

Internationally known Shengyi base materials Rigid material PCB Base materials S1170G

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