Gold, Silver and Copper in PCB

The PCB is support for electronic components and is a carrier for electrical connection of electronic components, mainly for supporting and interconnecting. From the outside, the outer layer of the board has three main colors: gold, silver, and light red. Classified by price: gold is the most expensive, silver is second, light red is the cheapest. However, the circuit inside the board is mainly pure copper, which is bare copper.Why are there precious metals on the PCB?PCB as a support for electr...

Immersion Silver Immersion Gold PCB CCL

SH260 Shengyi Rigid Polyimide Material Special Materials

SH260Characteristic● Polyimide system provides ultra-high thermal performance, with Tg>250℃ (TMA), Td>405℃ (5% loss, TGA), and T300>60min.● Lower Z-axis CTE of1.20% (50-260℃) offering superior PTH reliability.● Maintain mechanical strength and bonding strength at high temperature.● Tough resin system, Non-MDA chemistry.● Halogen-free chemistry compatible with lead-free processing. RoHS/WEEE compliant.● IPC4101D/40,/41.Application Area● Burn-in Board● Down Hole● Aircraft and Aerospace● Other PCB ...

Internationally known Shengyi base materials Rigid material PCB Base materials Special Materials

TU-863P MF High Tg Low Loss Halogen Free Low flow Prepreg PCB Materials

Radio Frequency (RF)TU-863P MFHigh Tg Low Loss Halogen Free Low flow PrepregPrepreg: TU-863P MFTU-863P MF low loss, low flow halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding applications. The special design TU-863P MF low flow, low loss halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board applications. TU-863P MF low flow prepreg also provide excellent bonding performance wi...

Internationally known TUC base materials Rigid material PCB Base materials TU-863P MF

N4000-13-13-SI High-Speed Multifunctional Epoxy Laminate & Prepreg PCB Materials

N4000-13 / 13 SIHigh-Speed Multifunctional Epoxy Laminate & PrepregLaminate Part Number: N4103-13Prepreg Part Number: N4203-13The Nelco N4000-13 / 13 SI series is an enhanced epoxy resin system engineered to provide both outstanding thermal and high signal speed / low signal loss properties. N4000-13 SI? is excellent for PCB material applications that require optimum signal integrity and precise impedance control, while maintaining high reliability through CAF and thermal resistance.Data She...

Internationally known AGC base materials Rigid material PCB Base materials PCB Materials

TU-872 LK TU-872 SLK TU-872 SLK Sp TUC High Speed Digital HSD PCB Materials

High Speed Digital (HSD)TU-872 LKLow Dk/Df and High Thermal Reliability MaterialCore: TU-872 LK; Prepreg: TU-87P LKTU-872 LK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 LK material is suitable for environmental protection lead free process and also compatible with FR-4 proc...

Internationally known TUC base materials Rigid material PCB Base materials TU-872

IT-170GRA2 ITEQ high Tg Rigid PCB Materials

IT-170GRA2The IT-170GRA2 is a high Tg (175° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. This green material is designed for low lost low loss material and used in server/storage/switch application .ApplicationServer/Storage/SwitchRoutersBackplaneTelecomBase stationKey FeaturesHalogen free, High-Tg (175oC)Lower Dk ( Compatible with High Tg standard FR-4 processesHigh thermal & CAF resistance reliabilityEnvironmental frie...

Internationally known ITEQ base materials Rigid material PCB Base materials IT-170GRA2

FR408HR High Performance Laminate and Prepreg PCB Materials

FR408HRHigh Performance Laminate and Prepregfr408hr.pdfProduct SummaryFR408HR is a proprietary high-performance 230°C (DMA) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% impr...

Internationally known isola base materials Rigid material PCB Base materials FR408HR

S7038 Shengyi HSD Materials Mid-loss PCB Material

S7038HSD Materials,Mid-loss MaterialCharacteristic● Tg>190℃ (DSC)● Dk/Df@1GHz: 3.62/0.0085● low Z-axis CTE, with good processibilityApplication AreaPC server, line card, HSD application...Product PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃190TgIPC-TM-650 2.4.24.4DMA℃200TdIPC-TM-650 2.4.24.65% wt. loss℃345CTE(Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃50After Tgppm/℃23050-260℃%2.5T260IPC-TM-650 2.4.24.1TMAmin>60T288IPC-TM-650 2.4.24.1TMAmin27Thermal StressIPC-TM-650 2.4....

Internationally known Shengyi base materials Rigid material PCB Base materials S7038

TU-768 High Speed Digital (HSD) PCB Materials

High Speed Digital (HSD)TU-768High-Tg and High Thermal Reliability Laminate and PrepregCore: TU-768; Prepreg: TU-768PTU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhi...

Internationally known High Speed Digital base materials Rigid material PCB Base materials TU-768

TU-662 Radio Frequency (RF) Mid-Tg and High Thermal Reliability Laminate and Prepreg PCB Material

TU-662Mid-Tg and High Thermal Reliability Laminate and PrepregCore: TU-662; Prepreg: TU-66PTU-662/ TU-66P laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 laminates exhibit excellent CTE, superior chemic...

Internationally known base materials Rigid material PCB Base materials TU-662

TU-862 HF TU-862S TU-862T Automotive High Tg Halogen Free Material

AutomotiveTU-862 HFHigh Tg Halogen Free MaterialCore: TU-862 HF; Prepreg: TU-86P HFTU-862 HF/TU-86P HF High Tg halogen free materials are made of epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862 HF/TU-86P HF achieves flammability class of UL94V-0 by incorporating phosphorous and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-86P HF is designed for...

Internationally known Halogen Free Rigid material PCB Base materials High Tg

S1151G Shengyi Conventional FR-4 Rigid PCB Materials

S1151GCharacteristic●Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.UV Blocking/AOI compatible● HighCTI,CTI≥600V● Not suitable for solder mask reworkApplication Area● Consumer electronics● Smartphone● Automotive electronics● Suggested to be used for maximum 8-layer board (thickness<1.6mm) with through hole constructionProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃150Td...

Internationally known Shengyi base materials Rigid material PCB Base materials S1151G

S1600 Shengyi Conventional FR-4 Rigid PCB Materials

Characteristic● Excellent tracking resistance,CTI≥600V● UV Blocking● Good PCB processablity● Not recommended fro solder mask reworkApplication Area● PDP, LCD, power base board, TV, refrigerator, washing machine, and etc.● Not suitable for Anti-CAF applicationProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃135TdIPC-TM-650 2.4.24.65% wt. loss℃310CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃55After Tgppm/℃30850-260℃%4.5Thermal StressIPC-TM-650 2.4.24.13288℃, solder dip...

Internationally known Shengyi base materials Rigid material PCB Base materials S1600

S1170G Shengyi Conventional FR-4 Rigid PCB Materials

S1170GCharacteristic● Lead-free compatible● Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.● High Tg, halogen free, Tg180℃(DMA)●UV Blocking/AOI compatible● Lower Z-axis CTEApplication Area● Consumer electronics● Smartphone● Automotive electronics● Computer● InstrumentProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.24.2DMA℃180TdIPC-TM-650 2.4.24.65% wt. loss℃390CTE (Z-axis)IPC-TM-...

Internationally known Shengyi base materials Rigid material PCB Base materials S1170G

S1150G Shengyi Halogen Free and Lead Free Compatible FR-4.1, FR-15.1 Rigid PCB Materials

S1150GCharacteristic● Free of constituents such as halogen, antimony, red phosphorous, ect. No toxic gas emission and no hazardous residue during waste combustion.● Excellent mechanical processability and thermal resistance, lead free process complianceApplication Area● Smartphone, tablet, notebook● LED, game station● Automotive electronics● Communication equipmentProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃155TdIPC-TM-650 2.4.24.65% wt. loss℃355CTE (Z-axis)IPC...

Internationally known Shengyi base materials Rigid material PCB Base materials S1150G

S1000-2M Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

S1000-2MCharacteristic● Lead-free compatible FR-4.0 laminate●Tg170℃ (DSC), UV Blocking/AOI compatible● High heat resistance● Lower Z-axis CTE● Excellent through-hole reliability● ExcellentAnti-CAF performance● Low water absorption● Excellent mechanical processabilityApplication Area● Suitable for high-layer count PCB● Widely used in computer, communication, automotive electronics, and etc.Product PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃180IPC-TM-650 2.4.24.4DMA℃185...

Internationally known Shengyi base materials Rigid material PCB Base materials S1000-2M

S1000-2 Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

S1000-2Characteristic● Lead-free compatible FR-4.0 laminate●Tg 170℃(DSC),UV Blocking/AOI compatible● High heat resistance● Low Z-axis CTE● Excellent through-holereliability●Excellent Anti-CAF performance● Low water absorptionApplication Area● Widely used in computer, communication equipment, precise apparatus and instrument, router, and etc.Product PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃180IPC-TM-650 2.4.24.4DMA℃185TdIPC-TM-650 2.4.24.65% wt. loss℃345CTE (Z-axis)I...

Internationally known Shengyi base materials Rigid material PCB Base materials S1000-2

S1000H Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

S1000HCharacteristic● Lead-free compatible FR-4.0● Excellent thermalreliability● LowZ-axis CTE● Good Anti-CAF performance and IST● Low water absorptionApplication Area● Computer and NB● Instruments● Consumer electronics● Automotive electronics● Power supply and industrialProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DDSC℃155IPC-TM-650 2.4.24.4DMA℃160TdIPC-TM-650 2.4.24.65% wt. loss℃348CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃37After Tgppm/℃23050-260℃%2.8T260IPC-TM-...

Tg150 Shengyi base materials Rigid material PCB Base materials PCB Materials S1000H

S1141 Shengyi Conventional FR-4 Rigid PCB Materials

Characteristic Tg140℃(DSC)●UV Blocking/AOI compatible● Excellent mechanical processabilityApplication Area● Computer,instrumentation, VCR, communication equipment, electronic game machine, automotive electronics, aviation,and etc.● Not suitable for Anit-CAF application● Not suitable for >2 oz heavy copper, HDI and >/=12L high layer count applicationProduct PerformanceItemsMethodConditionUnitTypical ValueTgIPC-TM-650 2.4.25DSC℃140TdIPC-TM-650 2.4.24.65% wt. loss℃310CTE (Z-axis)IPC-TM-650 2...

Internationally known Shengyi base materials Rigid material PCB Base materials PCB Materials S1141

Advanced PCBs common laminated structure design template

1. PCB stack method is recommended as Foil superposition method2. Minimize the use of PP and CORE models and types in the same stack (no more than 3 PP layers per layer).3. The thickness of PP medium between 3 and two layers should not exceed 21MIL. (thick PP dielectric processing is difficult. Generally, a core panel will be added, resulting in the increase of actual laminated number, which will increase additional processing cost).4. PCB outer layer (Top, Bottom layer) generally select 0.5OZ t...

PCB design template laminated structure Advanced PCBs

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