Defects Contrast between Wave Soldering and Reflow Soldering

Introduction:As a kind of traditional welding technology, wave soldering and reflow soldering play an active role in the field of electronic manufacturing in the assembling process of electronic products. The quality of welding is related to product performance, reliability, service life, etc., and will affect each subsequent process flow. By analyzing and comparing the defects in the process of wave soldering and reflow welding from the quality control before welding, production process materia...

Wave Soldering, Reflow Soldering

Notes for Gerber files Generated from Eagle 9.20

Several days ago, Eagle released the lastest version 9.20, which still provide the convenient button for generating Gerber files. But what followed was some file problems.When opening Eagle.brd file and clicking the "CAM processor", you need be aware of the option of soldermask layers. Please cancel checking the "Nagative Polarity" which is checked by default, shown as below screenshot:Then you can choose the Gerber RS-247X or RS -247X with comments and click "Process J...

Eagle; Gerber; PCB design

The Main Factors Affect the Quality of SMT Soldering and Its Solutions

Abstract: SMT process as the core of the electronic assembly process, the welding quality affects the overall quality of the products. For SMT industry, high quality welding quality is the basis of products, and the capital and leverage for products to compete with others. The following are some main factors affecting SMT welding quality.Materials:As one of the important components of SMT, the quality and performance of materials directly affect the quality of backflow welding, so that the follo...

Reflow Welding 3. Scraper Stencil Solder paste SMT

Ball Grid Array (BGA)

Background:In the information age, the update speed of electronic products is accelerated. In one hand, the popularity of computers, mobile devices, portable devices and other products has made people's demands on electronic products higher and higher, which means that the performance of products must be improved in order to meet people’s requirements. The feature size of IC chip should be smaller and smaller, and the complexity should be increased. That is to say, the number of I/O in the c...

Ball Grid Array (BGA)

The Application of AOI System in PCB

—created by PCBWayIntroduction: With the rapid development of IC industry and the improvement of special components as well as multifunction of electronic components, the number of pins in unit area are substantially increasing, which accelerated the transfer of QFP & TCP to BGA & CSP and promoted the obvious change of PCB technology. PCB products are also developing towards ultra-thin, small components, high density and fine spacing. As the density of components on the PCB increases, PC...

AOI PCB

Organic Solderability Preservative (OSP)

—A Method of Surface Finish TechnologiesBackground:In recent years, electronic products are developing towards light, thin, short, miniaturized and multi-functional. At the same time, PCB is also developing towards high precision, high speed, high density and so on. In particular, the rapid development of SMT makes the hot air leveling process increasingly unsuited to the requirements of PCB manufacturing process. Meanwhile, the welding material, such as Sn-Pb, used in the hot air leveling proce...

SMT Organic Solderability Preservative (OSP)

Problems Encountered in PCB Design and Their Solutions

Brief Introduction:The improvement of hardware of electronic products often takes a long time, and the major problem is often the focus of solution. But it's the small, trivial issues that ultimately get in our way. This article is aimed at PCB board design, production and some problems encountered in maintenance, such as the voltage resistance of diode, electromagnetic interference, the shedding of welding pads and the replacement of vulnerable parts, etc. Under the principle of minimizing ...

pads electromagnetic interference 1. Voltage - resistant protection rectifier diode PCB Design

Copper Clad Laminate

Introduction:The substrates used in PCB are mainly divided into two categories: organic substrates and inorganic substrates. Among them, the organic substrates are made of several types of materials which refer to the reinforcing materials, such as glass fiber cloth, fiber paper, glass felt, etc. These reinforcing materials are impregnated with resin adhesive and dried, then covered with copper foil at high temperature and high pressure. This type of substrate, known as copper clad laminate (CCL...

Copp 2) Flexible CCL 1) Rigid CCL FR-2 FR-1 CEM-3 CEM-1 FR-5 FR-4 CCL Copper Clad Laminate

Surface Finish Technology

Background:At present, the environmental problems involved in PCB production are particularly prominent. Lead and bromine are the hottest topics at the moment; Lead-free and halogen-free will affect the development of PCB in many ways. Although changes in the surface treatment process of PCB are not significant at present and seem to be relatively distant, it should be noted that the slow change in the long term will lead to great changes. PCB surface treatment technology is bound to change dram...

Surface Finish Technology

Something You Must Know about Surface Mount Technology (SMT)

Introduction:Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technolo...

Surface-mount technology SMT PCB Assembly PCB

What Do You Know About HDI

What Do You Know About HDI—by PCBWayBasic Information:HDI board refers to High Density Interconnect, namely High Density Interconnect board. It is a relatively new technology developed by PCB industry in the end of 20th century. When the drilling hole size of the traditional PCB reaches 0.15mm, the cost is very high and it is difficult to improve it again because of the affection by the drilling tool. The drilling of HDI board no longer relies on traditional mechanical drilling, but uses the las...

HDI

Meet PCBWay At Electronica 2018 (Messe München)

Venue:Messe MünchenDates:November 13–16, 2018 Opening hoursVisitorsExhibitorsJournalistsTuesday to Thursday09:00–18:0008:00–19:0008:45–18:00Friday09:00–17:0008:00–end of dismantling08:45–17: PCBWay Booth No.:A1.543-4◇Online Quotation Demonstration:Staffs of PCBWay will be consulted directly on PCB board design, manufacturing and assembly as well as PCB prototype and mass production. We will show some of our manufacturing examples in the booth so you can check the quality. ◇Main Exhib...

PCB Board Messe München Electronica Electronica 2018 PCBWay

Meet PCBWay At HKTDC Hong Kong Electronics Fair (Autumn Edition) 2018

Fair Dates: 13-16 October 2018 (Saturday-Tuesday) Venue: Hong Kong Convention and Exhibition Centre 1 Expo Drive, Wan Chai, Hong Kong (Harbour Road Entrance) Opening Hours:Fair DateOpening HoursBuyer Registration Hours13-15 October (Sat-Mon)9:30am-6:30pm9am-6pm16 October (Tue)9:30am-5:00pm9am-3:30pm PCBWay Booth No.:5F-G18 & 5F-G20◇Online Quotation Demonstration:Staffs of PCBWay will be consulted directly on PCB board design, manufacturing and assembly as well as PCB prototype and m...

PCB Manufacturing PCBWay Electronics Fair Autumn Edition Hong Kong Electronics Fair HKTDC

The PCB Assembly Process

IntroductionWith the rapid development of the modern information industry, electronic products are constantly improving and updating. Any electronic product cannot be separated from printed circuit board, which is the support body of electronic components and the provider of electrical connection of electronic components. High-density electronic product assembly on PCB is mainly dependent on SMT process. The rapid development and popularization of SMT---an important component of electronic advan...

Reflow Soldering AOI Component Placement Adhesive Dispense SMT Assembly PCB Assembly

Classification and Features of PCB

Classification and Features of PCBPrinted circuit is a conductive pattern attached to the insulating substrate surface to connect electronic components. The finished boards of printed circuit become printed circuit boards, namely PCBs. A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers ...

II. Features of Multi-layer PCB Features of PCB Multilayer PCB Double Sided PCB Single-side PCB Flexible PCB Rigid PCB Classification of PCB

New PCB design partner intruduction - ValiTech

ValiTech is an engineering services company founded in 2015. The company with a global presence and oriented to provide solutions to Medical & Industrial start-ups and SMEs. Through the use of state-of-the-art engineering processes and a strong global partnership with a leading electronic OEMs we are committed to transforming ideas into disruptive, leading edge products and systems.With combined 30 years of industry experience, the team has a vast embedded firmware and hardware knowledge fo...

wireless IoT FPGA FDM DLP 3D print PCB design

Detailed Procedures of Plating Copper for PCB Processing

——Technical Analysis of Plating Copper for PCB ProcessingElectroless plating is widely used in the printed circuit board (PCB) production and processing which has holes on that and it can also be called PTH(Plate Through Hole), the main purpose is to deposit a layer of copper through a series of chemical treatment methods in the conductive substrate, and then increasing the thickness of the copper layer through subsequent electroplating methods to its specific thickness of design which is usuall...

Charge Adjustment Oil Removing Cromic Acid PTH PCB process Electroless plating Plating Copper

ESD Inhibition Criteria in PCB Design

Introduction:Electrostatic discharge (ESD) is the sudden flow of electricity between two electrically charged objects caused by contact, an electrical short, or dielectric breakdown. A buildup of static electricity can be caused by tribocharging or by electrostatic induction. The ESD occurs when differently-charged objects are brought close together or when the dielectric between them breaks down, often creating a visible spark. ESD can create spectacular electric sparks (lightning, with the acc...

Charge Injection Electrostatic discharge PCB design ESD

True blue will never strain—PCBWay Opens Its PCB Test Report

In mid-May, PCBWay entrusts the third-party Huizhou Lier laboratory to test and report the PCB produced by a factory in Pingshan which is one of the PCB manufacturers of PCBWay. Huizhou Lier laboratory, belonging to Huizhou Lier industrial Co., LTD, has provided real and objective test results for many domestic manufacturing brands.The thermal stress test was conducted in the PCB reliability potion center of the laboratory for two day. Refer to the test method of GB/T 4677-2002, and the test con...

The thermal stress test of PCB

Holiday Schedule of the coming Mid-Autumn Festival and National Day

Dear All PCBWayers,Another famous Chinese traditional festival,Mid-Autumn Festival will be celebratedon September 24, 2018. Moreover, it’s followed by another important holiday, National Day on October 1, 2018. We sincerely know that our hard-working and dedicated employees are the important force for PCBWay’s continuous development. Therefore,our lovely employees will take 4-day paid leave for celebrating these two holidays.According to the actual production conditions of our factory, the holid...

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