Pattern Plating | Multi-layer PCB Manufacturing Process - 08

After developing, the copper thickness of the exposed circuits needs to be increased by a secondary copper plating, namely pattern plating. The purpose is to make the hole copper and surface copper of...

PCB PCB Manufacturing

Outer Layer | Multi-layer PCB Manufacturing Process - 07

In the previous steps, we have completed the creation of all the inner layer circuits and the required holes (Through/Buried/Blind holes). Next, we have to enter the outer layer imaging process of the...

PCB Manufacturing

PCB Plating Process | Multi-layer PCB Manufacturing Process - 06

The hole walls after drilling are composed of non-conductive epoxy resin and fiberglass board. In order to connect circuits between different layers, it is necessary to metalize the hole walls through...

PCB Manufacturing

Drilling | Multi-layer PCB Manufacturing Process - 05

To make the circuit of each layer connected, the boards need to go through the drilling process to make the corresponding holes according to the specifications in the drill files. For single and doubl...

PCB Manufacturing

Lamination | Multi-layer PCB Manufacturing Process - 04

Prior to lamination, the surface of inner image layer needs to go through an oxide process (brown oxide or black oxide treatment) to roughen and passivate the copper surface, increase the interaction ...

PCB Manufacturing

Inner Layer | Multi-layer PCB Manufacturing Process - 03

Surface Pre-TreatmentThe copper sheet after cutting has oxides, grease and other impurities attached to the surface, which firstly needs to be pretreated. The main purpose of pretreatment is to remove...

PCB Manufacturing

Board Cutting | Multi-layer PCB Manufacturing Process - 02

Planned FeedingAs PCB gets unavoidably scrapped in the actual production process, the factory needs to add an additional proportion of materials to ensure the required quantity of good boards. The add...

PCB Manufacturing

Pre-engineering | Multi-layer PCB Production Process 01

All PCB orders need to go through the engineering department before being scheduled for production. Now let's explore what the engineering department does to ensure the smooth production. Checkin...

PCB Manufacturing

回路基板の開発履歴について

プリント回路基板の設計の必要性に伴い、直接めっきプロセスは過去数年間継続的に開発されてきました。リード付きコンポーネントから表面実装コンポーネントまでの小型化によって推進され、PCB設計は、より多くのピンを備えた小型コンポーネントに適応するように進化しました。これにより、PCB層が増加し、回路基板が厚くなり、貫通穴が小さくなります。高アスペクト比の課題に対応するために、生産ラインの技術仕様には、超...

What is the Purpose of Plating Nickel on PCB?

The chemical element symbol of nickel is Ni. Because of its excellent physical, mechanical, and chemical properties, nickel has many applications in engineering and industry, such as anti-corrosion, i...

ENIG Nickel Plating IMC Passivation Matte Tin Surface Treatment OSP

Meet New Special PCB Technologies in PCBWay!

As a PCB innovation company, PCBWay is committed to solving the pain points of PCB procurement and meeting customers’ various PCB procurement needs — offering special plates such as Rogers, copper sub...

Impedance Control Thick Copper PCB Stack Up ENEPIG Gold Finger

What is PCB Tombstone?

IntroductionThe tombstone phenomenon is that during welding process of the MLCC and PCB, one end of the MLCC leaves the welding area and is inclined or standing upright. The main reason is the unbalan...

PCB Tombstone Solder Paste MLCC PCB Reflow Soldering

Corrosion Protection With Parylene

A natural process, corrosion enacts chemical/electrochemical reactions that degrade and gradually destroy materials or components within a functional environment. The outcome can be dangerous and...

Corrosion protection Parylene PCBs A-174 silane treatment CVD

Through-Hole Assembly

Through-hole technology (also spelled "thru-hole"), refers to the mounting scheme used for electronic components that involve the use of leads on the components that are inserted into holes drilled in...

thru-hole solder joint electronic components SMT technique

Top 10 Failure Analysis Techniques for PCB

As a carrier of various components and a hub for circuit signal transmission, PCB has become the most important and critical part of electronic information products. The quality and reliability of the...

X-ray fluoroscopy Slice analysis Scanning acoustic microscope

Important Processes of Rigid-Flex PCB Manufacturing

Introduction:Flexible printed circuit boards are used in a wide range of applications, almost all types of electronic products are involved, and the emergence of rigid-flex PCBs for the complex electr...

Rigid-Flex PCB,Drilling,Electroless Plating

Electrodeposition Photoresist --- A New Technology of HDI PCB Manufacturing

Introduction:With the rapid development of PCB, there are many challenges and much higher requirements of PCB, such as high density, high speed, miniaturization and so on, which makes the traditional ...

HDI PCB Electrodeposition Photoresist

Selection of Surface Treatment Process

The choice of surface treatment process depends mainly on the type of component that is finally assembled. And the surface treatment process will affect the production, assembly and end use of the PCB...

Surface Treatment Process HASL Immersion Gold

Common Surface Treatment Processes

Surface treatment purposeThe most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since copper in nature tends to exist in the form of oxides in the air, i...

Surface treatment

Development Trend of Rigid-Flex PCB Manufacturing Process Technology

Introduction:The manufacturing process of rigid-flex PCB is different due to the different types of substrates. The main processes that determine its performance are fine-line technology and microporo...

Rigid-Flex PCB Manufacturing Process Technology

1 2
Ranking Name Answers
1 Keser 1
2 PCBWay Support 1
Back to top