After developing, the copper thickness of the exposed circuits needs to be increased by a secondary copper plating, namely pattern plating. The purpose is to make the hole copper and surface copper of...
In the previous steps, we have completed the creation of all the inner layer circuits and the required holes (Through/Buried/Blind holes). Next, we have to enter the outer layer imaging process of the...
The hole walls after drilling are composed of non-conductive epoxy resin and fiberglass board. In order to connect circuits between different layers, it is necessary to metalize the hole walls through...
To make the circuit of each layer connected, the boards need to go through the drilling process to make the corresponding holes according to the specifications in the drill files. For single and doubl...
Prior to lamination, the surface of inner image layer needs to go through an oxide process (brown oxide or black oxide treatment) to roughen and passivate the copper surface, increase the interaction ...
Surface Pre-TreatmentThe copper sheet after cutting has oxides, grease and other impurities attached to the surface, which firstly needs to be pretreated. The main purpose of pretreatment is to remove...
Planned FeedingAs PCB gets unavoidably scrapped in the actual production process, the factory needs to add an additional proportion of materials to ensure the required quantity of good boards. The add...
All PCB orders need to go through the engineering department before being scheduled for production. Now let's explore what the engineering department does to ensure the smooth production. Checkin...
プリント回路基板の設計の必要性に伴い、直接めっきプロセスは過去数年間継続的に開発されてきました。リード付きコンポーネントから表面実装コンポーネントまでの小型化によって推進され、PCB設計は、より多くのピンを備えた小型コンポーネントに適応するように進化しました。これにより、PCB層が増加し、回路基板が厚くなり、貫通穴が小さくなります。高アスペクト比の課題に対応するために、生産ラインの技術仕様には、超...
The chemical element symbol of nickel is Ni. Because of its excellent physical, mechanical, and chemical properties, nickel has many applications in engineering and industry, such as anti-corrosion, i...
As a PCB innovation company, PCBWay is committed to solving the pain points of PCB procurement and meeting customers’ various PCB procurement needs — offering special plates such as Rogers, copper sub...
IntroductionThe tombstone phenomenon is that during welding process of the MLCC and PCB, one end of the MLCC leaves the welding area and is inclined or standing upright. The main reason is the unbalan...
A natural process, corrosion enacts chemical/electrochemical reactions that degrade and gradually destroy materials or components within a functional environment. The outcome can be dangerous and...
Through-hole technology (also spelled "thru-hole"), refers to the mounting scheme used for electronic components that involve the use of leads on the components that are inserted into holes drilled in...
As a carrier of various components and a hub for circuit signal transmission, PCB has become the most important and critical part of electronic information products. The quality and reliability of the...
Introduction:Flexible printed circuit boards are used in a wide range of applications, almost all types of electronic products are involved, and the emergence of rigid-flex PCBs for the complex electr...
Introduction:With the rapid development of PCB, there are many challenges and much higher requirements of PCB, such as high density, high speed, miniaturization and so on, which makes the traditional ...
The choice of surface treatment process depends mainly on the type of component that is finally assembled. And the surface treatment process will affect the production, assembly and end use of the PCB...
Surface treatment purposeThe most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since copper in nature tends to exist in the form of oxides in the air, i...
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