What is Multi-level /Step Stencil?Partial STEP-UP Stencil and partial STEP-DOWN Stencil are carried out on the steel sheet to make the same printing on the same stencil, so that different areas can obtain different thicknesses of solder paste. According to the performance of components, the size of connection end and the lands, it can accurately control the amount of solder paste which applied to the different components are accurately controlled to make the solder paste printing process efficie...
lesley
Jun 25,2019
124 views
Introduction of Application of Lead-free Surface Finish Techniques:Whether lead-free HASL can be popularized will depend on the results of the scientific study and its promotion and influence, but its smooth surface and high temperature process problems may be obstacles. OSP technology is widely used when a flatter surface is required, long shelf life is not required, and multiple heating applications are not required. OSP is likely to replace HASL technology in a large number of general applica...
PCBWay
Dec 24,2018
412 views
Background:PCB manufacturing is now a very developed high-tech industry, and the rapid development of silkscreen technology has injected new vitality into the industry, brought about major changes to the electronics industry, and it has become an indispensable part of various electronic equipment and instruments. The current screen printing technology has been able to adapt to the high density of PCB production.Youtube: https://www.youtube.com/watch?v=mwy9Kigv9MgMaterials:1) Stencil:Stencil ...
PCBWay
Dec 12,2018
446 views
Introduction:With the rapid development of PCB manufacturing technology, PCB cleaning technology must be constantly updated and developed. Various cleaning technologies emerge at the right moment have different advantages and disadvantages in the process of their use. This paper discusses the analysis and solutions of the problems that often occur in these PCB cleaning technologies.1. White Spots:One of the problems encountered after the formation of the cleaning process is that after the PCB...
PCBWay
Nov 16,2018
374 views
—A Method of Surface Finish TechnologiesBackground:In recent years, electronic products are developing towards light, thin, short, miniaturized and multi-functional. At the same time, PCB is also developing towards high precision, high speed, high density and so on. In particular, the rapid development of SMT makes the hot air leveling process increasingly unsuited to the requirements of PCB manufacturing process. Meanwhile, the welding material, such as Sn-Pb, used in the hot air leveling proce...
PCBWay
Sep 28,2018
1201 views
Background:At present, the environmental problems involved in PCB production are particularly prominent. Lead and bromine are the hottest topics at the moment; Lead-free and halogen-free will affect the development of PCB in many ways. Although changes in the surface treatment process of PCB are not significant at present and seem to be relatively distant, it should be noted that the slow change in the long term will lead to great changes. PCB surface treatment technology is bound to change dram...
PCBWay
Sep 26,2018
737 views
——Technical Analysis of Plating Copper for PCB ProcessingElectroless plating is widely used in the printed circuit board (PCB) production and processing which has holes on that and it can also be called PTH(Plate Through Hole), the main purpose is to deposit a layer of copper through a series of chemical treatment methods in the conductive substrate, and then increasing the thickness of the copper layer through subsequent electroplating methods to its specific thickness of design which is usuall...
PCBWay
Sep 14,2018
1398 views
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