What is a Via-in-Pad?As electronic products become increasingly miniaturized, multi-functional, and highly integrated, PCBs need to accommodate higher routing densities. To meet this demand, via-in-pa...
PCBWay
Feb 27,2023
6336 views
1. Determine the number of layers of the PCBBoard size and the number of routing layers need to be determined early in the design process. If the design requires the use of high-density ball grid arra...
lesley
Oct 24,2019
4681 views
Introduction:BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in the form of spherical solder joints, which can make the...
PCBWay
Jan 22,2019
8971 views
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 6 |
| 2 | sisma | 1 |
| 3 | Tormy Van Cool | 1 |
| 4 | Julian Phillips | 1 |
