Via-in-Pad Design | PCB Knowledge

What is a Via-in-Pad?As electronic products become increasingly miniaturized, multi-functional, and highly integrated, PCBs need to accommodate higher routing densities. To meet this demand, via-in-pa...

via-in-pad BGA

How to achieve PCB automatic routing efficiently?

1. Determine the number of layers of the PCBBoard size and the number of routing layers need to be determined early in the design process. If the design requires the use of high-density ball grid arra...

Automatic Routing BGA DFM

BGA Soldering Quality Detection Techniques by X-Ray Imaging

Introduction:BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in the form of spherical solder joints, which can make the...


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