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Edge plating

Reason of failed review: The pads are on the board edge, we couldn’t confirm if it needs to do the edge plating, if yes, which parts need to do?

Suggestion: If you need to do edge plating, pls choose it when you order online, also it is better that sign the edge plating position in your file, like the following pics shows

Last updated on 28/05/2019

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Spacing between silkscreen and openings
Silkscreen standard size
do not design texts on the copper layer
notes in the order are different from the designs in the files
the bottom silkscreen is mirrored
limited holes spacing
silkscreen over pads
the spacing from hole to trace
The requirement of beveling on gold finger area
The spacing from one hole to another is too narrow
the spacing requirement from hole to the edge of board
the spacing requirement from slot to copper trace
Spiral coil board
BGA pad opening
No Gold fingers design in file
UL Marking
The are some pads out of the board outline
Design has no silkscreen layer but online is yes with silkscreen
Some Issues concerning BGA(Ball Grid Array)

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Edge plating

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