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BGA pad opening

Reason of failed review:

The BGA pad opening is smaller than the copper layer pad, we need to confirm if it according to the copper layer pad to open or you need to revise the file.

Suggestion:

The solder mask pad opening needs to be larger than the copper layer pad 2—4mils.

Last updated on 28/05/2019

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Spacing between silkscreen and openings
Silkscreen standard size
do not design texts on the copper layer
notes in the order are different from the designs in the files
the bottom silkscreen is mirrored
limited holes spacing
silkscreen over pads
the spacing from hole to trace
The requirement of beveling on gold finger area
The spacing from one hole to another is too narrow
the spacing requirement from hole to the edge of board
Edge plating
the spacing requirement from slot to copper trace
Spiral coil board
No Gold fingers design in file
UL Marking
The are some pads out of the board outline
Design has no silkscreen layer but online is yes with silkscreen
Some Issues concerning BGA(Ball Grid Array)

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BGA pad opening

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