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Backdrill is the process of creating vias by removing the stub in multilayer_ed printed wiring boards, to allow signals to flow from one layer of the board to another. It is a special craftsmanship of control depth drilling.
l Reduce interference of other signal
l Improve signal integrity
l Reduce partial plate thickness
l Reduce the use of blind and buried vias to reduce the difficulty of PCB fabrication
n Mostly are rigid boards on back
n Normally used on 8 layers or above
n Board thickness is over 2.5mm
n Minimum hold size is 0.3mm
n Backdrill is 0.2mm larger than the vias
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