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PCB Backdrill

Backdrill is the process of creating vias by removing the stub in multilayer_ed printed wiring boards, to allow signals to flow from one layer of the board to another. It is a special craftsmanship of control depth drilling.

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Advantages:

l  Reduce interference of other signal

l  Improve signal integrity

l  Reduce partial plate thickness

l  Reduce the use of blind and buried vias to reduce the difficulty of PCB fabrication

 

General Characteristics

n  Mostly are rigid boards on back

n  Normally used on 8 layers or above

n  Board thickness is over 2.5mm

n  Minimum hold size is 0.3mm

n  Backdrill is 0.2mm larger than the vias

n  Tolerance of backdrill depth+/-0.05MM

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