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Good news that orders for PCB, SMT and Stencil with all parameter's options are acceptable now. But due to the backlog of orders in the factory, the lead time is still longer than usual. Please notice the extended lead time before order. Learn more details and real-time update >>

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PCB Backdrill

Backdrill is the process of creating vias by removing the stub in multilayered printed wiring boards, to allow signals to flow from one layer of the board to another. It is a special craftsmanship of control depth drilling.



l  Reduce interference of other signal

l  Improve signal integrity

l  Reduce partial plate thickness

l  Reduce the use of blind and buried vias to reduce the difficulty of PCB fabrication


General Characteristics

n  Mostly are rigid boards on back

n  Normally used on 8 layers or above

n  Board thickness is over 2.5mm

n  Minimum hold size is 0.3mm

n  Backdrill is 0.2mm larger than the vias

n  Tolerance of backdrill depth+/-0.05MM

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