Dear Customer,
Our factory has resumed production since February 10,2020. But only part of production was resumed. PCB prototype(<=100pcs) and small-batch(Within 1m2) production is now only supporting Green Solder Mask,and HASL with lead, HASL lead free, Immersion gold(ENIG) Surface treatment. Batch production is available for all colors. Learn more resuming operations details and update >>

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PCB Via Covering

Vias not covered

It means that the vias are exposed and the surface finish is applied to via barrel.

The solder paste might get into the vias and cause poor or non-existent solder joints.

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Tenting vias

It means that the vias are simply covering by soldermask ink.No additional process steps is required during fabrication.

Covering the annular ring and vias with soldermask ink in order to prevent exposure to the elements and reduce accidental shorting or contact with the circuit.

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Plugged Vias with non conductive media (eg. Epoxy/resin, soldermask ink)

The conductive vias in BGA requires plugged vias. Because solder paste might wick away from the intended pad and flow down into the via, then creating poor or non-existent solder joints during assembly.

The diameter of the plugged vias requires to be smaller than 0.5mm.

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