PCB Prototype the Easy Way

Full feature custom PCB prototype service.

PCBWay PCB Capabilities

PCBWay has prototype PCB,PCB Production fabrication and pcb assembly capabilities.

We Offer a Full Range of Printed Circuit Board Capabilities to Fit All of Your PCB Needs

PCBWay is a professional quick turn PCB prototyping,PCB Assembly and low-volume production manufacturer located in Shenzhen China.(3 major PCBs and 2 PCB Assembly production).

The information below details some of the key capabilities that PCBWay can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.

The first category is what we call "Quick-turn" and means we can offer Small Quantity - Quick Turn PCBs, Custom Spec - Quick Turn PCBs.

The second is our “Standard” offering and this shows the very best that PCBWay can offer:Full Spec PCBs, Highly Specialized Precision PCBs, & Large Scale Production,but sometimes some plates and materials are temporarily out of stock.

Please send messages to your sales rep if your boards are beyond the capabilities listed below.


PCB Capabilities - Quick-turn PCB

Items Manufacturing Capabilities Remarks
Number of Layers - 1-10 layers For orders above 10 layers,please view the below "Standard PCB" or contact our sales rep.
Material -
FR-4,Aluminum
For Flex, Rigid-flex, Metal-based (Aluminum etc.,), HDI, Halogen-free, High Tg, etc.,please view the below "Standard PCB" or contact sales rep.
Maximum PCB Size(Dimension) - 500*1100mm (min 5*6mm) Any sizes beyond this dimension, please view the below "Standard PCB" or contact sales rep.
Board Size Tolerance(Outline) - ±0.2mm/±0.5mm ±0.2mm for CNC routing, and ±0.5mm for V-scoring.
Board Thickness board thickness 0.2-2.4mm 0.2,0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4mm. Please view the below "Standard PCB" or contact us if your board exceeds these.
Board Thickness Tolerance(t≥1.0mm) - ±10% Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface.
Board Thickness Tolerance(t<1.0mm) - ±0.1mm
Min Trace Min Trace Min Spacing 0.1mm/4mil Min manufacturable trace is 4mil(0.1mm), strongly suggest to design trace above 6mil(0.15mm) to save cost.
Min Spacing Min manufacturable spacing is 4mil(0.1mm), strongly suggest to design spacing above 6mil(0.15mm) to save cost.
Outer Layer Copper Thickness Outer Layer Copper Thickness 1oz/2oz/3oz(35μm/70μm/105μm) Also known as copper weight. 35μm=1oz, 70μm=2oz, 105μm=3oz. Please view the below "Standard PCB" or contact us if you need copper weight greater than 3oz.
Inner Layer Copper Thickness Inner Layer Copper Thickness 1oz/1.5oz(35μm/50μm) Inner copper weight as per customer’s request for 4 and 6 layers(Multi-layer laminated structure). Please contact us if you need copper weight greater than 1.5oz.
Drill Sizes (CNC) drill Sizes (CNC) 0.2-6.3mm Min drill size is 0.2mm, max drill is 6.3mm. Any holes greater than 6.3mm or smaller than 0.3mm will be subject to extra charges.
Min Width of Annular Ring Min Width of Annular Ring 0.15mm(6mil) For pads with vias in the middle, Min width for Annular Ring is 0.15mm(6mil).
Finished Hole Diameter (CNC) Finished Hole Diameter (CNC) 0.2mm-6.2mm The finished hole diameter will be smaller than size of drill bits because of copper plating in the hole barrels
Finished Hole Size Tolerance(CNC) - ±0.08mm For example, if the drill size is 0.6mm, the finished hole diameter ranges from 0.52mm to 0.68mm will be considered acceptable.
Solder Mask PCB Solder Mask LPI Liquid Photo-Imageable is the mostly adopted. Thermosetting Ink is used in the inexpensive paper-based boards.
Minimum Character Width(Legend) PCB Silkscreen 0.15mm Characters of less than 0.15mm wide will be too narrow to be identifiable.
Minimum Character Height (Legend) - 0.8mm Characters of less than 0.8mm high will be too small to be recognizable.
Character Width to Height Ratio (Legend) - 1:5 In PCB silkscreen legends processing, 1:5 is the most suitable  ratio
Minimum Diameter of Plated Half Holes - 0.6mm Design Half-Holes greater than 0.6mm to ensure better connection between boards.
Surface Finishing Surface Finishing HASL with lead
HASL lead free
Immersion gold,OSP
The most popular three types of PCB surface finish. Please view the below "Standard PCB" or contact us for other finishes.
Solder Mask Solder Mask Green ,Red, Yellow, Blue, White ,Black

No extra charge (Green, Red, Yellow, Blue)

Silkscreen PCB Silkscreen White, Black, None

No extra charge.

Panelization V-scoring V-scoring,
Tab-routing,
Tab-routing with Perforation (Stamp Holes)

Leave min clearance of 1.6mm between boards for break-routing. For V-score panelization, set the space between boards to be zero.

Others - Fly Probe Testing (Free) and A.O.I. testing(free), ISO 9001:2008 ,UL Certificate

No extra charge.

Standard PCB Capabilities - Standard PCB

Categories No. Items PCB process parameters Remarks
Normal process Medium difficulty High difficulty
Non-standard review Unable to make
product type 1 Multilayer PCB Layers 3L≤Layers≤16L 18L≤Layers≤24L ≥24L
2 Blind and Buried Vias HDI(1+1+....+N+......+1+1) Anylayer HDI HDI(2+...+N...+2) If meet the requirements of 2, 6, and 19 at the same time, it is classified as a high requirement product (thickness to diameter ratio, copper thickness of hole)
3 Surface Coating HASL(+gold finger),immersion gold, Immersion Gold +gold fingers with hard gold,OSP (+gold finger with hard gold), Immersion Tin (+gold finger with hard gold) (Not two different surface finish),Immersion Tin Local immersion gold (long or short gold fingers, segmented gold finger craft) Exceed this range require unconventional production processes Partial immersion gold, thickness of gold or nickel reference to the thickness of the coating
4 Board Material FR-4;aluminum,Rogers4 series + FR-4 mixed(The Prepreg is ShengYi brand and ROGERS4403 series);CEM-3、LianMao IT158/IT180A Pure ROGERS4 series multi-layer board (Prepreg is 4450F),PTFE、aluminum+FR4、PTFE+FR4 Exceed this range require unconventional production processes Pure PTFE multi-layer board Pure PTFE can’t be made because the lamination temperature isn’t up to standard,Can‘t laminate Rogers copper foil directly
Drills 5 Drill diameter Nc drill 0.20mm≤Drill diameter≤6.5mm More than 6.0mm using CNC milling
hole diameter 0.2mm: maximum board thickness 1.6mm
hole diameter diameter 0.25mm:maximum board thickness 2.0mm,
hole diameter 0.3mm≤Ф≤0.35mm, maximum board thickness 3.2 mm,
hole diameter 0.4mm≤Ф≤0.55mm, maximum board thickness 4.8 mm,
hole diameter>0.55mm maximum board thickness 6.4 mm
6.5mm or more ±0.1mm ≤ hole diameter tolerance (using CNC milling for 6.5mm or more) The drill diameter more than 6.0mm, the hole diameter tolerance less than ±0.1mm. If exceed this range require unconventional production processes Drill diameter below 0.2mm, and the aspect ratio≥10, which is medium difficulty
6 Thickness to diameter ratio Thickness to diameter ratio≤8 8 10 Thickness to diameter ratio greater than 12 when the aperture cannot be compensated If need to meet the requirement of 2, 6, and 19, it will be treat as high requirement product.
7 countersink hole diameter 3.0mm≤hole diameter≤6.5mm Unconventional production beyond this range Countersink depth tolerance is controlled 0.15mm
Angle 90° Unconventional production beyond this range
8 Hole position tolerances ±0.075mm ±0.05mm <+ />-0.05mm
9 hole diameter tolerance PTH ±0.075mm or no customer requirements ±0.05≤ hole diameter tolerance <±0.75mm <±0.05mm <+ />-0.05mm Metallized hole diameter tolerance of 6.0mm or more refers to the requirement of serial number 5
NPTH ≥±0.075mm <±0.05mm <+ />-0.025mm
Special hole pressfit ≤±0.05 \ \
non-plated Countersink/Counterbore holes(NPTH) hole diameter <10mm:tolerance ±0.15mm,hole=±0.15mm,hole diameter=diameter ≥10mm:tolerance=≥10mm:tolerance ±=± 0.20mm=0.20mm \ \
non-plated Countersink/Counterbore holes(NPTH) hole diameter <10mm:tolerance ±0.2mm=±0.2mm
hole diameter ≥10mm:tolerance+0.3mm
\ \
10 Hole to hole spacing component hole ≥10MIL 8≤Hole to hole spacing≤10 7≤Hole to hole spacing≤8 <7mil
via(≤0.45mm) ≥8MIL
11 slot hole slot hole size ≥0.6mm \ \ More than 1.0mm, can be slot by machine
Length to width ratio of slot hole Length to width≥2 Length to width<2
12 Castellated Holes Castellated Holes diameter ≥0.5mm 0.5mm>diameter≥0.4mm \
Castellated Holes spacing (edge to edge) ≥0.3mm 0.3mm>diameters≥0.2mm \
13 Minimum isolation ring of Inner layer,
The distance between minimum hole in Inner layer and circuit (before compensation)
4L ≥7MIL 6MIL≤isolation ring, distance<7mil 5MIL≤isolation ring, distance<6mil If the size of one side is greater than 600MM, the inner hole to line and the hole to copper spacing must be greater than or equal to 15mil. If less than 15mil, it must be treated as unconventional review. The conventional process of 10 layers or more need to be incremented by 1 mil for each additional 2 layers. Change the isolation ring to 12mil or more as much as possible
6L ≥8MIL 6.5MIL≤isolation ring, distance<8mil 6MIL≤isolation ring, distance<6.5mil
8L ≥9MIL 7MIL≤isolation ring, distance<9mil 6MIL≤isolation ring, distance<7mil
≥10L ≥10MIL 8MIL≤isolation ring, distance<10mil<9MIL 7MIL≤isolation ring, distance<8mil
image transfer 14 The min width/spacing of inner layer (before compensation) cooper thickness 18um ≥4/4 mil ≥4/3.5 mil <3.5 />3 mil width/spacing
cooper thickness 35um ≥4/5 mil ≥4/4 mil <3.5 />4 mil width/spacing
cooper thickness 70um ≥6/8mil ≥6/7mil <5 />6 mil width/spacing
cooper thickness 105um ≥8/11 mil ≥8/10 mil <6 />9 mil width/spacing
15 The min width/spacing of outer layer (before compensation) cooper thickness 18um ≥4/5 mil ≥4/4 mil or parts 3.5/3.5mil <3.5 />3.5 mil Local 3.5/3.5mil, only the distance from the GBA chip area line to the PAD
cooper thickness 35um ≥5/6 mil ≥5/5 mil <4 />4 mil
cooper thickness 70um ≥7/8mil ≥6/7mil <5 />6 mil
cooper thickness 105um ≥10/12 mil ≥8/10 mil <6 />9 mil
16 grid trace width/spacing cooper thickness 18um ≥7/9 mil ≥6/8 mil <6 />7 mil
cooper thickness 35um ≥9/11 mil ≥8/10 mil <8 />9 mil
cooper thickness 70um ≥11/13mil ≥10/12mil <10 />11 mil
cooper thickness 105um ≥13/15 mil ≥12/14 mil <12 />13 mil
17 Minimum weld ring (outer layer) cooper thickness 18um via hole ≥5mil ≥4mil <3 mil=mil
component hole ≥8mil ≥6mil <6 mil=mil
cooper thickness 35um via hole ≥5mil ≥4mil <3 mil=mil
component hole ≥10mil ≥8mil <8 mil=mil
cooper thickness 70um via hole ≥7mil ≥6mil <5 mil=mil
component hole ≥12mil ≥10mil <10 mil=mil
cooper thickness 105um via hole ≥8mil ≥6mil <6 mil=mil
component hole ≥14mil ≥12mil <12 mil=mil
18 width tolerance width tolerance:≥±20% ±10%≤ width tolerance:<±20% <±10% spacing must meet the requirements of 11 and 12, lf width is greater than 15mil, controlled by ±2.5mil
BGA pad diameter hot air leveling (original) ≥12MIL ≥10MIL <8mil
immersion gold (original) diameter≥11mil 8.0mil≤diameter<11.0mil <6mil
19 Line to board edge distance CNC milling 0.25mm 0.20mm <0.20mm
SMT width ≥12mil ≥9mil <9mil以下 <7mil,except the=the binding=binding board=board
Metal plating 20 Plating Thickness Electroless Nickel-Immersion Gold,ENIG Nickel thickness 100-150 200
gold thickness 1-8 >8
Full board gold plating Nickel thickness 100-150 200 Order center check the final price
gold thickness 1-10 10-50 >50
gold finger Nickel thickness 120-150 200
gold thickness 1-30 30-50 >50
21 Hole copper thickness (um) Through hole 18-25 30-50 >50 If 2,6,19 is required to exist at the same time, it will be treated as high requirement. The thickness of the copper is 25-50UM, and the thickness of the copper is required to be 2-3OZ generally.
Blind hole (mechanical hole) 18-25 30-50 >50
Buried hole 15-25 30-50 >50
22 Bottom copper thickness Inner and outer copper thickness (OZ) 0.5-4 4-6 >6
solder mask 23 solder mask green solder mask opening(mil) ≥2mil 1.5 1 1mil is only concentrated in the BGA area. If the window can be enlarged, increase it as much as possible, but the maximum is 3mil
green solder mask Bridge(mil) cooper thicknesss<2oz 4(spacing between ICs is 8 mil, green oil),variegated or black oil≥4.5mil 3-4(spacing between ICs is 7-8 mil, green oil),variegated or black oil≥4mil
cooper thicknesss≥2OZ 5 4
Plug Hole diameter 0.20mm≤hole diameter≤0.40mm,plug hole fullness 70% 0.4mm< hole diameter ≤0.70mm fullness 100%
Plug Hole board thickness 0.40mm≤board thickness≤2.4mm >2.4MM
24 solder mask solder mask color Green, matt green, blue, red, black, matte black, white, yellow \ \ Special colors need to be purchased or deployed in advance
silkscreen 25 Etched silkscreen (finished copper thickness) Copper thickness 18um word width/word height 8MIL/40MIL 7MIL/35MIL
Copper thickness 35um word width/word height 9MIL/40MIL 8MIL/35MIL
Copper thickness 75um word width/word height 12MIL/60MIL 10MIL/50MIL
Copper thickness 105um word width/word height 16MIL/60MIL 14MIL/50MIL
outline 26 Maximum board thickness Double PCB 3.2MM 4.5MM >4.5MM calculated by 4 layers if the thickness more than 3mm
Multilayer layer board 3.2MM 4.5MM >4.5MM
27 Minimum board thickness (single and double panel refers to substrate thickness) Single or Double side PCB (pcb prototype) ≥0.3mm 0.25mm
4L ≥0.60mm 0.40mm <0.40mm
6L ≥0.9mm 0.70mm <0.70mm
8L ≥1.20mm 1.00mm <1.00mm
10L ≥1.40mm 1.20mm <1.20mm
12L ≥1.70mm 1.50mm <1.50mm
14L ≥2.00mm 1.80mm <1.80mm
28 thickness (T) tolerance MM (multilayer layer pcb) T≤1.0 ±0.10 Need to review if less than the tolerance If the tolerance is unilateral tolerance, the tolerance shall be double tolerance value, such as: 1.8mm requires positive tolerance, the tolerance shall be 0-0.36mm
1.0 ±0.13
1.6 ±0.18
2.5 ±0.23
T≥3.2 ±8%
29 Maximum finished board size Single and double side PCB 508×610mm Beyond this range needs to be reviewed
Multilayer Layer PCB 508×600mm
30 Minimum finished pcb size ≥20mm 10mm≤Size<20mm <10mm
31 Beveling for gold finger Bevel angle 20°30°45°60° <20°or>60°
Bevel angle tolerance >±5° ±5° <±5°
Bevel depth tolerance tolerance≥±0.15mm ±0.15mm< Tolerance ≤ ±0.1mm tolerance<±0.10mm
32 Shape tolerance tolerance≥±0.15mm ±0.10mm≤tolerance<±0.15mm Tolerance<±0.10mm or=or more=more than=than two=two form=form form=form form=form form=form form=form form=form form=form form=form tolerance=tolerance control=control
33 V-CUT Angle 20°30°45°60°
The Maximum number of V-CUT In 20 times In 30 times In 40 times
Width of the shape 80MM< width <560mm 60MM< width <80mm width <60mm
board thickness 0.6MM≦thickness≦2.4MM 0.5MM≦thickness<0.6mm thickness<0.5mm or=or thickness=thickness>2.4MM below 0.5mm is single-sided V-CUT
Remaining thickness ≥0.25MM <0.25mm
V-CUT Conventional V-CUTT、V-CUT: Skip V-CUT \ \
others 34 panel size The minimum panel size ≥100*120mm \ <100*120mm The thickness of the finished board is less than 0.4MM, the panel size can’t exceed 14inch, and the maximum size of the HASL PCB can’t exceed 24inch
the Maximum panel size ≤20*24 inch \ Need to review if beyond range
35 impedance control Impedance control tolerance ±10%,50Ω and below:±5Ω \ <±10%,50ω and=and below=below <±5Ω
bow and twist bow and twist tolerance bow and twist≥0.75% 0.75%≤bow and twist≤0.5% bow and twist<0.5% asymmetry boards bow and twist tolerance 1.2%
36 HASL processing capacity component hole diameter hole diameter>0.5mm 0.4mm≤hole diameter≤0.5mm
board thickness 0.5mm≤board thickness≤3.5mm 0.4mm≤board thickness<0.5mm
thickness 2um≤thickness of Tin≤30um \ \
37 Acceptance Criteria IPC standard IPC2 level standard IPC Level 3 standard

Upload PCB files( gerber file, .pcb, .pcbdoc or .cam file format)

Thanks for reviewing our PCB capabilities. Please upload your PCB files in the format of gerber file, .pcb, .pcbdoc or .cam file when you go through our online purchase procedures. Please try best to offer gerber file. But if you only have DXP file with (.pcb/.pcbdoc) format, we will use ALtium Designer10.0 software to transfer to gerber.So please avoid higher version than AD10.0 .You can also send your Gerber to your sales rep, but we strongly suggest you order online on the webpages.


Making a PCB - PCB Manufacture step by step

Click the icon to view the details

Our Customers

Military Military and aerospace: We have large customer base in these industries. Customers choose us to make their PCBs in the prototype and production stage.

MedicineMedicine: Medicine and biomedical clients occupy a large part of our customers. We have strict quality standard and short lead time and our price is competitive, our customer base in this area is still on the rise.

Commercial Commercial, industrial and automotive: Most of our customers are in these industries. Fast response, short delivery time, professional engineering support continuously affordable price help retain and expand customer scale in these industries.

school University, school and amateur: Students are our future scientists, we support them! Students and amateurs are price sensitive customers, our price guarantees they will rely on us for their PCB needs in terms of price and quality! At the same time, our educational sponsorship program provides free PCBs to university students, please send us the details of your project or competition at service@pcbway.com.

Contact Us!

Our customer service
ready for your PCB

+86-571-85317532

quotesI am impressed with the quality of the boards, the delivery time and responce to all my questions. Best price excellent service and speedy delivery. When I need another board I will certainly use this supplier. "

-Bill Robinson Company

quotesспасибо за платы! платы очень хорошего качества. надежный продавец. оперативно отвечал на вопросы. заказ выполнили и отправили очень быстро.Заказываю платы не в первый раз - как всегда только лучшие впечатления. 5+++. 4 числа отправил файлы 26-го забрал на почте в Москве."

-FVL. SKU Company
Front-end data preparation

01.PPE - Pre Production Engineering

Customer supplied data (gerber) is used to produce the manufacturing data for the specific PCB (artworks for imaging processes and drill data for drilling programs). Engineers compare demands/specifications against capabilities to ensure compliance and also determine the process steps and associated checks. No changes are allowed without PCBWay Group permission.

Preparing

02.Preparing the phototools

Artwork Master is PCB production in the key steps, which directly affect the quality of the final product quality,An accurately scaled configuration of electronic data used to produce the artwork master or production master. Artwork Master – The photographic image of the PCB pattern on film used to produce the circuit board, usually on a 1:1 scale.In general, there are three types of Artwork Master:(1) Conductive Pattern (2) solder mask (3) Silkscreen

print icon

03.Print inner layers

Stage 1 is to transfer the image using an artwork film to the board surface, using photosensitive dry-film and UV light, which will polymerise the dry film exposed by the artwork. This step of the process is performed in a clean room.
Imaging – The process of transferring electronic data to the photo-plotter, which in turn uses light to transfer a negative image circuitry pattern onto the panel or film.

etch icon

04.Etch inner layers

Stage 2 is to remove the unwanted copper from the panel using etching. Once this copper has been removed, the remaining dry film is then removed leaving behind the copper circuitry that matches the design.
Etching – The chemical, or chemical and electrolytic, removal of unwanted portions of conductive or resistive material.

aoi icon

05.Inner layer Automatic Optical Inspection(AOI)

Inspection of the circuitry against digital “images” to verify that the circuitry matches the design and that it is free from defects. Achieved through scanning of the board and then trained inspectors will verify any anomalies that the scanning process has highlighted. PCBWay Group allows no repair of open circuits.

Lamination icon

06.Lay-up and bond (Lamination)

The inner layers have an oxide layer applied and then “stacked” together with pre-preg providing insulation between layers and copper foil is added to the top and bottom of the stack. The lamination process consists of placing the internal layers under extreme temperature (375 degrees Fahrenheit) and pressure (275 to 400 psi) while laminating with a photosensitive dry resist. The PCB is allowed to cure at a high temperature, the pressure is slowly released and then the material is slowly cooled.

drilling icon

07.Drilling the PCB

We now have to drill the holes that will subsequently create electrical connections within the multilayer PCB. This is a mechanical drilling process that must be optimised so that we can achieve registration to all of the the inner layer connections. The panels can be stacked at this process. The drilling can also be done by a laser drill

copper icon

08.Electroless copper deposition

The first step in the plating process is the chemical deposition of a very thin layer of copper on the hole walls.
PTH provides a very thin deposit of copper that covers the hole wall and the complete panel. A complex chemical process that must be strictly controlled to allow a reliable deposit of copper to be plated even onto the non-metallic hole wall. Whilst not a sufficient amount of copper on its own, we now have electrical continuity between layers and through the holes.Panel plating follows on from PTH to provide a thicker deposit of copper on top of the PTH deposit – typically 5 to 8 um. The combination is used to optimise the amount of copper that is to be plated and etched in order to achieve the track and gap demands.

image icon

09.Image the outer layers

Similar to the inner layer process (image transfer using photosensitive dry film, exposure to UV light and etching), but with one main difference – we will remove the dry film where we want to keep the copper/define circuitry – so we can plate additional copper later in the process.
This step of the process is performed in a clean room.

Plating icon

10.Plating

Second electrolytic plating stage, where the additional plating is deposited in areas without dry film (circuitry). Once the copper has been plated, tin is applied to protect the plated copper.

etch icon

11.Etch outer layer

This is normally a three step process. The first step is to remove the blue dry film. The second step is to etch away the exposed/unwanted copper whilst the tin deposit acts an etch resist protecting the copper we need. The third and final step is to chemically remove the tin deposit leaving the circuitry.

AOI

12.Outer layer AOI

Just like with inner layer AOI the imaged and etched panel is scanned to make sure that the circuitry meets design and that it is free from defects. Again no repair of open circuits are allowed under PCBWay demands.

Soldermask

13.Soldermask

Soldermask ink is applied over the whole PCB surface. Using artworks and UV light we expose certain areas to the UV and those areas not exposed are removed during the chemical development process – typically the areas which are to be used as solderable surfaces. The remaining soldermask is then fully cured making it a resilient finish.
This step of the process is performed in a clean room.

Surface finish

14.Surface finish

Various finishes are then applied to the exposed copper areas. This is to enable protection of the surface and good solderability. The various finishes can include Electroless Nickel Immersion Gold, HASL, Immersion Silver etc. Thicknesses and solderability tests are always carried out.

Profile

15.Profile

This is the process of cutting the manufac-turing panels into specific sizes and shapes based upon the customer design as defined within the gerber data. There are 3 main options available when providing the array or selling panel – scoring, routing or punching. All dimensions are measured against the customer supplied drawing to ensure the panel is dimensionally correct.

Electrical test

16.Electrical test

Used for checking the integrity of the tracks and the through hole interconnections – checking to ensure there are no open circuits or no short circuits on the finished board. There are two test methods, flying probe for smaller volumes and fixture based for volumes.We electrically test every multilayer PCB against the original board data. Using a flying probe tester we check each net to ensure that it is complete (no open circuits) and does not short to any other net.

inspection

17.Final inspection

In the last step of the process a team of sharp-eyed inspectors give each PCB a final careful check-over.Visual checking the PCB against acceptance criteria and using PCBWay “approved” inspectors. Using manual visual inspection and AVI – compares PCB to gerber and has a faster checking speed that human eyes, but still requires human verification. All orders are also subjected to a full inspection including dimensional, solderability, etc.

Packaging

18.Packaging

Boards are wrapped using materials that comply with the PCBWay Packaging demands (ESD etcetera) and then boxed prior to be being shipped using the requested mode of transport.