PCBWay Multi-layer laminated structure

4-layer PCB standard stackup

Thickness Copper thick Laminated chart
1.6mm±10% 1oz 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.13 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
1.2mm±10% 1oz 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.73 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
1.0mm±0.1mm 1oz 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.175 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.53 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
0.8mm±0.1mm 1oz 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.175 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.33 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
0.6mm±0.1mm 1oz 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.175 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.17 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
2.0mm±10% 1oz 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.175 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.53 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
2.4mm±10% 1oz 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.175 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 1.93 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
0.8mm±0.1mm inner 1.5OZ 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.22 mm dielectric constant 4.29
Copper 2 53 um
Dielectric 2-3 0.094 mm dielectric constant 3.96
Copper 3 53 um
Dielectric 3-4 0.22 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
1.0mm±0.1mm inner 1.5OZ 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.22 mm dielectric constant 4.29
Copper 2 53 um
Dielectric 2-3 0.294 mm dielectric constant 3.96
Copper 3 53 um
Dielectric 3-4 0.22 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
1.2mm±10% inner 1.5OZ 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.22 mm dielectric constant 4.29
Copper 2 53 um
Dielectric 2-3 0.494 mm dielectric constant 3.96
Copper 3 53 um
Dielectric 3-4 0.22 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
1.6mm±10% inner 1.5OZ 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.22 mm dielectric constant 4.29
Copper 2 53 um
Dielectric 2-3 0.894 mm dielectric constant 3.96
Copper 3 53 um
Dielectric 3-4 0.22 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
2.0mm±10% inner 1.5OZ 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.22 mm dielectric constant 4.29
Copper 2 53 um
Dielectric 2-3 1.494 mm dielectric constant 3.96
Copper 3 53 um
Dielectric 3-4 0.22 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
2.4mm±10% inner 1.5OZ 4-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.36 mm dielectric constant 4.29
Copper 2 53 um
Dielectric 2-3 1.494 mm dielectric constant 3.96
Copper 3 53 um
Dielectric 3-4 0.36 mm dielectric constant 4.29
Copper 4 18 um--plating to 35um
Instrution:
1. Above stackup lists are our common factory’s standard stackup of 4-layer PCB.If you have the sepecial request,pls choose the "Custom Stackup" when placing orders.
2. When copper thickness increases, the dielectric layer will be reduced correspondingly.
3. The outer copper thickness can do 1OZ/2OZ,above stackup is for 1OZ.If the request is for 2OZ,we will use 1.5OZ or 2OZ base copper foil,and plate to 2OZ.
4. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager!

6-layer PCB standard stackup

Thickness Copper thick Laminated chart
1.6mm±10% 1oz 6-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.53 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.53 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.11 mm dielectric constant 4.29
Copper 6 18 um--plating to 35um
1.2mm±10% 1oz 6-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.33 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.33 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.11 mm dielectric constant 4.29
Copper 6 18 um--plating to 35um
1.0mm±0.1mm 1oz 6-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.175 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.13 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.13 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.175 mm dielectric constant 4.29
Copper 6 18 um--plating to 35um
0.8mm±0.1mm 1oz 6-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.13 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.13 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.11 mm dielectric constant 4.29
Copper 6 18 um--plating to 35um
2.0mm±10% 1oz 6-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.73 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.73 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.11 mm dielectric constant 4.29
Copper 6 18 um--plating to 35um
2.4mm±10% 1oz 6-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.93 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.93 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.11 mm dielectric constant 4.29
Copper 6 18 um--plating to 35um
Instrution:
1. Above stackup lists are our common factory’s standard stackup of 6-layer PCB.If you have the sepecial request,pls choose the "Custom Stackup" when placing orders.
2. When copper thickness increases, the dielectric layer will be reduced correspondingly.
3. The outer copper thickness can do 1OZ/2OZ,above stackup is for 1OZ.If the request is for 2OZ,we will use 1.5OZ or 2OZ base copper foil,and plate to 2OZ.
4. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager!

8-layer PCB standard stackup

Thickness Copper thick Laminated chart
1.6mm±10% 1oz 8-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.175 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.13 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.13 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.175 mm dielectric constant 4.29
Copper 6 35 um
Dielectric 6-7 0.13 mm dielectric constant 3.96
Copper 7 35 um
Dielectric 7-8 0.175 mm dielectric constant 4.29
Copper 8 18 um--plating to 35um
1.2mm±10% 1oz 8-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.13 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.13 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.11 mm dielectric constant 4.29
Copper 6 35 um
Dielectric 6-7 0.13 mm dielectric constant 3.96
Copper 7 35 um
Dielectric 7-8 0.11 mm dielectric constant 4.29
Copper 8 18 um--plating to 35um
2.0mm±10% 1oz 8-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.175 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.33 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.175 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.33 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.175 mm dielectric constant 4.29
Copper 6 35 um
Dielectric 6-7 0.33 mm dielectric constant 3.96
Copper 7 35 um
Dielectric 7-8 0.175 mm dielectric constant 4.29
Copper 8 18 um--plating to 35um
2.4mm±10% 1oz 8-layer PCB standard stackup
Copper 1 18 um--plating to 35um
Dielectric 1-2 0.11 mm dielectric constant 4.29
Copper 2 35 um
Dielectric 2-3 0.53 mm dielectric constant 3.96
Copper 3 35 um
Dielectric 3-4 0.11 mm dielectric constant 4.29
Copper 4 35 um
Dielectric 4-5 0.53 mm dielectric constant 3.96
Copper 5 35 um
Dielectric 5-6 0.11 mm dielectric constant 4.29
Copper 35 um
Dielectric 6-7 0.53 mm dielectric constant 3.96
Copper 7 35 um
Dielectric 7-8 0.11 mm dielectric constant 4.29
Copper 8 18 um--plating to 35um
Instruction:
1. Above stackup lists are our common factory’s standard stackup of 8-layer PCB.If you have the sepecial request,pls choose the "Custom Stackup" when placing orders.
2. When copper thickness increases, the dielectric layer will be reduced correspondingly.
3. The outer copper thickness can do 1OZ/2OZ,above stackup is for 1OZ.If the request is for 2OZ,we will use 1.5OZ or 2OZ base copper foil,and plate to 2OZ.
4. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager!

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