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silkscreen size and spacing in solder mask layer

Reason of failed review:

The lengends in solder mask layer is required to be min 1.2mm at height,and 0.2mm at width.And the min spacing between lengends should be 0.2mm at least.

Suggestion:

It’s advised to measure the size and spacing when you upload the gerber file for review,and you can ask your sales rep to help you confirm if you have issue in checking this information.

If you have any question with ordering, feel free to contact us.

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The parameters in gerber files are different from the order details online.
Some Issues concerning BGA(Ball Grid Array)
Design has no silkscreen layer but online is yes with silkscreen
The are some pads out of the board outline
UL Marking
No Gold fingers design in file
BGA pad opening
Spiral coil board
the spacing requirement from slot to copper trace
Edge plating
the spacing requirement from hole to the edge of board
The spacing from one hole to another is too narrow
The requirement of beveling on gold finger area
the spacing from hole to trace
limited holes spacing
the bottom silkscreen is mirrored
notes in the order are different from the designs in the files
do not design texts on the copper layer
Silkscreen standard size

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silkscreen size and spacing in solder mask layer

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