Design issue caused poor soldering

Question: Below design caused cold joint at the pads which are connecting to the center big pad.

Red stands for soldermask layer, Blue is for copper layer.

Answer: Better to have soldermask ink between those GND pads and the center pad to avoid solder paste on GND pads to be pulled away.

图片4.png

Correct design: Red stands for soldermask layer, Blue is for copper layer, ref below picture.

图片5.png

The question of component dimension is bigger than the land pattern in the design.
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The question for pin pitch
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Design issue caused poor soldering

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