4th-order HDI buried/blind via board

PCB Products / HDI PCB / 4th-order HDI buried/blind via board

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Applications

Semiconductor test

Features

Material

S1000-2M

Layers

10 Layers

Thickness

2.2±0.2mm

Min Hole Size

Mechanical hole 0.2mm

Min Track/Spacingh

200/110um

Minimum board thickness and hole ratio

8.5:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Product Details

4th-order HDI buried blind hole PCB board, the smallest aperture can reach 0.1mm, the Min Track/Spacing can reach 200/110um. The HDI board is widely used in the field of semiconductor testing.

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