5G mobile phone PCB motherboard

PCB Products / 5G communication PCB / 5G mobile phone PCB motherboard

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Applications

5G mobile phone

Features

Material

S1000-2M

Layers

12 Layers

Thickness

1.2±0.1mm

Min Hole Size

Min Track/Spacingh

65/65um

Minimum board thickness and hole ratio

Surface Finish

Immersion gold(ENIG)+OSP

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Product Details

The 5G mobile phone PCB motherboard is made of Shengyi S1000-2M material through surface immersion gold, laser drilling and OSP processes. This type of HDI circuit board is widely used in the field of smart phones.

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Engineer

HEAT

I just wanted to reach out and say that the quality of this assembly batch is excellent AGAIN. I am especially happy to see that the specific soldering instruction I left for one of the components was followed perfectly. The execution was incredible. Also, the communication regarding the BOM was great and very helpful in ensuring everything went smoothly. I have tested the board, and it works perfectly.

Yordanov

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