Semiconductor test PCB

PCB Products / Semiconductor test PCB / Semiconductor test PCB

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Applications

Semiconductor test

Features

4 times laser drilling, 5 times pressing, 4nd order HDI board

Material

S1000-2M

Layers

8 Layers

Thickness

4.4±0.4mm

Min Hole Size

Laser hole 0.127mm; mechanical hole 0.3mm

Min Track/Spacingh

127/85um

Minimum board thickness and hole ratio

15:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Product Details

Semiconductor test PCB circuit board, this type of circuit board is made of Shengyi S1000-2M material, manufactured by laser drilling, surface immersion gold and other processes, and the smallest aperture can reach 0.1mm, and the Min Track/Spacing can reach 127/85um. The HDI board is widely used in the field of semiconductor testing.

PCB Capabilities

Advanced PCB Capabilities

Multi-layer laminated structure

Quick turn PCB Fabrication

PCB Prototyping

Low-volume Production

Production Process

PCB Products

FAQ of PCB

PCBA Capabilities

PCB Assembly Capability

Special Reminders

File Requirements

PCB Assembly FAQ

Production Process

PCB Assembly Products

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