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The high-speed computer gold finger card board is manufactured by Lianmao IT170GRA1TC high-speed material pure pressure, surface immersion gold and gold finger immersion thick gold and other production processes. It is widely used in high-speed computers and high-end server fields in cloud data centers. The products are stable, Durable and other characteristics.

16 layers, Material: TU-872SLK+RO4350b, Thickness: 1.8±0.1mm
10 layers, Material: IT968TC+S1000-2M, Thickness: 1.0±0.1mm
4 layers, Material: RO4350B+TU768, Thickness: 1.6±0.16mm
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Excellent service, support with file queries, appropriate solutions that facilitate development work. We are very grateful for the attention given to this and other projects manufactured with PCBWay.
C.A.
After manufacturing the board correctly, the team contacted me with an assembled prototype to confirm the assembly method. I thought that was amazing. After confirming my part of the assembly, the team proceeded with the production process and assembled the boards in a very professional manner. Congratulations!
Engineer