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TU-662 Radio Frequency (RF) Mid-Tg and High Thermal Reliability Laminate and Prepreg PCB Material

by: Aug 27,2019 1771 Views 0 Comments Posted in PCB Basic Information

TU-662 PCB Base materials Rigid material base materials Internationally known


Mid-Tg and High Thermal Reliability Laminate and Prepreg

Core: TU-662; Prepreg: TU-66P

TU-662/ TU-66P laminate/ prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-662 laminates exhibit excellent CTE, superior chemical resistance, and thermal stability for lead free soldering assembly with general CAF resistance.

Main Applications


Consumer Electronics

Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Use friendly FR-4 processing conditions such as oxide, press, drilling and desmear

Superior chemical and thermal resistance

Fluorescence for AOI

Optical characteristics provide UV-block property

High interlayer bonding strength with optimum resin flow

Low moisture absorption

Typical Values
Tg (DMA)
Tg (DSC)
Tg (TMA)
Td (TGA)
CTE z-axis (50 to 260 °C)
T-260/ T288
>60 min/ >10 min
Permittivity (RC 50%) @1GHz
Loss Tangent (RC 50%) @1GHz

Industry Approvals

IPC-4101 Type Designation : /21, /98, /99, /101

UL Designation - ANSI Grade: FR-4.0

UL File Number: E189572

Flammability Rating: 94V-0

Maximum Operating Temperature: 130°C

Standard Availability

Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form

Copper Foil Cladding: 1/3 to 6oz (HTE) for built-up; 1/3 to 3oz (HTE) for double sides and H to 2oz (MLS)

Prepregs: Available in roll or panel form

Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628 etc.

Document Downloads For Public

  1. TU-662_Datasheet.pdf

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