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  2. TU-872 LK TU-872 SLK TU-872 SLK Sp TUC High Speed Digital HSD PCB Materials

TU-872 LK TU-872 SLK TU-872 SLK Sp TUC High Speed Digital HSD PCB Materials

by: Aug 27,2019 1423 Views 0 Comments Posted in PCB Basic Information

Internationally known TUC base materials Rigid material PCB Base materials TU-872

  1. High Speed Digital (HSD)

TU-872 LK

Low Dk/Df and High Thermal Reliability Material

Core: TU-872 LK; Prepreg: TU-87P LK

TU-872 LK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 LK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 LK laminates also exhibit excellent CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.


Main Applications

Backpanel, High performance computing

Line cards, Storage

Servers, Telecom, Base station

Office Routers


Key Features

Excellent electrical properties

Dielectric constant less than 4.0

Dissipation factor less than 0.010

Stable and flat Dk/Df performance

Compatible with most FR-4 processes

Lead free process compatible

Improved z-axis thermal expansion

Anti-CAF capability

Superior dimensional stability, thickness uniformity and flatness

Excellent through-hole and soldering reliability


Property
Typical Values
Tg (DMA)
220°C
Tg (DSC)
200°C
Tg (TMA)
190°C
Td (TGA)
340°C
CTE z-axis (50 to 260 °C)
2.5%
T-260/ T288
60 min/ 20 min
Permittivity (RC 50%) @10GHz
3.8
Loss Tangent (RC 50%) @10GHz
0.009

Industry Approvals

IPC-4101E Type Designation : /29, /99, /101, /126

IPC-4101E/126 Validation Services QPL Certified

UL designation - ANSI Grade: FR-4.0

UL file number: E189572

Flammability rating: 94V-0

Maximum Operating Temperature: 130°C

Standard Availability

Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form

Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides

Prepregs: Available in roll or panel form

Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request

Document Downloads For Public

  1. TU-872 LK_Datasheet.pdf

TU-872 SLK

Low Dk/Df and High Thermal Reliability Material

Core: TU-872 SLK; Prepreg: TU-87P SLK

TU-872 SLK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 SLK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.


Main Applications

Radio Frequency

Backpanel, High performance computing

Line cards, Storage

Servers, Telecom, Base station

Office Routers


Key Features

Excellent electrical properties

Dielectric constant less than 4.0

Dissipation factor less than 0.010

Stable and flat Dk/Df performance

Compatible with modified FR-4 processes

Excellent moisture resistance and Lead Free reflow process compatible

Improved Z-axis thermal expansion

Anti-CAF capability

Superior dimensional stability, thickness uniformity and flatness

Excellent through-hole and soldering reliability

Property
Typical Values
Tg (DMA)
220°C
Tg (DSC)
200°C
Tg (TMA)
190°C
Td (TGA)
340°C
CTE z-axis (50 to 260 °C)
2.3%
T-260/ T288
60 min/ 20 min
Permittivity (RC 50%) @10GHz
3.8
Loss Tangent (RC 50%) @10GHz
0.009


Industry Approvals

IPC-4101E Type Designation : /29, /99, /101, /126

IPC-4101E/126 Validation Services QPL Certified

UL Designation - ANSI Grade: FR-4.0

UL File Number: E189572

Flammability Rating: 94V-0

Maximum Operating Temperature: 130°C


Standard Availability

Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form

Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides

Prepregs: Available in roll or panel form

Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request.

Document Downloads For Public

  1. TU-872 SLK_Datasheet.pdf

TU-872 SLK Sp

Low Dk/Df and High Thermal Reliability Material

Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp

Main Applications

Radio Frequency

Backpanel, High performance computing

Line cards, Storage

Servers, Telecom, Base station

Office Routers


Key Features

Excellent electrical properties

Dielectric constant less than 3.5

Dissipation factor less than 0.010

Excellent, stable and flat Dk/Df performance

Compatible with most FR-4 processes

Lead free process compatible

Improved z-axis thermal expansion

Anti-CAF capability

Superior dimensional stability, thickness uniformity and flatness

Excellent through-hole and soldering reliability

Property
Typical Values
Tg (DMA)
220°C
Tg (DSC)
200°C
Tg (TMA)
190°C
Td (TGA)
340°C
CTE z-axis (50 to 260 °C)
2.7%
T-260/ T288
60 min/ 20 min
Permittivity (RC 50%) @10GHz
3.5
Loss Tangent (RC 50%) @10GHz
0.008

Industry Approvals

IPC-4101 Type Designation : /29, /98, /99, /101, /126

IPC-4101E/126 Validation Services QPL Certified

UL Designation - ANSI Grade: FR-4.0

UL File Number: E189572

Flammability Rating: 94V-0

Maximum Operating Temperature: 130°C

Standard Availability

Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form

Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides

Prepregs: Available in roll or panel form

Glass Styles: 106, 1080 and 2116

Document Downloads For Public

  1. TU-872 SLK Sp_Datasheet.pdf



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