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TU-863P MF High Tg Low Loss Halogen Free Low flow Prepreg PCB Materials

by: Aug 27,2019 584 Views 0 Comments Posted in PCB Basic Information

Internationally known TUC base materials Rigid material PCB Base materials TU-863P MF

  1. Radio Frequency (RF)

TU-863P MF


High Tg Low Loss Halogen Free Low flow Prepreg

Prepreg: TU-863P MF

TU-863P MF low loss, low flow halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding applications. The special design TU-863P MF low flow, low loss halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board applications. TU-863P MF low flow prepreg also provide excellent bonding performance with a variety of materials and with excellent high Tg, low CTE thermal performance for sequential lamination and lead-free processes.

Main Applications

High Speed Rigid-flex Board

Heat sink, Cavity


Key Features

Stable resin flow

Excellent bonding strength with polyimide materials

Low resin powder dust generation

High Tg, low loss and halogen free characteristics

Lead Free process compatible

Reduced z-axis thermal expansion

Superior dimensional stability, thickness uniformity and flatness

Good drilling & lamination processes friendly

Superior dielectric thickness control


Property
Typical Values
Tg (DMA)
200°C
Tg (TMA)
165°C
Td (TGA)
375°C
CTE z-axis (50 to 260 °C)
2.5%
T-260/ T288
>60 min/ >60 min
Permittivity (RC 50%) @1GHz
4.1
Loss Tangent (RC 50%) @1GHz
0.007


Industry Approvals

IPC-4101E Type Designation : /127, /128, /130

IPC-4101E/130 Validation Services QPL Certified

UL Designation - ANSI Grade: FR-4.1

UL File Number: E189572

Flammability Rating: 94V-0

Maximum Operating Temperature: 130°C

Standard Availability

Prepregs: Available in roll or panel form

Glass Styles: 106 and 1080, other prepreg grades are available upon request


Document Downloads For Public

  1. TU-863P MF_Datasheet.pdf


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