TU-863P MF low loss, low flow halogen-free prepreg consist of optimal resin flow specially formulated for unique purpose bonding applications. The special design TU-863P MF low flow, low loss halogen-free prepreg is appropriate for applying in multiple layer rigid-flex bonding, heat sink bonding and die cavity board applications. TU-863P MF low flow prepreg also provide excellent bonding performance with a variety of materials and with excellent high Tg, low CTE thermal performance for sequential lamination and lead-free processes.
Main Applications
High Speed Rigid-flex Board
Heat sink, Cavity
Key Features
Stable resin flow
Excellent bonding strength with polyimide materials
Low resin powder dust generation
High Tg, low loss and halogen free characteristics
Lead Free process compatible
Reduced z-axis thermal expansion
Superior dimensional stability, thickness uniformity and flatness
Good drilling & lamination processes friendly
Superior dielectric thickness control
Property | Typical Values |
Tg (DMA) | 200°C |
Tg (TMA) | 165°C |
Td (TGA) | 375°C |
CTE z-axis (50 to 260 °C) | 2.5% |
T-260/ T288 | >60 min/ >60 min |
Permittivity (RC 50%) @1GHz | 4.1 |
Loss Tangent (RC 50%) @1GHz | 0.007 |
Industry Approvals
IPC-4101E Type Designation : /127, /128, /130
IPC-4101E/130 Validation Services QPL Certified
UL Designation - ANSI Grade: FR-4.1
UL File Number: E189572
Flammability Rating: 94V-0
Maximum Operating Temperature: 130°C
Standard Availability
Prepregs: Available in roll or panel form
Glass Styles: 106 and 1080, other prepreg grades are available upon request
