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TU-768 High Speed Digital (HSD) PCB Materials

by: Aug 27,2019 2884 Views 0 Comments Posted in PCB Basic Information

TU-768 PCB Base materials Rigid material base materials High Speed Digital Internationally known

  1. High Speed Digital (HSD)


High-Tg and High Thermal Reliability Laminate and Prepreg

Core: TU-768; Prepreg: TU-768P

TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.

Main Applications

Consumer Electronics

Server, workstation


Key Features

Lead Free process compatible

Excellent coefficient of thermal expansion

Anti-CAF property

Superior chemical and thermal resistance

Fluorescence for AOI

Moisture resistance

Typical Values
Tg (DMA)
Tg (DSC)
Tg (TMA)
Td (TGA)
CTE z-axis (50 to 260 °C)
T-260/ T288
>60 min/ >15 min
Permittivity @1GHz(RC 50%)
Loss Tangent @1GHz(RC 50%)

Industry Approvals

IPC-4101E Type Designation : /98, /99, /101, /126

IPC-4101E/126 Validation Services QPL Certified

UL Designation - ANSI Grade: FR-4.0

UL File Number: E189572

Flammability Rating: 94V-0

Maximum Operating Temperature: 130°C

Standard Availability

Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form

Copper Foil Cladding: 1/8 to 12oz (HTE) for built-up; 1/8 to 3oz (HTE) for double sides and H to 2oz (MLS)

Prepregs: Available in roll or panel form

Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628 etc.

Document Downloads For Public

  1. TU-768_Datasheet.pdf

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