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TU-862 HF TU-862S TU-862T Automotive High Tg Halogen Free Material

by: Aug 27,2019 615 Views 0 Comments Posted in PCB Basic Information

Internationally known Halogen Free Rigid material PCB Base materials High Tg

  1. Automotive

TU-862 HF

High Tg Halogen Free Material

Core: TU-862 HF; Prepreg: TU-86P HF

TU-862 HF/TU-86P HF High Tg halogen free materials are made of epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862 HF/TU-86P HF achieves flammability class of UL94V-0 by incorporating phosphorous and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-86P HF is designed for use with TU-862 HF for making multilayer printed wire boards. TU-862 HF is also available for single/double sided application. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-862 HF laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and CAF resistance.

Main Applications

Backpanel, High performance computing

Line cards, Storage

Servers, Telecom, Base station

Office Routers

Key Features

Low halogen and environmental friendly materials

Lead free process compatible

Compatible to PCB processes

Very low coefficient of thermal expansion

Moisture resistance

Anti-CAF capability

Higher Tg characteristics

Property
Typical Values
Tg (DMA)
200°C
Tg (TMA)
170°C
Td (TGA)
390°C
CTE z-axis (50 to 260 °C)
2.1%
T-260/ T288
>60 min/ >60 min
Permittivity (RC 50%) @1GHz
4.4
Loss Tangent (RC 50%) @1GHz
0.010

Industry Approvals

IPC-4101 Type Designation: /127, /128, /130

IPC-4101E/130 Validation Services QPL Certified

UL Designation - ANSI Grade FR-4.1

UL File Number: E189572

Flammability Rating: 94V-0

Maximum Operating Temperature: 130°C

Standard Availability

Thickness: 0.002”[0.05mm] to 0.062”[1.58mm], available in sheet or panel form

Copper Foil Cladding: 1/3 to 5oz (HTE) for built-up & double sides and H to 2oz (MLS)

Prepregs: Available in roll or panel form

Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628, etc.

Document Downloads For Public

  1. TU-862 HF_Datasheet.pdf
  2. High Speed Digital (HSD)

TU-862S

Hi-Tg Halogen Free Mid-Loss Material

Core: TU-862S; Prepreg: TU-862P S

TU-862S High Tg halogen free Mid-loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with lower dielectric constant and dissipation factor for high speed mid-loss multilayer circuit server board applications. Unlike conventional FR-4.0 material using brominated resin as flame retardant. TU-862S achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. TU-862S material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, mid-loss signal attenuation and eliminate the use of potential hazardous halogenated resins.

Main Applications

Backpanel, High performance computing

Line cards, Storage

Servers, Telecom, Base station

Office Routers

Key Features

Lower Dk & Df performance, mid-loss applications

Lead free process compatible

Environmental friendly materials

Compatible to PCB processes

Low coefficient of thermal expansion

Moisture resistance

Anti-CAF capability

Property
Typical Values
TG (DMA)
200°C
TG (TMA)
165°C
Td (TGA)
370°C
CTE z-axis (50 to 260 °C)
2.2%
T-260/ T288
>60 min/ >60 min
Permittivity (RC 50%) @1GHz
4.3
Loss Tangent (RC 50%) @1GHz
0.011

Industry Approvals

IPC-4101 Type Designation: /127, /128, /130

IPC-4101E/130 Validation Services QPL Certified

UL Designation - ANSI Grade FR-4.1

UL File Number: E189572

Flammability Rating: 94V-0

Maximum Operating Temperature: 130°C

Standard Availability

Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form

Copper Foil Cladding: 1/3 to 4 oz for built-up & double sides

Prepregs: Available in roll or panel form

Glass Styles: 106, 1080, 3313, 2116 etc and other prepreg grades are available upon request

Document Downloads For Public

  1. TU-862S_Datasheet.pdf
  2. High Density Interconnect (HDI)

TU-862T

High Tg Halogen Free Material

Core: TU-862T; Prepreg: TU-862P T


TU-862T High Tg halogen free materials are made of High Tg epoxy resin and E-glass fabric. Unlike conventional FR-4 material using brominated resin as flame retardant, TU-862T /TU-862P T achieves flammability class of UL94V-0 by incorporating phosphorus and nitrogen compounds in the materials. The materials are compatible with the AOI process and exhibit the UV-block characteristic. TU-862P T is designed for use with TU-862T for making multilayer printed wire boards. TU-862T is also available for single/double sided application. This series of green materials are designed to eliminate the use of halogenated resins due to the potential hazardous effects from the environmental concerns. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-862T laminates also exhibit superior chemical resistance, thermal stability for lead free soldering assembly and CAF resistance than conventional High Tg materials.

Main Applications

Backplane, High performance computing

Automotive, Harsh environments

Servers, Telecom, Base station

Office Routers


Key Features

Low halogen and environmental friendly materials

Lead free process compatible

Compatible to PCB processes

Very low coefficient of thermal expansion

Moisture resistance

Anti-CAF capability

Higher Tg characteristics

Property
Typical Values
TG (TMA)
175°C
Td (TGA)
370°C
CTE z-axis (50 to 260 °C)
2.0%
T-260/ T288
>60 min/>60 min
Permittivity (RC 50%) @1GHz
4.5
Loss Tangent (RC 50%) @1GHz
0.013


Industry Approvals

IPC-4101 Type Designation: /127, /128, /130

IPC-4101E/130 Validation Services QPL Certified

UL Designation - ANSI Grade FR-4.1

UL File Number: E189572

Flammability Rating: 94V-0

Maximum Operating Temperature: 130°C

Standard Availability

Thickness: 0.002”[0.05mm] to 0.062” [1.58mm], available in sheet or panel form

Copper Foil Cladding: 1/3 to 5 oz (HTE) for built-up & double sides and H to 2 oz (MLS)

Prepregs: Available in roll or panel form

Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628, etc.

Document Downloads For Public

  1. TU-862T_Datasheet.pdf




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