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S1151G Shengyi Conventional FR-4 Rigid PCB Materials

by: Aug 26,2019 601 Views 0 Comments Posted in PCB Basic Information

Internationally known Shengyi base materials Rigid material PCB Base materials S1151G

S1151G

Characteristic

●Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.

UV Blocking/AOI compatible

● HighCTI,CTI≥600V

● Not suitable for solder mask rework

Application Area

● Consumer electronics

● Smartphone

● Automotive electronics

● Suggested to be used for maximum 8-layer board (thickness<1.6mm) with through hole construction

Product Performance

Items
Method
Condition
Unit
Typical Value
Tg
IPC-TM-650 2.4.25
DSC
150
Td
IPC-TM-650 2.4.24.6
5% wt. loss
360
CTE (Z-axis)
IPC-TM-650 2.4.24
Before Tg
ppm/℃
36
After Tg
ppm/℃
220
50-260℃
%
2.8
T260
IPC-TM-650 2.4.24.1
TMA
min
>60
T288
IPC-TM-650 2.4.24.1
TMA
min
15
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
--
pass
Volume Resistivity
IPC-TM-650 2.5.17.1
After moisture resistance
MΩ.cm
6.4 x 107
E-24/125
MΩ.cm
5.3 x 106
Surface Resistivity
IPC-TM-650 2.5.17.1
After moisture resistance
4.8 x 107
E-24/125
2.8 x 106
Arc Resistance
IPC-TM-650 2.5.1
D-48/50+D-4/23
s
140
Dielectric Breakdown
IPC-TM-650 2.5.6
D-48/50+D-4/23
kV
45+kV NB
Dissipation Constant (Dk)
IPC-TM-650 2.5.5.9
1MHz
--
4.8
IEC 61189-2-721
10GHz
--
Dissipation Factor (Df)
IPC-TM-650 2.5.5.9
1MHz
--
0.010
IEC 61189-2-721
10GHz
--
Peel Strength (1Oz HTE copper foil)
IPC-TM-650 2.4.8
A
N/mm
After thermal Stress 288℃,10s
N/mm
1.4
125℃
N/mm
1.3
Flexural Strength
LW
IPC-TM-650 2.4.4
A
MPa
600
CW
IPC-TM-650 2.4.4
A
MPa
450
Water Absorption
IPC-TM-650 2.6.2.1
E-1/105+D-24/23
%
0.10
CTI
IEC60112
A
Rating
PLC 0
Flammability
UL94
C-48/23/50
Rating
V-0
E-24/125
Rating
V-0

Remarks:

1. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

2.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

Product Certificate

CQC S1151G S.pdf

Data Download

S1151G TDS

S1151G Line up

S1151G Processing guidelines

S1151G Laminate SGS

S1151G Prepreg SGS

S1151G Laminate MSDS

S1151G Prepreg MSDS

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