1. Blog>
  2. S1151G Shengyi Conventional FR-4 Rigid PCB Materials

S1151G Shengyi Conventional FR-4 Rigid PCB Materials

by: Aug 26,2019 7941 Views 1 Comments Posted in PCB Basic Information

S1151G PCB Base materials Rigid material base materials Shengyi

S1151G

Characteristic

●Free of constituents such as halogen, antimony, red phosphorous, ect. No toxicgas emission and no hazardous residue during waste combustion.

UV Blocking/AOI compatible

● HighCTI,CTI≥600V

● Not suitable for solder mask rework

Application Area

● Consumer electronics

● Smartphone

● Automotive electronics

● Suggested to be used for maximum 8-layer board (thickness<1.6mm) with through hole construction

Product Performance

Items

Method

Condition

Unit

Typical Value

Tg

IPC-TM-650 2.4.25

DSC

150

Td

IPC-TM-650 2.4.24.6

5% wt. loss

360

CTE (Z-axis)

IPC-TM-650 2.4.24

Before Tg

ppm/℃

36

After Tg

ppm/℃

220

50-260℃

%

2.8

T260

IPC-TM-650 2.4.24.1

TMA

min

>60

T288

IPC-TM-650 2.4.24.1

TMA

min

15

Thermal Stress

IPC-TM-650 2.4.13.1

288℃, solder dip

--

pass

Volume Resistivity

IPC-TM-650 2.5.17.1

After moisture resistance

MΩ.cm

6.4 x 107

E-24/125

MΩ.cm

5.3 x 106

Surface Resistivity

IPC-TM-650 2.5.17.1

After moisture resistance

4.8 x 107

E-24/125

2.8 x 106

Arc Resistance

IPC-TM-650 2.5.1

D-48/50+D-4/23

s

140

Dielectric Breakdown

IPC-TM-650 2.5.6

D-48/50+D-4/23

kV

45+kV NB

Dissipation Constant (Dk)

IPC-TM-650 2.5.5.9

1MHz

--

4.8

IEC 61189-2-721

10GHz

--

Dissipation Factor (Df)

IPC-TM-650 2.5.5.9

1MHz

--

0.010

IEC 61189-2-721

10GHz

--

Peel Strength (1Oz HTE copper foil)

IPC-TM-650 2.4.8

A

N/mm

After thermal Stress 288℃,10s

N/mm

1.4

125℃

N/mm

1.3

Flexural Strength

LW

IPC-TM-650 2.4.4

A

MPa

600

CW

IPC-TM-650 2.4.4

A

MPa

450

Water Absorption

IPC-TM-650 2.6.2.1

E-1/105+D-24/23

%

0.10

CTI

IEC60112

A

Rating

PLC 0

Flammability

UL94

C-48/23/50

Rating

V-0

E-24/125

Rating

V-0

Remarks:

1. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

2.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

Product Certificate

CQC S1151G S.pdf

Data Download

S1151G TDS

S1151G Line up

S1151G Processing guidelines

S1151G Laminate SGS

S1151G Prepreg SGS

S1151G Laminate MSDS

S1151G Prepreg MSDS

Join us
Wanna be a dedicated PCBWay writer? We definately look forward to having you with us.
  • Comments(1)
Upload photo
You can only upload 5 files in total. Each file cannot exceed 2MB. Supports JPG, JPEG, GIF, PNG, BMP
0 / 10000
    Back to top