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S1150G Shengyi Halogen Free and Lead Free Compatible FR-4.1, FR-15.1 Rigid PCB Materials

by: Aug 23,2019 542 Views 0 Comments Posted in PCB Basic Information

Internationally known Shengyi base materials Rigid material PCB Base materials S1150G

S1150G

Characteristic

● Free of constituents such as halogen, antimony, red phosphorous, ect. No toxic gas emission and no hazardous residue during waste combustion.

● Excellent mechanical processability and thermal resistance, lead free process compliance

Application Area

● Smartphone, tablet, notebook

● LED, game station

● Automotive electronics

● Communication equipment

Product Performance

Items
Method
Condition
Unit
Typical Value
Tg
IPC-TM-650 2.4.25
DSC
155
Td
IPC-TM-650 2.4.24.6
5% wt. loss
355
CTE (Z-axis)
IPC-TM-650 2.4.24
Before Tg
ppm/℃
40
After Tg
ppm/℃
230
50-260℃
%
2.8
T260
IPC-TM-650 2.4.24.1
TMA
min
60
T288
IPC-TM-650 2.4.24.1
TMA
min
45
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
--
>100S No Delamination
Volume Resistivity
IPC-TM-650 2.5.17.1
After moisture resistance
MΩ.cm
1.15E + 08
E-24/125
MΩ.cm
4.13E + 08
Surface Resistivity
IPC-TM-650 2.5.17.1
After moisture resistance
9.61E + 06
E-24/125
5.37E + 07
Arc Resistance
IPC-TM-650 2.5.1
D-48/50+D-4/23
s
178
Dielectric Breakdown
IPC-TM-650 2.5.6
D-48/50+D-4/23
kV
45+kV NB
Dissipation Constant (Dk)
IPC-TM-650 2.5.5.9
1GHz
--
4.5
IPC-TM-650 2.5.5.9
1MHz
--
4.8
Dissipation Factor (Df)
IPC-TM-650 2.5.5.9
1GHz
--
0.011
IPC-TM-650 2.5.5.9
1MHz
--
0.009
Peel Strength (1Oz HTE copper foil)
IPC-TM-650 2.4.8
A
N/mm
After thermal Stress 288℃,10s
N/mm
1.5
125℃
N/mm
Flexural Strength
LW
IPC-TM-650 2.4.4
A
MPa
630
CW
IPC-TM-650 2.4.4
A
MPa
480
Water Absorption
IPC-TM-650 2.6.2.1
E-1/105+D-24/23
%
0.10
Flammability
UL94
C-48/23/50
Rating
V-0
E-24/125
Rating
V-0

Remarks:

1. Specification sheet: IPC-4101/128, is for your reference only.

2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

3.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

Product Certificate

S1150G CQC.pdf

S1150G CQC CN 苏州.pdf

BSI VC 660215(2016).pdf

S1150G TDS

S1150G Line up

S1150G Processing guidelines

S1150G Laminate SGS

S1150G Prepreg SGS

S1150G Laminate MSDS

S1150G Prepreg MSDS

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