● Lead-free compatible FR-4.0 laminate
●Tg170℃ (DSC), UV Blocking/AOI compatible
● High heat resistance
● Lower Z-axis CTE
● Excellent through-hole reliability
● ExcellentAnti-CAF performance
● Low water absorption
● Excellent mechanical processability
● Suitable for high-layer count PCB
● Widely used in computer, communication, automotive electronics, and etc.
Product Performance
Items | Method | Condition | Unit | Typical Value | |
Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 355 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 41 | |
After Tg | ppm/℃ | 208 | |||
50-260℃ | % | 2.4 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
T300 | IPC-TM-650 2.4.24.1 | TMA | min | 15 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | >100S No Delamination | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 8.66 E+08 | |
E-24/125 | MΩ.cm | 7.18 E+06 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 2.17 E+07 | |
E-24/125 | MΩ | 8.64 E+06 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 133 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.6 | |
IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.9 | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.018 | |
IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.015 | ||
Peel Strength (1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm | 1.3 | |||
125℃ | N/mm | ||||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 567 |
CW | IPC-TM-650 2.4.4 | A | MPa | 442 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.08 | |
CTI | IEC60112 | A | Rating | PLC 3 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 | |||
1. Specification sheet: IPC-4101/126, is for your reference only.
2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.
3.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.
Product Certificate
CQC S1000-2M S.pdf
BSI VC 660216（2016）.pdf
S1000-2M TDS
S1000-2M Line up
S1000-2M Processing guidelines
S1000-2M Laminate SGS
S1000-2M Prepreg SGS
S1000-2M Laminate MSDS
S1000-2M Prepreg MSDS
