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S1000-2M Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

by: Aug 23,2019 217 Views 0 Comments Posted in PCB Basic Information

Internationally known Shengyi base materials Rigid material PCB Base materials S1000-2M

S1000-2M

Characteristic

● Lead-free compatible FR-4.0 laminate

●Tg170℃ (DSC), UV Blocking/AOI compatible

● High heat resistance

● Lower Z-axis CTE

● Excellent through-hole reliability

● ExcellentAnti-CAF performance

● Low water absorption

● Excellent mechanical processability

Application Area

● Suitable for high-layer count PCB

● Widely used in computer, communication, automotive electronics, and etc.

Product Performance

Items
Method
Condition
Unit
Typical Value
Tg
IPC-TM-650 2.4.25
DSC
180
IPC-TM-650 2.4.24.4
DMA
185
Td
IPC-TM-650 2.4.24.6
5% wt. loss
355
CTE (Z-axis)
IPC-TM-650 2.4.24
Before Tg
ppm/℃
41
After Tg
ppm/℃
208
50-260℃
%
2.4
T260
IPC-TM-650 2.4.24.1
TMA
min
60
T288
IPC-TM-650 2.4.24.1
TMA
min
30
T300
IPC-TM-650 2.4.24.1
TMA
min
15
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
--
>100S No Delamination
Volume Resistivity
IPC-TM-650 2.5.17.1
After moisture resistance
MΩ.cm
8.66 E+08
E-24/125
MΩ.cm
7.18 E+06
Surface Resistivity
IPC-TM-650 2.5.17.1
After moisture resistance
2.17 E+07
E-24/125
8.64 E+06
Arc Resistance
IPC-TM-650 2.5.1
D-48/50+D-4/23
s
133
Dielectric Breakdown
IPC-TM-650 2.5.6
D-48/50+D-4/23
kV
45+kV NB
Dissipation Constant (Dk)
IPC-TM-650 2.5.5.9
1GHz
--
4.6
IPC-TM-650 2.5.5.9
1MHz
--
4.9
Dissipation Factor (Df)
IPC-TM-650 2.5.5.9
1GHz
--
0.018
IPC-TM-650 2.5.5.9
1MHz
--
0.015
Peel Strength (1oz HTE copper foil)
IPC-TM-650 2.4.8
A
N/mm
After thermal Stress 288℃,10s
N/mm
1.3
125℃
N/mm

Flexural Strength
LW
IPC-TM-650 2.4.4
A
MPa
567
CW
IPC-TM-650 2.4.4
A
MPa
442
Water Absorption
IPC-TM-650 2.6.2.1
E-1/105+D-24/23
%
0.08
CTI
IEC60112
A
Rating
PLC 3
Flammability
UL94
C-48/23/50
Rating
V-0
E-24/125
Rating
V-0

Remarks:

1. Specification sheet: IPC-4101/126, is for your reference only.

2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

3.All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.

Product Certificate

CQC S1000-2M S.pdf

BSI VC 660216(2016).pdf

S1000-2M TDS

S1000-2M Line up

S1000-2M Processing guidelines

S1000-2M Laminate SGS

S1000-2M Prepreg SGS

S1000-2M Laminate MSDS

S1000-2M Prepreg MSDS

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