Electrodeposition Photoresist --- A New Technology of HDI PCB Manufacturing

Introduction:With the rapid development of PCB, there are many challenges and much higher requirements of PCB, such as high density, high speed, miniaturization and so on, which makes the traditional manufacturing technology not meet the requirements of these new PCBs.The Traditional Patterns Manufacturing Technology of Multilayer PCB (Take out-layer patterns as an example):After making the inner patterns of multi-layer PCB (MLB), and then it will carry on laminating, drilling and PTH. And after...

Electrodeposition Photoresist HDI PCB

Selection of Surface Treatment Process

The choice of surface treatment process depends mainly on the type of component that is finally assembled. And the surface treatment process will affect the production, assembly and end use of the PCB. The use occasion of five common surface treatment processes will be described below.Hot Air Solder Level(HASL)HASL has been dominant in PCB surface treatment processes. In the 1980s, more than three-quarters of PCBs used HASL, but the industry has been reducing the use of hot air leveling processe...

Immersion Gold HASL Surface Treatment Process

Common Surface Treatment Processes

Surface treatment purposeThe most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since copper in nature tends to exist in the form of oxides in the air, it is unlikely to remain as raw copper for a long time, so other treatments of copper are required. Although in the subsequent assembly, strong flux can be used to remove most of the copper oxide, the strong flux itself is not easy to remove, so the industry generally does not use strong flux.Common ...

Surface treatment

Development Trend of Rigid-Flex PCB Manufacturing Process Technology

Introduction:The manufacturing process of rigid-flex PCB is different due to the different types of substrates. The main processes that determine its performance are fine-line technology and microporous technology. With the requirements of the miniaturization, multi-function and intensive assembly of electronic products, the manufacturing technologies of rigid-flex PCBs and embedded flexible PCBs aiming at high-density combination are widely concerned about the high-end PCB technology at present...

Manufacturing Process Technology Rigid-Flex PCB

The Impact of Pre-treatment in Solder Mask Bridge of PCB Production

Introduction:In the PCB industry, in order to ensure the insulation of solder mask of the printed circuit boards, as well as prevent the oxidation of the PCB surface and beautify the appearance, it is usually necessary to apply a layer of solder mask on the PCB surface and the substrate that do not need to be soldered. With the rapid development of electronic industry, the solder mask technology has been developed rapidly.The solder mask between the pads of SMD is called Solder Bridge, whose fun...

SMD Solder Mask Bridge

How is the PCB safety spacing designed?

There are many places in the PCB design that need to consider safe spacing. Here, for the time being, they fall into two categories: one is electrical-related safety spacing, and the other is non-electrical-related safety spacing.Electrical-related safety spacing1 Wire SpacingFor the processing capability of mainstream PCB manufacturers, the distance between the wires and the wires must be at least 4 mils. The minimum line spacing is also the line-to-line, line-to-pad distance. From a production...

Non-electrical-related safety spacing Electrical-related safety spacing Safety Spacing PCB

Get to know the Multi-level /Step Stencil

What is Multi-level /Step Stencil?Partial STEP-UP Stencil and partial STEP-DOWN Stencil are carried out on the steel sheet to make the same printing on the same stencil, so that different areas can obtain different thicknesses of solder paste. According to the performance of components, the size of connection end and the lands, it can accurately control the amount of solder paste which applied to the different components are accurately controlled to make the solder paste printing process efficie...

Laser Cutting Etch Step Stencil Multi-level Stencil

How to Choose Lead-free Surface Finish Techniques

Introduction of Application of Lead-free Surface Finish Techniques:Whether lead-free HASL can be popularized will depend on the results of the scientific study and its promotion and influence, but its smooth surface and high temperature process problems may be obstacles. OSP technology is widely used when a flatter surface is required, long shelf life is not required, and multiple heating applications are not required. OSP is likely to replace HASL technology in a large number of general applica...

Surface Finish

Analysis of Silkscreen Printing Process

Background:PCB manufacturing is now a very developed high-tech industry, and the rapid development of silkscreen technology has injected new vitality into the industry, brought about major changes to the electronics industry, and it has become an indispensable part of various electronic equipment and instruments. The current screen printing technology has been able to adapt to the high density of PCB production.Youtube: https://www.youtube.com/watch?v=mwy9Kigv9MgMaterials:1) Stencil:Stencil ...

Analysis of Common Problems of PCB Cleaning

Introduction:With the rapid development of PCB manufacturing technology, PCB cleaning technology must be constantly updated and developed. Various cleaning technologies emerge at the right moment have different advantages and disadvantages in the process of their use. This paper discusses the analysis and solutions of the problems that often occur in these PCB cleaning technologies.1. White Spots:One of the problems encountered after the formation of the cleaning process is that after the PCB...

PCB Cleaning

Organic Solderability Preservative (OSP)

—A Method of Surface Finish TechnologiesBackground:In recent years, electronic products are developing towards light, thin, short, miniaturized and multi-functional. At the same time, PCB is also developing towards high precision, high speed, high density and so on. In particular, the rapid development of SMT makes the hot air leveling process increasingly unsuited to the requirements of PCB manufacturing process. Meanwhile, the welding material, such as Sn-Pb, used in the hot air leveling proce...

Organic Solderability Preservative (OSP) SMT

Surface Finish Technology

Background:At present, the environmental problems involved in PCB production are particularly prominent. Lead and bromine are the hottest topics at the moment; Lead-free and halogen-free will affect the development of PCB in many ways. Although changes in the surface treatment process of PCB are not significant at present and seem to be relatively distant, it should be noted that the slow change in the long term will lead to great changes. PCB surface treatment technology is bound to change dram...

Surface Finish Technology

Detailed Procedures of Plating Copper for PCB Processing

——Technical Analysis of Plating Copper for PCB ProcessingElectroless plating is widely used in the printed circuit board (PCB) production and processing which has holes on that and it can also be called PTH(Plate Through Hole), the main purpose is to deposit a layer of copper through a series of chemical treatment methods in the conductive substrate, and then increasing the thickness of the copper layer through subsequent electroplating methods to its specific thickness of design which is usuall...

Plating Copper Electroless plating PCB process PTH Cromic Acid Oil Removing Charge Adjustment

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