What is the Purpose of Plating Nickel on PCB?

The chemical element symbol of nickel is Ni. Because of its excellent physical, mechanical, and chemical properties, nickel has many applications in engineering and industry, such as anti-corrosion, increased hardness, wear-resistance, and magnetism. It is mainly used in alloy formulations, such as nickel steel, nickel-chromium steel, nickel-copper, etc. to increase its corrosion resistance and oxidation resistance. Because of its good oxidation resistance, it was often used to make coins in the...

OSP Surface Treatment Matte Tin Passivation IMC Nickel Plating ENIG

Meet New Special PCB Technologies in PCBWay!

As a PCB innovation company, PCBWay is committed to solving the pain points of PCB procurement and meeting customers’ various PCB procurement needs — offering special plates such as Rogers, copper substrates, aluminum substrates, and high-frequency high-speed HDI.Recently, with the efforts of the technical department, PCBWay has added many special technologies.1 Impedance controlThe resistance encountered by high-frequency signals or electromagnetic waves in the transmission signal lines of elec...

Gold Finger ENEPIG Stack Up Thick Copper PCB Impedance Control

What is PCB Tombstone?

IntroductionThe tombstone phenomenon is that during welding process of the MLCC and PCB, one end of the MLCC leaves the welding area and is inclined or standing upright. The main reason is the unbalanced wetting force at both ends of the MLCC during the welding process. The main factors that produce unbalanced wetting force are:(1) Both ends of MLCC cannot be melted at the same time;(2) The pad design is unreasonable. According to the mechanical mechanism, it is proposed to keep the surface of t...

Reflow Soldering PCB MLCC Solder Paste PCB Tombstone

Corrosion Protection With Parylene

A natural process, corrosion enacts chemical/electrochemical reactions that degrade and gradually destroy materials or components within a functional environment. The outcome can be dangerous and costly to repair. For printed circuit boards (PCBs) and similar assemblies, corroded electrical contacts can cause potentially life-threatening mechanical malfunction of aerospace/automotive/industrial systems during operation; corroded medical implants may disrupt pacemaker function or lead to blood p...

CVD A-174 silane treatment PCBs Parylene Corrosion protection

Through-Hole Assembly

Through-hole technology (also spelled "thru-hole"), refers to the mounting scheme used for electronic components that involve the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by the manual assembly (hand placement) or by the use of automated insertion mount machines.The quality of the solder joint is important for several reasons. The solder joint is the actual connection between the component...

SMT technique electronic components solder joint thru-hole

Top 10 Failure Analysis Techniques for PCB

As a carrier of various components and a hub for circuit signal transmission, PCB has become the most important and critical part of electronic information products. The quality and reliability of the PCB determine the quality and reliability of the entire equipment. However, due to cost and technical reasons, a large number of failures have occurred during the production and application of PCBs.For this kind of failure problem, we need to use some commonly used failure analysis techniques to en...

Scanning acoustic microscope Slice analysis X-ray fluoroscopy

Important Processes of Rigid-Flex PCB Manufacturing

Introduction:Flexible printed circuit boards are used in a wide range of applications, almost all types of electronic products are involved, and the emergence of rigid-flex PCBs for the complex electronic packaging interconnection provides a better way to produce perhaps the most complex interconnection structure of the PCB products. The rigid-flex PCB includes two technologies what are the flexible printed circuit board technology and the rigid printed circuit board technology. For example, by ...

Rigid-Flex PCB,Drilling,Electroless Plating

Electrodeposition Photoresist --- A New Technology of HDI PCB Manufacturing

Introduction:With the rapid development of PCB, there are many challenges and much higher requirements of PCB, such as high density, high speed, miniaturization and so on, which makes the traditional manufacturing technology not meet the requirements of these new PCBs.The Traditional Patterns Manufacturing Technology of Multilayer PCB (Take out-layer patterns as an example):After making the inner patterns of multi-layer PCB (MLB), and then it will carry on laminating, drilling and PTH. And after...

Electrodeposition Photoresist HDI PCB

Selection of Surface Treatment Process

The choice of surface treatment process depends mainly on the type of component that is finally assembled. And the surface treatment process will affect the production, assembly and end use of the PCB. The use occasion of five common surface treatment processes will be described below.Hot Air Solder Level(HASL)HASL has been dominant in PCB surface treatment processes. In the 1980s, more than three-quarters of PCBs used HASL, but the industry has been reducing the use of hot air leveling processe...

Immersion Gold HASL Surface Treatment Process

Common Surface Treatment Processes

Surface treatment purposeThe most basic purpose of surface treatment is to ensure good solderability or electrical properties. Since copper in nature tends to exist in the form of oxides in the air, it is unlikely to remain as raw copper for a long time, so other treatments of copper are required. Although in the subsequent assembly, strong flux can be used to remove most of the copper oxide, the strong flux itself is not easy to remove, so the industry generally does not use strong flux.Common ...

Surface treatment

Development Trend of Rigid-Flex PCB Manufacturing Process Technology

Introduction:The manufacturing process of rigid-flex PCB is different due to the different types of substrates. The main processes that determine its performance are fine-line technology and microporous technology. With the requirements of the miniaturization, multi-function and intensive assembly of electronic products, the manufacturing technologies of rigid-flex PCBs and embedded flexible PCBs aiming at high-density combination are widely concerned about the high-end PCB technology at present...

Manufacturing Process Technology Rigid-Flex PCB

The Impact of Pre-treatment in Solder Mask Bridge of PCB Production

Introduction:In the PCB industry, in order to ensure the insulation of solder mask of the printed circuit boards, as well as prevent the oxidation of the PCB surface and beautify the appearance, it is usually necessary to apply a layer of solder mask on the PCB surface and the substrate that do not need to be soldered. With the rapid development of electronic industry, the solder mask technology has been developed rapidly.The solder mask between the pads of SMD is called Solder Bridge, whose fun...

SMD Solder Mask Bridge

How is the PCB safety spacing designed?

There are many places in the PCB design that need to consider safe spacing. Here, for the time being, they fall into two categories: one is electrical-related safety spacing, and the other is non-electrical-related safety spacing.Electrical-related safety spacing1 Wire SpacingFor the processing capability of mainstream PCB manufacturers, the distance between the wires and the wires must be at least 4 mils. The minimum line spacing is also the line-to-line, line-to-pad distance. From a production...

Non-electrical-related safety spacing Electrical-related safety spacing Safety Spacing PCB

Get to know the Multi-level /Step Stencil

What is Multi-level /Step Stencil?Partial STEP-UP Stencil and partial STEP-DOWN Stencil are carried out on the steel sheet to make the same printing on the same stencil, so that different areas can obtain different thicknesses of solder paste. According to the performance of components, the size of connection end and the lands, it can accurately control the amount of solder paste which applied to the different components are accurately controlled to make the solder paste printing process efficie...

Laser Cutting Etch Step Stencil Multi-level Stencil

How to Choose Lead-free Surface Finish Techniques

Introduction of Application of Lead-free Surface Finish Techniques:Whether lead-free HASL can be popularized will depend on the results of the scientific study and its promotion and influence, but its smooth surface and high temperature process problems may be obstacles. OSP technology is widely used when a flatter surface is required, long shelf life is not required, and multiple heating applications are not required. OSP is likely to replace HASL technology in a large number of general applica...

Surface Finish

Analysis of Silkscreen Printing Process

Background:PCB manufacturing is now a very developed high-tech industry, and the rapid development of silkscreen technology has injected new vitality into the industry, brought about major changes to the electronics industry, and it has become an indispensable part of various electronic equipment and instruments. The current screen printing technology has been able to adapt to the high density of PCB production.Youtube: https://www.youtube.com/watch?v=mwy9Kigv9MgMaterials:1) Stencil:Stencil ...

Analysis of Common Problems of PCB Cleaning

Introduction:With the rapid development of PCB manufacturing technology, PCB cleaning technology must be constantly updated and developed. Various cleaning technologies emerge at the right moment have different advantages and disadvantages in the process of their use. This paper discusses the analysis and solutions of the problems that often occur in these PCB cleaning technologies.1. White Spots:One of the problems encountered after the formation of the cleaning process is that after the PCB...

PCB Cleaning

Organic Solderability Preservative (OSP)

—A Method of Surface Finish TechnologiesBackground:In recent years, electronic products are developing towards light, thin, short, miniaturized and multi-functional. At the same time, PCB is also developing towards high precision, high speed, high density and so on. In particular, the rapid development of SMT makes the hot air leveling process increasingly unsuited to the requirements of PCB manufacturing process. Meanwhile, the welding material, such as Sn-Pb, used in the hot air leveling proce...

Organic Solderability Preservative (OSP) SMT

Surface Finish Technology

Background:At present, the environmental problems involved in PCB production are particularly prominent. Lead and bromine are the hottest topics at the moment; Lead-free and halogen-free will affect the development of PCB in many ways. Although changes in the surface treatment process of PCB are not significant at present and seem to be relatively distant, it should be noted that the slow change in the long term will lead to great changes. PCB surface treatment technology is bound to change dram...

Surface Finish Technology

Detailed Procedures of Plating Copper for PCB Processing

——Technical Analysis of Plating Copper for PCB ProcessingElectroless plating is widely used in the printed circuit board (PCB) production and processing which has holes on that and it can also be called PTH(Plate Through Hole), the main purpose is to deposit a layer of copper through a series of chemical treatment methods in the conductive substrate, and then increasing the thickness of the copper layer through subsequent electroplating methods to its specific thickness of design which is usuall...

Plating Copper Electroless plating PCB process PTH Cromic Acid Oil Removing Charge Adjustment

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