Keyword: PCB production process, PCB type PCB production process is along with the PCB type (type) and technology progress and the different and changing. At the same time as the PCB manufacturer USES different technology and different. That is to say can adopt different production process and technology produce products of the same or similar PCB with afterlife. But traditional single, double and sandwich plate production process is still the basis of PCB production process. The following is a rounding the PCB production process. 1 single panel production process CAD/CAM CCL cutting, drilling and positioning hole The open system of punching mould making silk screen version────────────→Printing, curing conductive graphics │ │ ↓ │ │ etching, removal of printed materials, clean │ │ ↓ │ └──────────────→Graphics, curing printing resistance welding │ │ ↓ │ └──────────────→tag printing, curing characters ∣ ∣ ↓ ∣ └──────────────→Printing element position, curing characters ∣ ↓ └────────────────────→Positioning hole drilling die, punching blanking ↓ left Inspection and test circuit ↓ Coating curing or OSP ↓ Inspection, packaging and finished products 2 hole metallization double panel production process AD and CAM CCL materials/edge grinding ↓ ↓ -- -- -- -- -- -- -- -- -- -- -- - > NC drilling │ ↓ │ hole metal mineralization │ (graphics electroplating) ↓ ↓ (the full plate electroplating) │ dry film or wet membrane mask hole or holes -- -- -- -- -- -- -- -- -- - (Negative graphics) (positive graphics) ↓ ↓ Plating copper/tin lead graphic transfer ↓ ↓ Go to film, etching etching ↓ ↓ Annealing tin lead, plating plug to film, clean ↓ ↓ Printing a few resistance welding agent/characters ↓ Hot air leveling or OSP ↓ Milling/cutting shape ↓ Inspection/testing ↓ The packing/finished product The buried orifice and blind hole plate forming first "core board" (equivalent to the conventional dual panel or laminated) to laminate, the following process with double panel. Core board (plug hole double panel and various kinds of laminated) manufacture → lamination RCC → laser drilling → Kong Hua electroplating→ pattern transfer → Refund film etching, → lamination RCC →Repeatedly to form the structure of a + n + b product layer board. Source: //www.seekic.com
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