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PCB power and ground handling techniques

by: Feb 28,2014 1291 Views 0 Comments Posted in Engineering Technical

PCB ground wire PCB board layout PCB production process PCB

In the PCB board layout , the power and ground handling is very important to make noise generated by power lines and ground down to a minimum to ensure the quality of the product.

Power and ground wiring rules are as follows .

· Between the power supply and ground plus decoupling capacitors .

· Try widening power lines, ground width , it is better than the power ground wire width .

· Digital circuits available PCB ground wire to form a wide loop , constitutes a ground network to use, not so analog circuits to be used.

· Copper layer with a large area for the ground on the PCB is not a place to spend connected with the ground as the ground with , or made ​​of plywood, each occupying power and ground floor .

. Check the rules

After completion of wiring design , layout design needs to be carefully checked whether the rules established by the designer , but also need to confirm whether the rule meets the requirements established by the PCB production process , general inspection following aspects .

· Lines and lines from the line and component pads , line and through holes , pads and through-hole components , through-hole and through hole between reasonable, whether to meet production requirements.

· Power line and ground width is appropriate, whether the tight coupling ( low impedance ) between the power supply and ground , whether there can make the PCB ground widened place.

• For Key 's signal cable is best to take measures, such as the length of the shortest line added protection , input lines and output lines are clearly separated.

· Analog circuits and digital circuits if there are separate ground wire.

· Is the added PCB graphics ( such as icons, subscript ) will cause the signal shorted.

· For some ideal linear modification.

· Whether the PCB plus a processing line , solder meets the requirements of the production process , solder size is appropriate, whether the pressure in the device character logo pads fine .

· Multilayer formation in the frame power supply is reduced, such as power -board strata exposed copper is likely to cause a short circuit.

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