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How to remove the IC block from the PCB?

by: Jan 15,2014 1399 Views 0 Comments Posted in Engineering Technical

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General overhaul in the circuit, often demand from the PCB assembly of integrated circuits, due to the integrated and intensive multi-pin, assembled very difficult, and sometimes damage IC and PCB board. Here is a summary of several integrated circuit assembly fruitful way for everyone to reference.

Multi-strand copper tin suction assembly method: Plastic is the application of multi-strand copper wire, remove the plastic skin, the use of multi-strand copper wire (can be applied to short head). Rosin alcohol solution before the first use of a multi-strand copper wire, electric iron pan will be multi-strand copper wire onto the pin heating manifold, so that the solder pin will be copper adsorption, absorption locally on the solder can be cut, can be repeated several times to implement all of the solder pin sucked. There may also be required to use shielded wire braided wire inside. Just sucking the solder, tweezers or small "a" word quietly a screwdriver to pry, manifold can be removed.

Growth solder ablation assembly method: This method is an easy way, just to be on the manifold assembly solder pin and then grow a little, so that each column pin joints link up, so in order to facilitate heat transfer, easy to assemble . Each assembly is heated electric iron pin on a column with a sharp tweezers or small "a" word screwdriver to pry pry, two columns of pins rotation heated until removed so far. Under ordinary conditions, the pin is heated twice each column can be removed.

Electric iron brush with the assembly method: The easy way is easy, just have a soldering iron and a small brush can be. When the first electric iron heating manifold assembly until the temperature reaches the melting tin solder pin after ablation, took the opportunity to sweep with a brush melted solder. This would make the manifold pin PCB parting. The approach can be divided into the implementation of the foot can be divided into columns implemented. End-tipped tweezers or small "a" word screwdriver to pry the manifold.

Medical hollow needle assembly method: Medical No. 8-12 hollow several needles. When using a needle Neijing just caught Manifold pin appropriate. When assembled with a soldering iron to melt the solder pins, needles caught in time with the pin, and then removed the iron and rotate the needle, and so condensation soldering pull out the needle. So that the pin on the printed circuit board and the entire separately. All pin to do so again after the manifold can be removed at will.

Suction tin tin suction assembly method: the use of suction tin manifold assembly, which is a common professional way, using ordinary tools suck, welding two electric iron, power 35W or more. Manifold assembly, just two heated electric iron head on to the manifold assembly pin, to be sucked into the joints after ablation of thin tin tin, solder pin after absorbing all the manifold can be removed.

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