PCBWay
Mar 05,2014
1489
I/O Optimization with 3D SoC, SiP, and PCB co-design
SoCs and advanced packages (such as system-in-package or package-on-package), and the board layout are typically designed in separate environments. Information can be communicated and exchanged from S...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |
