Clearance Hole
A hole in the conductive pattern larger than, but concentric with, a hole in the printed board base material.
Clad
(Adj). A condition of the base material to which a relatively thin layer or sheet of metal foil has been bonded at one or both of its sides, e.g. a metal clad base material.
Clad or Cladding
A relatively thin layer or sheet of metal foil which is bonded to a laminate core to form the base material for printed circuits.
Circumferential Separation
A crack in the plating extending around the entire circumference of a plated through-hole.
Circuit Tester
Generic term for volume tester of PCBs, such as bed-of-nails, footprint, guided probe, internal trace, loaded board, bare board and parts testing.
Chip Testers
Large computer-based systems that test individual ICs, especially LSI and VLSI.
Chemically-deposited Printed Chip on board
In this technology integrated circuits are glued and wire-bonded directly to printed circuit boards instead of first being packaged.
Chemical Hole Clearing
The chemical process for cleaning conductive surfaces exposed within a hole ( see also “ Etch-back ”).
Chemical Conversion Coating
A protective coating produced by the chemical reaction of a metal with a chemical solution.
Check Plots
Pen plots that are suitable for checking only. Pads are represented as circles and thick traces as rectangular outlines instead of filled-in artwork. This technique is used to enhance the transparency...
Characteristic Impedance
The ratio of voltage to current in a propagating wave, i.e., the impedance which is offered to this wave at any point of the line. The characteristic impedance is expressed in ohms.
Chamfer
A corner which has been rounded or shaped to eliminate an otherwise sharp edge.
Catalyst
A chemical that speeds or changes the cure of a resin but does not become a part of the final product. Examples: hardeners, promoters, inhibitors.
Cast Adhesive
Special sheet adhesive material used for bonding polyimide multi-layer boards and flexi-rigids ( similar to prepreg = B-Stages ).
Capillary Action
A phenomenon of force adhesion and cohesion that prompts liquids ( molten solder) to flow against gravity between closely spaced solid surface, such as component leads and pads.
Capacitive Coupling
The electrical interaction between two conductors caused by the capacitance between them.
CAD/CAM system
Computer-aided design is the use of special software tools to formulate printed circuit patterns. Computer-aided manufacturing translates such designs into actual products.
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |