Shiny Li
Jan 19,2016
755
Bond Lift-off
A failure condition in which a lead is separated from its bonding surface.
Shiny Li
Jan 19,2016
656
Bond Interface
The common area between a lead and a land to which it has been terminated.
Shiny Li
Jan 19,2016
802
Body
The portion of an electronic component exclusive of its pins or leads.
Shiny Li
Jan 19,2016
750
Board Thickness
The overall thickness of the base material and all conductive materials deposited thereon.
Shiny Li
Jan 19,2016
721
Board Density
A measure of the ratio of the area of the board used by parts to the total available area of the&nbs...
Shiny Li
Jan 19,2016
937
Blutter Coat
An external layer of resin over the reinforcing structure of base material.
Shiny Li
Jan 19,2016
873
Bluetooth
Bluetooth is a short-range (up to 10m) 2.4GHz wireless connectivity standard intended for such applications as wireless&...
Shiny Li
Jan 19,2016
738
Blow Hole
A void in the solder fillet caused by outgassing from the barrel of a plated through hole.(see also outgassing...
Shiny Li
Jan 19,2016
1336
Blistering
A localized swelling and separation between any of the layers of a laminated base material, or between base ma...
Shiny Li
Jan 19,2016
846
Blister
De-lamination in the form of a localized swelling and separation between any of the Layers of a lamination bas...
Shiny Li
Jan 19,2016
974
Blind Via
A via that reaches only one layer beneath the outer layer on one side of a muti-layer board.
Shiny Li
Jan 19,2016
930
Bleeding
A condition in which liquid solder resist or rotation spreads larger than the defined apperture.
Shiny Li
Jan 19,2016
1051
Biscuit Frame
An array of circuits on a larger “mother” panel.
Shiny Li
Jan 19,2016
748
BGA
Ball Grid Array. Leadless array packaging technology in which solder balls are mounted to the underside of the ...
Shiny Li
Jan 19,2016
731
Bellows Contact
A connector contact which is a flat sprint folded to provide a uniform spring rate over the full tolerance ran...
Shiny Li
Jan 19,2016
968
Bed-of-Nails
A method of PCB testing involving a fixture containing a field of spring-loaded pins that are co-ordinated with&nbs...
Shiny Li
Jan 19,2016
802
Basic Wettability
The ease with which a metal or metal alloy can be wetted by molten solder.
Shiny Li
Jan 19,2016
651
Base Solderability
The ease with which a metal or metal alloy surface can be wetted by molten solder under minimum realistic ...
Shiny Li
Jan 19,2016
861
Base Material
The insulating material (either rigid or flexible ) as well as the copper foils bonded on one or both sid...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 11 |
| 2 | Jonathan Scher | 3 |
| 3 | Paul Hupman | 2 |
| 4 | Samarth Jiwarajka | 1 |
| 5 | Engineer | 1 |
| 6 | Ibrahim TKR | 1 |
