Shiny Li
Jan 20,2016
616
Epoxy Resins
Materials that form straight chain thermoplastic and thermosetting resins having good mechanical properties and dimensional s...
Shiny Li
Jan 20,2016
673
Entrapment
The damaging admission and trapping of air, flux and fumes; it is caused by contamination and plating.
Shiny Li
Jan 20,2016
650
Emulsion Side
The side of the film on which the photographic image is defined.
Shiny Li
Jan 20,2016
662
Embedded Component
A discrete component that is fabricated as an integral part of a printed board.
Shiny Li
Jan 20,2016
689
Electroplating
The electrodeposition of a metal coating on a conductive object. The object to be plated is placed in an ...
Shiny Li
Jan 20,2016
764
Electron-beam Bonding
Terminations made by heating with a stream of electrons in a vacuum.
Shiny Li
Jan 20,2016
617
Electroless Deposition
The deposition of conductive material from an auto-catalytic plating solution without application of electrical current.
Shiny Li
Jan 20,2016
838
Electroless Copper
A layer of copper plated on to an insulating or conductive surface of a PCB by chemical reduction, that&...
Shiny Li
Jan 20,2016
1066
Edge-board Contacts
A series of contacts printed on or near any edge of a printed board and intended for mating with an ...
Shiny Li
Jan 20,2016
774
Edge Spacing
The distance of a pattern, components, or both, from the edges of the printed board and intended for mating&nb...
Shiny Li
Jan 20,2016
1354
Edge Connector
A connector (can be gold-plated edge contacts or a series of parallel lines of holes).
Shiny Li
Jan 20,2016
1233
Edge Clearance
The distance of a pattern, components, or both, from the edges of the printed circuit board.
Shiny Li
Jan 20,2016
720
Durometer
A measurement of the hardness of a non-metal such as rubber, plastic, etc. Also the instrument for such measur...
Shiny Li
Jan 20,2016
683
Dummy Component
A mechanical package without the die, used to verify placement processes.
Shiny Li
Jan 20,2016
784
Dual Solder Wave
In wave soldering, the first wave’s multi-directional jet leaves solder on all contacted surfaces, followed by the ...
Shiny Li
Jan 20,2016
642
Drying Time
Within the re-flow process after pre-heat and before peak re-flow temperature wherein volatile materials escape from the...
Shiny Li
Jan 20,2016
947
Dry Film Resists
Coating material in the form of laminated photo-sensitive foils specifically designed for use in the manufacture of ...
Shiny Li
Jan 20,2016
973
Dross
Oxide and other contaminates which form on the surface of molten solder.
Shiny Li
Jan 20,2016
735
Drills
Solid, carbide cutting tools designed specifically for the fast removal of material in extremely abrasive, glass-epoxy m...
Shiny Li
Jan 20,2016
1371
DRC
Design Rule Check: Checks the integrity of print (PCB) so that problems like short-circuits, unrouted nets, etc. ar...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |
