Haloing Mechanically
Induced fracturing or de-lamination on or below the surface of the base material, it is usually exhibited by a light area around holes, other machined areas, or both.
Halides
Compounds containing fluorine, chlorine, bromine or iodine, which may be part of the activators in the flux system and must be cleaned.
Gull Wing Lead
A surface mounted device lead which flares outward from the device body.
Guided Probe Method
A technique for volume production of PCBs based on incoming inspection to catch the majority of device failures and inspection prior to populating, that will eliminate most manufacturing errors. ...
Ground Plane Clearance
Removed portions of a ground plane that serves to isolate it form a hole in the base material to which the plane is attached
Ground Plane
A conductor layer, or portion of a conductor layer, used as a common reference point for circuit returns, shielding, or heat sinking. All those areas, not consumed by traces or pads, of the PCB which ...
Grid
An orthogonal network of two sets of parallel, equidistant lines used for locating points on a printed circuit board.
Glob Top
A coating process in which a set portion of resin is dispensed on the top of a chip or board. After spreading over the entire surface ,it is cured to form a soild protective coating.
Class Transition Temperature
TG-value, temperature at which resin ceases to act as a solid, Till this temperature, no separation will take place between resin/copper/reinforcement.
Glass Epoxy
A material used to fabricate printed circuit boards. The base material (fibre-glass) is impregnated with an epoxy filler which then must have copper laminated to its outer surface to form the material...
Gerber
Vector-based language, developed by Gerber Scientific Instrument Company, for sending commands to photoplotters.
Fused Coating
A metallic coating, usually tin or solder alluvia, which has been melted and solidified forming a metallurgical bond to the base material.
Functional Test
To check an assembly using equipment that tests for the functions intended and engaging inputs and outputs.
Fully-Additive Process
An additive process wherein the entire thickness of electrically isolated conductors is built-up by copper.
FR4
Flame retardent laminate made from woven glass fibre material impregnated with epoxy resin.
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |