Shiny Li
Jan 19,2016
793
Blister
De-lamination in the form of a localized swelling and separation between any of the Layers of a lamination bas...
Shiny Li
Jan 19,2016
888
Blind Via
A via that reaches only one layer beneath the outer layer on one side of a muti-layer board.
Shiny Li
Jan 19,2016
860
Bleeding
A condition in which liquid solder resist or rotation spreads larger than the defined apperture.
Shiny Li
Jan 19,2016
984
Biscuit Frame
An array of circuits on a larger “mother” panel.
Shiny Li
Jan 19,2016
704
BGA
Ball Grid Array. Leadless array packaging technology in which solder balls are mounted to the underside of the ...
Shiny Li
Jan 19,2016
688
Bellows Contact
A connector contact which is a flat sprint folded to provide a uniform spring rate over the full tolerance ran...
Shiny Li
Jan 19,2016
894
Bed-of-Nails
A method of PCB testing involving a fixture containing a field of spring-loaded pins that are co-ordinated with&nbs...
Shiny Li
Jan 19,2016
749
Basic Wettability
The ease with which a metal or metal alloy can be wetted by molten solder.
Shiny Li
Jan 19,2016
603
Base Solderability
The ease with which a metal or metal alloy surface can be wetted by molten solder under minimum realistic ...
Shiny Li
Jan 19,2016
803
Base Material
The insulating material (either rigid or flexible ) as well as the copper foils bonded on one or both sid...
Shiny Li
Jan 19,2016
650
Base Material Thickness
The thickness of the base material, excluding metal foil or material deposited on the surface.
Shiny Li
Jan 19,2016
583
Base Laminate
The substrate material upon which the conductive wiring pattern may be formed.
Shiny Li
Jan 19,2016
727
Base Copper
The original, thin copper foil present on one or both sides of a copper clad laminate. During PCB manufacture,...
Shiny Li
Jan 19,2016
1034
Barrel
The cylinder formed by plating through a drilled hole.
Shiny Li
Jan 19,2016
757
Bare Board
A PCB having all lines, pads and layers intact but without components installed. An unassembled PCB.
Shiny Li
Jan 19,2016
615
Backdriving
An in-circuit test procedure for digital circuitry.
Shiny Li
Jan 19,2016
950
B-stage Material
Laminate impregnated with a resin and cured to an intermediate stage (B-stage resin ). Normally designated as prepr...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 11 |
| 2 | KhronoSound Audio | 2 |
| 3 | john James | 1 |
| 4 | Engineer | 1 |
| 5 | LouD _ | 1 |
