Shiny Li
Jan 19,2016
832
Bridging
A condition where excess solder builds up in the air gap between conductors and causes them to short together....
Shiny Li
Jan 19,2016
632
Bridged Joint
Solder that spans across two or more conductors causing an electrical short-circuit.
Shiny Li
Jan 19,2016
759
Breakdown Voltage
The voltage at which an insulator or dielectric ruptures or at which ionization and conduction take place in a...
Shiny Li
Jan 19,2016
574
Brazing Alloy
A metal alloy (solder) which melts above 450℃ but below metals being joined.
Shiny Li
Jan 19,2016
643
Branched Conductor
A conductor which connects electrically two or more leads on a printed board assembly. Some branched conductors, no...
Shiny Li
Jan 19,2016
642
Bow
The deviation from the flatness of a board characterized by a roughly cylindrical or spherical curvature. If the&nb...
Shiny Li
Jan 19,2016
742
Boundary Scan
A self-test designed into components at the silicon level, permitting testing via a built-in, four-or-five-pin test bus&...
Shiny Li
Jan 19,2016
592
Border Data
Patterns that appear in the border area, such as tooling features, test patterns and registration marks.
Shiny Li
Jan 19,2016
644
Bonding Time
The duration from hot-bar-heat-up (contact with lead and pad ) until the solder joint is completed.
Shiny Li
Jan 19,2016
1352
Bonding Layer
An adhesive layer used in bonding together other discrete layers of multi-layer printed board during lamination.
Shiny Li
Jan 19,2016
679
Bond Strength:
The force perpendicular to a board’s surface required to separate two adjacent layers of the board, expressed as&nb...
Shiny Li
Jan 19,2016
709
Bond Lift-off
A failure condition in which a lead is separated from its bonding surface.
Shiny Li
Jan 19,2016
606
Bond Interface
The common area between a lead and a land to which it has been terminated.
Shiny Li
Jan 19,2016
752
Body
The portion of an electronic component exclusive of its pins or leads.
Shiny Li
Jan 19,2016
713
Board Thickness
The overall thickness of the base material and all conductive materials deposited thereon.
Shiny Li
Jan 19,2016
669
Board Density
A measure of the ratio of the area of the board used by parts to the total available area of the&nbs...
Shiny Li
Jan 19,2016
900
Blutter Coat
An external layer of resin over the reinforcing structure of base material.
Shiny Li
Jan 19,2016
816
Bluetooth
Bluetooth is a short-range (up to 10m) 2.4GHz wireless connectivity standard intended for such applications as wireless&...
Shiny Li
Jan 19,2016
686
Blow Hole
A void in the solder fillet caused by outgassing from the barrel of a plated through hole.(see also outgassing...
Shiny Li
Jan 19,2016
1287
Blistering
A localized swelling and separation between any of the layers of a laminated base material, or between base ma...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 11 |
| 2 | KhronoSound Audio | 2 |
| 3 | john James | 1 |
| 4 | Engineer | 1 |
| 5 | LouD _ | 1 |
