Shiny Li
Jan 28,2016
638
INDEX EDGE
INDEX EDGE MARKER, INDEXING HOLE, INDEXING NOTCH, INDEXING SLOT: See Locating Edge, Location Edge Marker,etc.
Shiny Li
Jan 28,2016
1204
Inclusion
A foreign particle in the conductive layer, plating, or base material.
Shiny Li
Jan 28,2016
699
In-circuit Test
A check of specific components(s) or cuicuits(s) within an assembly without their de-coupling from the primary circuit.
Shiny Li
Jan 28,2016
881
Impedance, Characteristic
The resistance of a parallel conductor structure to the flow of alternating current (ac), usually applied to high-speed circuits and normally consisting of a constant value over a wide range of freque...
Shiny Li
Jan 28,2016
710
Immersion Plating
The chemical deposition of a thin metallic coating over certain basis metals that is achieved by a partial displacement of the basis metal.
Shiny Li
Jan 28,2016
728
Hygroscopic
The ability of a material to absorb and retain moisture from the air.
Shiny Li
Jan 28,2016
833
Hot Zone
The section of a re-flow oven held at maximum temperature. Other zones include per-heat and cooling.
Shiny Li
Jan 28,2016
700
Hole Void
A void in the metallic deposit of a plated through-hole exposing the base material.
Shiny Li
Jan 28,2016
876
Hole Pull Strength
The force necessary to rupture a plated through-hole when loaded or pulled in the direction of the axis of the hole.
Shiny Li
Jan 28,2016
925
Hole Location
The dimensional location of the centre of a hole.
Shiny Li
Jan 28,2016
843
Hole Density
The quantity of holes in a printed circuit board per unit area.
Shiny Li
Jan 28,2016
1041
Hole Breakout
A condition in which a hole is not completely surrounded by the land.
Shiny Li
Jan 28,2016
767
Hipot Test
Wherein the assembly or component undergoes a high potential (ac) current.
Shiny Li
Jan 28,2016
489
Heel，Bonding
The part of a lead adjacent to a termination that has been deformed by the edge of the bonding tool.
Shiny Li
Jan 28,2016
707
Heat Sink
Any device that absorbs and draws off heat from a hot object, radiating it into the surrounding atmosphere.
Shiny Li
Jan 28,2016
699
Heat and Pull
A de-soldering method using a device that grasps, heats and pulls the leads to be removed.
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |
