Shiny Li
Jan 28,2016
859
Micro-sectioning
A destructive test procedure in which a section of specimen it cut and removed for close examination.
Shiny Li
Jan 28,2016
908
Metallization
A deposited or plated thin metallic film used for its protective or electrical properties.
Shiny Li
Jan 28,2016
837
Metal Clad Base Material
Base material covered with metal on one or both of its sides.
Shiny Li
Jan 28,2016
1994
Meniscus
The contour or shape of molten solder as formed by surface tension forces in turn controlled by wetting.
Shiny Li
Jan 28,2016
734
Melting Range
The temperature range over which the solder alloy melts .An alloy with a single melting point, rather than a melting range, is known as a eutectic alloy .
Shiny Li
Jan 28,2016
1018
MELF
A metal electrode leadless face surface mount component that is round with metallic cap terminations.
Shiny Li
Jan 28,2016
1219
Measling
A condition existing in the base laminate in the form of discrete white sports or crosses below the surface of the base laminate, reflecting a separation of fibres in the glass cloth at the weave inte...
Shiny Li
Jan 28,2016
1136
Mean Time between Failure (MTBF)
The statistical mean average time interval, usually in hours, that may be expected between failures of an operating unit. Results should be designated actual. Predicted or calculated.
Shiny Li
Jan 28,2016
892
MCR
Moulded Carrier Ring. A tape of fine-pitch chip package named for the method of supporting and protecting the leads. The leads are left straight; the ends of the leads are embedded in a strip of plast...
Shiny Li
Jan 28,2016
869
Maximum, Plated Through-hole Size
A hole size equal to the specified hole size before plating, plus the manufacturing tolerance, less twice the minimum plating thickness.
Shiny Li
Jan 28,2016
982
Master Pattern
An accurately scaled pattern which is used to produce the printed circuit within the accuracy specified on the master drawing.
Shiny Li
Jan 28,2016
1126
Master Drawing
A document that shows the dimensional limits or grid locations applicable to any or all parts of a printed board(rigid or flexible),including the arrangement of conductive and non-conductive patterns ...
Shiny Li
Jan 28,2016
669
Master Artwork
A document showing dimensional limits and grid locations for all parts of an assembly to be fabricated. It includes the arrangement of conductors and non-conductive patterns and the size, t...
Shiny Li
Jan 28,2016
752
Mass Soldering
Methods of soldering in which many joints are made in the same operation.
Shiny Li
Jan 28,2016
666
Mask
A material applied to enable selective etching, plating or the application of solder to a printed circuit board.
Shiny Li
Jan 28,2016
1124
Margin
The distance between the reference edge of a flat cable and the nearest edge of the first conductor.(See also Edge Spacing)
Shiny Li
Jan 28,2016
1657
MAR(Minimum Annular Ring)
The minimum metal width, at the narrowest point between the circumference of the hole and the outer circumference of the land. This measurement is made to the drilled hole on internal layers of multi-...
Shiny Li
Jan 28,2016
1061
Manhattan Distance
The orthogonal distance between two points.
Shiny Li
Jan 28,2016
691
Major Defect
A defect that could result in failure or significantly reduce the usability of the part for its intended purpose.
Shiny Li
Jan 28,2016
883
Logic diagram
A drawing that depicts the multi-state device implementation of logic functions with logic symbols and supplementary notations, showing details of signal flow and control, but not necessarily the poin...
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |
