Shiny Li
Jan 28,2016
1054
Panel Plating
The plating of the entire surface of a panel (including holes).
Shiny Li
Jan 28,2016
1121
Panel
The base material containing one or more circuit patterns that passes successively through the production sequence and from which printed circuit boards are extracted. See Backplanes/Backpanels.
Shiny Li
Jan 28,2016
954
Pad
A portion of the conductive area of which components, terminals, traces, etc., are mechanically attached. (Also called land).
Shiny Li
Jan 28,2016
1428
Packaging Density
Quantity of functions (components, interconnection devices, mechanical devices) per unit volume, usually expressed in qualitative terms, such as high, medium, or low.
Shiny Li
Jan 28,2016
2178
Overhang
Increase in printed circuit conductor width caused by plating build-up or by undercutting during etching.
Shiny Li
Jan 28,2016
1270
Outgrowth
The increase in conductor width at one side of a conductor, caused by plating build-up, over that delineated on the production master.
Shiny Li
Jan 28,2016
1178
Outgassing
The gaseous emission from a laminate printed board or component when the board or the printed board assembly is exposed to heat or reduced air pressure or both.
Shiny Li
Jan 28,2016
1136
Organic Activated (OA)
A water-soluble flux using organic acids as activators.
Shiny Li
Jan 28,2016
1270
Open
An area of a bare PCB which, due to over-etching or fabrication problems, separates two electrically connected points.
Shiny Li
Jan 28,2016
1302
Omegameter
A test instrument measuring ionic residues on PCBs via the drop of resistivity over a specific time.
Shiny Li
Jan 28,2016
1244
Non-wetting
A condition whereby a surface has contacted molten solder, but has had none of the solder adhere to it.
Shiny Li
Jan 28,2016
1256
Non-polar Compound
Material having electrical charges distributed over the surface of the molecule, thereby showing an electrical effect in solution.
Shiny Li
Jan 28,2016
2183
Non-functional Land
A land on internal or external layers, not connected to the conductive pattern on its layer.
Shiny Li
Jan 28,2016
1244
Non-conductive Pattern
A configuration formed by functional non-conductive material of a printed circuit.
Shiny Li
Jan 28,2016
1429
Non-conductive Epoxy
An epoxy resin with or without a filler, which may be added to improve thermal conductivity.
Shiny Li
Jan 28,2016
1249
Non-clean solder
A process using specially formulated low-solid solder pastes whose residues require no cleaning.
Shiny Li
Jan 28,2016
1326
Node
A pin, lead or even junction which will have at least one wire connected to it.
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |
