Shiny Li
Jan 28,2016
2714
Virtual Prototype
A virtual (computer model) representation of an electronic product that can be used to explore different design scenarios and then verify that the product will work as planned before building a physic...
Shiny Li
Jan 28,2016
2544
Via
A plated through-hole used as an interlayer connection and not as a terminating point for a component lead. It may also be blind (incomplete penetration) or buried (non-surfacing).
Shiny Li
Jan 28,2016
2508
Via Hole
A plated through-hole whose only purpose is to connect a track on one layer or side of the board through to a track on another layer or side. In a via, there is no intention to insert a component lead...
Shiny Li
Jan 28,2016
2491
Vapour Phase
The solder re-flow process that uses a vaporized solvent as the source for heating the solder beyond its melting point,creating the component-to-board solder joint.
Shiny Li
Jan 28,2016
2264
Vacuum Pick-up
A component handling tool with a small vacuum cup for ease of pick-up and removal during de-soldering.
Shiny Li
Jan 28,2016
2369
Unsupported Hold
A hole containing no conductive material nor any other type of reinforcement.
Shiny Li
Jan 28,2016
935
Underwriters’ Symbol
A logotype authorized for placement on a product which has been recognized (accepted) by Underwriters Laboratories, Inc. (UL).
Shiny Li
Jan 28,2016
2721
Undercut
A groove or excavation at one edge of a conductor caused by etching.
Shiny Li
Jan 28,2016
2217
Ultrasonic Soldering
Fluxless soldering wherein molten solder is vibrated at ultrasonic frequencies while making the joint.
Shiny Li
Jan 28,2016
1862
UL
Underwriter’s Laboratories, Inc., a corporation for the purpose of establishing safety standards on types of equipment or components in USA and Canada.
Shiny Li
Jan 28,2016
1812
Twist
The deformation of a rectangular sheet, panel or printed board, that occurs parallel to a diagonal across its surface in such a way that one of the comers of the sheet is not in the plane formed by th...
Shiny Li
Jan 28,2016
1724
Trim Lines
Lines which define the borders of a printed board.
Shiny Li
Jan 28,2016
1870
Triazine
Dielectric material with higher glass transition temperature and better thermal stability than epoxy resin, however, more expensive and not in common use.
Shiny Li
Jan 28,2016
2052
Transmission Line
A signal-carrying circuit composed of conductors and dielectric material with controlled electrical characteristics used for the transmission of high-frequency or narrow-pulse type signals.
Shiny Li
Jan 28,2016
1790
Traces
The metallic conductive strips that provide connections between components, terminals, etc., on printed circuits.
Shiny Li
Jan 28,2016
1889
Tombstoning
A soldering defect in which a chip component moves into a vertical position during solidification of the solder so that only one terminal is connected. It is caused by defective re-flow processing.
Shiny Li
Jan 28,2016
2212
Tolling Hole
Also called fabrication hole, pilot hole, or manufacturing hole. These are used as PCB reference points upon which other dimensions are based.
Shiny Li
Jan 28,2016
1792
Tinning
The application of molten solder to a basis metal in order to increase its solderability.
| Ranking | Name | Answers |
|---|---|---|
| 1 | PCBWay Team | 4 |
| 2 | Engineer | 1 |
| 3 | Ibrahim TKR | 1 |
| 4 | Engineer | 1 |
| 5 | Adilson Pierog | 1 |
| 6 | Lucas Laupichler | 1 |
