If solderability is in doubt, a simple test is to stencil solder paste on a bare board and then reflow it without components. If the joints look good, but there is still doubt, have a testing lab do an If solderability is in doubt, a pcb board simple test is to stencil solder paste on a bare board and then reflow it without components. If the joints look good, but there is still doubt, have a testing lab do an pcb board X-ray to determine copper content of the solder or other potential causes of poor solderability. If the pads pcb board exhibit proper adhesion, then check the electronic components themselves. The following tests measure solderability of both component leads.
The pcb board dip and look test is similar in its ease and simplicity to the pad test. It requires a few pieces of equipment and some work space, but can be done quickly without interrupting production. If you have established that solderability of the pads is good, take a board that has been through the screen pcb board printer, but has no pcb board components on it, to use for this test. Heat the board on a hot plate, or by whatever means are available that can be controlled. pcb board With a thermocouple attached to one of the leads, use a tweezer to place the surface mount component on its pad. pcb board Some kapton tape placed over the pcb board component to hold it in place helps secure the part. Heat the assembly through the thermal cycle (See Section 3 – Reflow Profiling) appropriate for the solder paste, using the thermocouple as a guide. Let the assembly cool, remove flux residue if necessary pcb board, and then inspect the lead for wetting.
