General circuit and system design with dual-panel design to meet the needs of four-layer board , but in the more advanced circuit design, or have special needs, such as against high frequency interference requirements under circumstances the use of more than six and six MLB . When making a layer of a multilayer lamination , it is more layers , regardless of design or manufacturing process is more complicated , the design time and cost will be greatly increased.
If you add another layer between the PCB top and bottom of the board shall constitute a multilayer, such as placing two layers multilayer power board .
Multilayer Mid-Layer ( intermediate layer) and the Internal Plane ( inner layer ) is not the same for both concepts , the intermediate layer is an intermediate layer for the wiring board , the conductor layer is uniform , with the inner layer at the power supply layer or the ground layer is made from a copper film constituting the chunk , the structure shown in FIG .
Multilayer total of six in the drawing layer design , the top of Top Layer ( top ) ; lowermost of Bottom Layer ( bottom ) ; intermediate 4 has two inner layers , i.e. InternalPlane1 and InternalPlane2, for the power supply layer ; two intermediate layers , and the MidLayerl MidLayer2, for wire cloth.
