Description

NextPM_IoT_Node_v2_PROD_CANDIDATE-

1. As shown in the attached pic, your IC pad spacing is too small (just shows one example), and the blue solder mask sliver can’t be made (0.19mm is ok), which might cause poor soldering during assembly.

I chosed to modify the project in other words :

B. You revise the design to ensure the 0.19 mm IC pad spacing so we can keep the solder mask sliver.

2. As shown in the attached pic, there are vias designed within the pads.To prevent the risk of short circuits during the soldering process, we recommend filling these vias with non-conductive resin and capping them.If you accept vias filled with resin, shall we fill all vias or vias in pads only?

I have removed all vias under pads, so I think the issue is solved

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Oct 12,2026

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NextPM_IoT_Node_v2_PROD_CANDIDATE-

4 Layers PCB 54.3 x 53 mm FR-4, 1.6 mm, 1, HASL lead free, Blue Solder Mask, White silkscreen

Published: Oct 12,2026

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